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J. S. Jeong, Y. S. Lee, K. H. Shin, S. K. Cheong, D. Y. Jang, "A Study on the Failure Characteristics of Sn-xAg-0.5Cu Lead-Free Solder Balls", Journal of the Korean Society of Machine Tool Engineers, 18(5), 449 (2009).
과학기술학회마을
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JEDEC Standard JESD22-B111, Board Level Drop test Method of Components for Handheld Electronic Products
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RS D 0015, 무연 솔더볼, 산업자원부 기술표준원, (2003).
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4 |
JEDEC Solid State Technology Association, JESD22B-117A Solder ball shear (2000).
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5 |
I. N. Jang, J. H. Park and Y. S. Ahn, "Standardization of Bending Fatigue Impact test Method of Sn-Ag-Cu Lead-Free Solder Ball", J. Microelectronics Packag. Soc., 17(1) 55 (2010).
과학기술학회마을
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I. N. Jang, J. H. Park and Y. S. Ahn, "Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-Free Solder Bump", J. Microelectronics Packag. Soc., 16(3), 11 (2009).
과학기술학회마을
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C. H. Yu and K. S. Kim, "Thermal Cycling Analysis of Flip-Chip BGA Solder Joints", J. Microelectronics Packag. Soc., 10(1), 45 (2003).
과학기술학회마을
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W. H. Zhu, L. X Pang, J. H. L. Zhang, X. R. Poh, E. Sun, Y. F. Sun, A. Y. S. Wang and C. K. Tan "Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.1667-1672 (2008).
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