Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 4 Serial No. 37
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- Pages.289-299
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Evaluation and Test Method Characterization for Mechanical and Electrical Properties in BGA Package
BGA 패키지의 기계적${\cdot}$ 전기적 특성 평가 및 평가법
- Koo Ja-Myeong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Kim Jong-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Kim Dae-Gon (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Yoon Jeong-Won (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
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Lee Chang-Yong
(School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
-
Jung Seung-Boo
(School of Advanced Materials Science and Engineering, Sungkyunkwan University)
- 구자명 (성균관대학교 신소재공학부) ;
- 김종웅 (성균관대학교 신소재공학부) ;
- 김대곤 (성균관대학교 신소재공학부) ;
- 윤정원 (성균관대학교 신소재공학부) ;
-
이창용
(성균관대학교 신소재공학부) ;
-
정승부
(성균관대학교 신소재공학부)
- Published : 2005.12.01
Abstract
The ball shear force was investigated in terms of test parameters, i.e. displacement rate and probe height, with an experimental and non-linear finite element analysis for evaluation of the solder joint integrity in area array packages. The increase in the displacement rate and the decrease in the probe height led to the increase in the shear force. Excessive probe height could cause some detrimental effects on the test results such as unexpected high standard deviation and probe sliding from the solder ball surface. The low shear height conditions were favorable for assessing the mechanical integrity of the solder joints. The mechanical and electrical properties of the Sn-37Pb/Cu and Sn-3.5Ag/Cu BGA solder joints were also investigated with the number of reflows. The total thickness of the intermetallic compound (IMC) layers, consisting of Cu6Sn5 and Cu3Sn, was increased as a function of cubic root of reflow time. The shear force was increased up to 3 or 4 reflows, and then was decreased with the number of reflows. The fracture occurred along the bulk solder, in irrespective of the number of reflows. The electrical resistivity was increased with increasing the number of reflows.
실험과 비선형 유한요소해석을 병행하여, area array 패키지에서 솔더 접합부 특성을 판별하기 위한 전단시험 결과에 미치는 전단속도와 높이의 영향을 연구하였다. 전단속도의 증가와 전단높이의 감소에 따라 전단강도는 증가하는 경향을 나타내었다. 과대하게 높은 전단높이는 비정상적으로 높은 표준편차 또는 솔더볼 표면으로부터 전단 프로브의 밀림 현상과 같은 실험오차를 발생시켰다. 반면, 낮은 전단 속도는 취약한 계면 파괴나 계면에서 가장 약한 층의 판별에 있어서 유용하였다. 한편, 리플로우 회수 증가에 따른 Sn-37Pb/Cu와 Sn-3.5Ag/Cu BGA 솔더 접합부의 기계적
Keywords
- BGA (ball grid array);
- tin-silver (Sn-Ag) solder;
- shear test;
- finite element analysis;
- electrical resistivity