Browse > Article

Mechanical Characteristic Evaluation of Sn-Ag-Cu Lead Free Solder Ball Joint on The Pad Geometry  

Jang, Im-Nam (Dept. of Materials Sci. & Eng, Pukyong National University)
Park, Jai-Hyun (Research Institute of Industrial Science & Technology)
Ahn, Yong-Sik (Dept. of Materials Sci. & Eng, Pukyong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.2, 2010 , pp. 41-47 More about this Journal
Abstract
The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.
Keywords
Pad design; Mechanical property; Sn-Ag-Cu solder joint;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
연도 인용수 순위
1 J. S. Jeong, Y. S. Lee, K. H. Shin, S. K. Cheong, D. Y. Jang, "A Study on the Failure Characteristics of Sn-xAg-0.5Cu Lead-Free Solder Balls", Journal of the Korean Society of Machine Tool Engineers, 18(5), 449 (2009).   과학기술학회마을
2 JEDEC Standard JESD22-B111, Board Level Drop test Method of Components for Handheld Electronic Products
3 RS D 0015, 무연 솔더볼, 산업자원부 기술표준원, (2003).
4 JEDEC Solid State Technology Association, JESD22B-117A Solder ball shear (2000).
5 I. N. Jang, J. H. Park and Y. S. Ahn, "Standardization of Bending Fatigue Impact test Method of Sn-Ag-Cu Lead-Free Solder Ball", J. Microelectronics Packag. Soc., 17(1) 55 (2010).   과학기술학회마을
6 I. N. Jang, J. H. Park and Y. S. Ahn, "Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-Free Solder Bump", J. Microelectronics Packag. Soc., 16(3), 11 (2009).   과학기술학회마을
7 C. H. Yu and K. S. Kim, "Thermal Cycling Analysis of Flip-Chip BGA Solder Joints", J. Microelectronics Packag. Soc., 10(1), 45 (2003).   과학기술학회마을
8 W. H. Zhu, L. X Pang, J. H. L. Zhang, X. R. Poh, E. Sun, Y. F. Sun, A. Y. S. Wang and C. K. Tan "Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.1667-1672 (2008).