• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.3-6
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• 2015

Recently, the collection of the sensor data and its analysis become important as the smart buildings equipped with the various sensors appear as a usual scene. The interconnection through the wire cable among the sensors is indispensible because of the information collections such as the temperature, the humidity, and the luminance in the rooms and the hallways for the effective management of the in-building energies. However, these interconnections through the cabling will be very costly, time-consuming, and a difficult task since they will cause some damages to the buildings. Therefore, the interconnections through the unwired connections are required in terms of the deployment effectiveness such as time and cost In this paper, the design and the operation appropriateness are confirmed through the simulation of the signal measurement system for in-building propagation characteristics based on signature sequence and the analysis of the collected measurement data is performed thereafter.

• Proceedings of the Korean Environmental Sciences Society Conference
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• 2003.11a
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• pp.73-78
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• 2003

In this research, we implement Realtime Air Diffusion Prediction System which is a parallel Fortran model running on distributed-memory parallel computers. The system is designed for air diffusion simulations with four-dimensional data assimilation. For regional air quality forecasting a series of dynamic downscaling technique is adopted using the NCAR/Penn. State MM5 model which is an atmospheric model. The realtime initial data have been provided daily from the KMA (Korean Meteorological Administration) global spectral model output. It takes huge resources of computation to get 24 hour air quality forecast with this four step dynamic downscaling (27km, 9km, 3km, and lkm). Parallel implementation of the realtime system is imperative to achieve increased throughput since the realtime system have to be performed which correct timing behavior and the sequential code requires a large amount of CPU time for typical simulations. The parallel system uses MPI (Message Passing Interface), a standard library to support high-level routines for message passing. We validate the parallel model by comparing it with the sequential model. For realtime running, we implement a cluster computer which is a distributed-memory parallel computer that links high-performance PCs with high-speed interconnection networks. We use 32 2-CPU nodes and a Myrinet network for the cluster. Since cluster computers more cost effective than conventional distributed parallel computers, we can build a dedicated realtime computer. The system also includes web based Gill (Graphic User Interface) for convenient system management and performance monitoring so that end-users can restart the system easily when the system faults. Performance of the parallel model is analyzed by comparing its execution time with the sequential model, and by calculating communication overhead and load imbalance, which are common problems in parallel processing. Performance analysis is carried out on our cluster which has 32 2-CPU nodes.

• Korean Journal of Materials Research
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• v.27 no.3
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• pp.149-154
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• 2017

Transparent conducting oxides (TCOs) were fabricated using solution-based ITO (Sn-doped $In_2O_3$) nanoinks with nanorods at an annealing temperature of $200^{\circ}C$. In order to optimize their transparent conducting performance, ITO nanoinks were composed of ITO nanoparticles alone and the weight ratios of the nanorods to nanoparticles in the ITO nanoinks were adjusted to 0.1, 0.2, and 0.5. As a result, compared to the other TCOs, the ITO TCOs formed by the ITO nanoinks with weight ratio of 0.1 were found to exhibit outstanding transparent conducting performance in terms of sheet resistance (${\sim}102.3{\Omega}/square$) and optical transmittance (~80.2 %) at 550 nm; these excellent properties are due to the enhanced Hall mobility induced by the interconnection of the composite nanorods with the (440) planes of the short lattice distance in the TCOs, in which the presence of the nanorods can serve as a conducting pathway for electrons. Therefore, this resulting material can be proposed as a potential candidate for solution-based TCOs for use in optoelectronic devices requiring large-scale and low-cost processes.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• The Transactions of the Korea Information Processing Society
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• v.5 no.12
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• pp.3088-3098
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• 1998

The arrangement graph, which is a viable interconnection scheme for parallel and distributed systems, has been proposed as an attactive altemative to the n-cube. However, A fault tolerant design model which is well suitable for the arrangement graph doesn't has been proposd until recently, but fault tolerant design modelsfor many schemes have been proposed ina large number of paper. So, our paper presents a new fault tolerant design technique suited for the arrangement graph. To maintains the previous structures when it ocurs a fault in the current processing, the scheme properly sugbstitutes a fault-componnent into the existing structures by adding a spare component. the first of all, it converts arrangement graph into a circulant graph using the hamiltonian property and then uses automorphism of circulant graph to tolerate faults. Also, We optimize the cost of rate fault tolerant architectures by adding exactly k spare processor while tolerating up to k processor and minimizing the maximum number of limks per processor. Specially, we proposes a new techniue to minimize the maximum number of links.

