Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints |
Kim, Sung-Hyuk
(School of Materials Science and Engineering, Andong National University)
Park, Gyu-Tae (School of Materials Science and Engineering, Andong National University) Lee, Byeong-Rok (School of Materials Science and Engineering, Andong National University) Kim, Jae-Myeong (STATS ChipPAC Korea Ltd.) Yoo, Sehoon (Korea Institute of Industrial Technology, Advanced Welding and Joining R&BD Group) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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