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Effect of MeOH/IPA Ratio on Coating and Fluxing of Organic Solderability Preservatives  

Lee, Jae-Won (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Kim, Chang Hyeon (Daedeok Research Institute, Honam Petrochemical Co.)
Lee, Hyo Soo (Nano Material Team, Advanced Material Center, Korea Institute of Industrial Technology)
Huh, Kang Moo (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Lee, Chang Soo (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Choi, Ho Suk (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Publication Information
Korean Chemical Engineering Research / v.46, no.2, 2008 , pp. 402-407 More about this Journal
Abstract
Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.
Keywords
Organic Solderability Preservatives; Fluxing; Thermal Stability; Solubility;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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