• The KIPS Transactions:PartA
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• v.16A no.4
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• pp.299-306
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• 2009

Hierarchical Folded HyperStar Network has lower network cost than HCN(n,n) and HFN(n,n) which are hierarchical networks with the same number of nodes. In this paper, we analyze embedding between Hierarchical Folded HyperStar HFH($C_n,C_n$) and Hypercube, HCN(n,n), HFN(n,n). The results of embedding are that HCN(n,n), HFN(n,n) and Hypercube $Q_{2n}$ can be embedded into HFH($C_n,C_n$) with expansion $\frac{C^n}{2^{2n}}$ and dilation 2, 3, and 4, respectively. Also, HFH($C_n,C_n$) can be embedded into HFN(2n,2n) with dilation 1. These results mean so many developed algorithms in Hypercube, HCN(n,n), HFN(n,n) can be used efficiently in HFH($C_n,C_n$).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.243-250
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• 2001

This paper presents the structure of a $\mu$Spring package, its fabrication process and an analysis of its electrical characteristics compared to that of a $\mu$BGA. It was found that both $\mu$BGA and $\mu$Spring packages provide with outstanding high speed signal transmission characteristics due to their lower inductance of package interconnection lines, smaller than half of inductance of TSOP package lines. Even the worst case substrate trace of a Rambus DRAM $\mu$Spring package yields the line inductance of 2.9nH, which provides with 25% margin compared to the Rambus DRAM specification of 4nH. The fabrication cost of $\mu$Spring package is lower than that of $\mu$BGA by 50%, passes 1000 thermal cycles, meets JEDEC Level 1 specification whereas $\mu$BGA does not, and thereby yields high reliability and strong competing power.

• KIPS Transactions on Computer and Communication Systems
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• v.3 no.4
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• pp.107-114
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• 2014

Things in the IoT(Internet of Things) make various services by exchanging information over networks. The IoT includes many types of WSNs(Wireless Sensor Networks) that consists of spatially distributed wireless sensor nodes and operates with the various purposes with useful technologies such as identification, sensing and communication. Typically, Zigbee network composed of low-cost and lowpower devices is mainly used for wide-area monitoring and remote device control systems. The IoT composed of various WSNs cannot interoperate among networks because of heterogeneous communication protocol and different data representation of each network, but can facilitate interconnection and information exchange among networks via the DDS, which is communication middleware standard that aims to enable real-time, high performance and interoperable data exchanges. In this paper, we proposed design of Zigbee Adaptor for two-way interoperation and data exchange between Zigbee network and other networks in the IoT. Zigbee Adaptor communicates with Zigbee network according to the Zigbee protocol and communicates with external networks via DDS. DDS-based Zigbee Adaptor can facilitate interoperation between a Zigbee network and external networks by systematic cooperation among its components.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.7
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• pp.10-14
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• 2015

Recently, the collection of the sensor data and its analysis become important as the smart buildings equipped with the various sensors appear as a usual scene. The interconnection through the wire cable among the sensors is indispensible because of the information collections such as the temperature, the humidity, and the luminance in the rooms and the hallways for the effective management of the in-building energies. However, these interconnections through the cabling will be very costly, time-consuming, and a difficult task since they will cause some damages to the buildings. Therefore, the interconnections through the unwired connections are required in terms of the deployment effectiveness such as time and cost In this paper, the design and the short sequence operation appropriateness are confirmed through the simulation of the signal measurement system for in-building propagation characteristics based on short signature sequence and the analysis of the system characteristics based on the false alarm probability is performed thereafter.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.