• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.32A no.9
• /
• pp.114-120
• /
• 1995

It is important to test the various kinds of interconnect faults between chips on a card/module. When boundary scan design techniques are adopted, the chip to chip interconnection test generation and application of test patterns is greatly simplified. Various test generation algorithms have been developed for interconnect faults. A new interconnect test generation algorithm is introduced. It reduces the number of test patterns by half over present techniques. It also guarantees the complete diagnosis of mutiple interconnect faults.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.40 no.1
• /
• pp.61-71
• /
• 2003

Interconnect test for highly integrated environments like SoC, becomes more important as the complexity of a circuit increases. This importance is from two facts, test time and complete diagnosis. Since the interconnect test between IPs is based on the scan technology such as IEEE1149.1 and IEEE P1500, it takes long test time to apply test vectors serially through a long scan chain. Complete diagnosis is another important issue because a defect on interconnects are shown as a defect on a chip. But generally, interconnect test algorithms that need the short test time can not do complete diagnosis and algorithms that perform complete diagnosis need long test time. A new interconnect test algorithm is developed. The new algorithm can provide a complete diagnosis for all faults with shorter test length compared to the previous algorithms.

• Journal of the Microelectronics and Packaging Society
• /
• v.4 no.2
• /
• pp.25-32
• /
• 1997

대용량, 고속 정보처리가 요구되는 System의 모듈은 Data 처리의 고속성 및 회로의 고집적이 가능한 MCM의 형태로 구현되어 ATM, GPS 및 PCS 등의 분야에 광범위하게 응 용되고 있다. 위와 같은 High Speed 응용분야에서의 System 성능은 Interconnect Line의 전달지연, 임피던스 부정합에 의한 신호 반사 손실. 신호선 간의 Crosstalk, Ground Bounce 등의 현상에 대한 최적화 여부에 결정적인 영향을 받는다. 그러나 Interconnect의 특성상 정 형이 존재하지 않으므로 추상적인 Library를 구축하는 형식으로 접근할 수밖에 없으며 이를 위하여 여러기본 구조를 정의한후 각 Dimension을 변수로 두고 해석 결과를 합성하여 Database화하는 접근방식이다. 본 논문에서는 MCM-D 공정을 이용하여 Interconnect Line 특성을 분석하고 Database화 하기 위한 Test Pattern을 구현하고 Time Domain reflectometry(TDR)을 이용하여 그특성들을 측정 분석하였다. Test pattern 제작은 MCM-D 공정으로 최소선폭 27$\mu$m, Via Hole 75$\mu$m으로 형성하였고 2 Layer Signal과 GND로 총 3Layer를 구현하였다. 특성분석을 위해 TDR장비와 모데링 및 Simulation S/W인 IPA 510 을 사용하였다. 이를 통해 MCM-D를 이용한 공정에서 Interconcet Line의 고주파 특성을 측정하고 정량화하여 LIbrary를 제작할수 있었다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.7 s.337
• /
• pp.37-44
• /
• 2005

This paper presents effective test patterns and their BIST implementations for SoC and Board interconnects. Initially '6n'algorithm, where 'n' is the total number of interconnect nets, is introduced to completely detect and diagnose both static and crosstalk faults. Then, more economic 4n+1 algorithm is described to perfectly capture the crosstalk faults for the interconnect nets separated within a certain distance. It will be shown that both algorithms can be easily implemented as interconnect BIST hardwares with small area penalty than conventional LFSR.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.41 no.11
• /
• pp.69-77
• /
• 2004

An efficient board-level interconnect test algorithm is proposed considering both the ground bounce effect and the delay fault detection. The proposed algorithm is capable of IEEE 1149.1 interconnect test, negative ground bounce effect prevention, and also detects delay faults as well. The number of final test pattern set is not much different with the previous method, even our method enables to detect the delay faults in addition to the abilities the previous method guarantees.

• ETRI Journal
• /
• v.30 no.3
• /
• pp.403-411
• /
• 2008

This paper introduces an interconnect delay fault test (IDFT) controller on boards and system-on-chips (SoCs) with IEEE 1149.1 and IEEE 1500 wrappers. By capturing the transition signals launched during one system clock, interconnect delay faults operated by different system clocks can be simultaneously tested with our technique. The proposed IDFT technique does not require any modification on boundary scan cells. Instead, a small number of logic gates needs to be plugged around the test access port controller. The IDFT controller is compatible with the IEEE 1149.1 and IEEE 1500 standards. The superiority of our approach is verified by implementation of the controller with benchmark SoCs with IEEE 1500 wrapped cores.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.48 no.8
• /
• pp.18-24
• /
• 2011

A new problem happens with the evolution of TSV based 3D IC design. The bonding process takes place which follows with the testing of design for proper connectivity in the absence of TSV redundancy. In order to achieve good yield, the design should be tested with redundancy TSV. This paper presents a wrapper cell design for redundancy TSV interconnect test. The design for test technique, in terms of hardware and software perspectives is described. The wrapper cell with hardware design can use original test patterns. However, software design has less area overhead.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.44 no.12
• /
• pp.71-76
• /
• 2007

The effect of crosstalk errors is most significant in high-performance circuits. This paper presents effective test patterns for SoC and Board level interconnects considering actual effective aggressors. Initially '6n' algorithm, where 'n' is the total number of interconnect nets, is analyzed to detect and diagnose 100% crosstalk faults. Then, more efficient algorithm is proposed reducing the number of test patterns significantly while maintaining complete crosstalk fault coverage.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.5 s.335
• /
• pp.39-46
• /
• 2005

This paper introduces a new At-speed Interconnect Test Controller (ASITC) that can detect and diagnose dynamic as well as static defects in an SoC. SoC is comprised of IEEE 1149.1 and P1500 wrapped cores which can be operated by multiple system clocks. In other to test such a complicated SoC, we designed a interface module for P1500 wrapped cores and the ASITC that makes it possible to detect interconnect delay faults during 1 system clock from launching to capturing the transition signal. The ASITC proposed requires less area overhead than other approaches and the operation was verified through the FPGA implementation

• Journal of KIISE:Computer Systems and Theory
• /
• v.26 no.8
• /
• pp.1024-1030
• /
• 1999

IEEE 1149.1 바운다리스캔은 보드 수준에서 고장점검 및 진단을 위한 테스트 설계기술이다. 그러나, 바운다리스캔 제어기의 특성상 테스트 패턴의 주입에서 관측까지 2.5 TCK가 소요되므로, 연결선상의 지연고장을 점검할 수 없다. 본 논문에서는 UpdateDR 신호를 변경하여, 테스트 패턴 주입에서 관측까지 1 TCK가 소요되게 함으로써, 지연고장 점검을 가능하게 하는 기술을 소개한다. 나아가서, 정적인 고장점검을 위한 테스트 패턴을 개선해 지연고장 점검까지 가능하게 하는, N개의 net에 대한 2 log(n+2) 의 새로운 테스트패턴도 제안한다. 설계와 시뮬레이션을 통해 지연고장 점검이 가능함을 확인하였다.Abstract IEEE 1149.1 Boundary-Scan is a testable design technique for the detection and diagnosis of faults on a board. However, since it takes 2.5TCKs to observe data launched from an output boundary scan cell due to inherent characteristics of the TAP controller, it is impossible to test delay defects on the interconnect nets. This paper introduces a new technique that postpones the activation of UpdateDR signal by 1.5 TCKs while complying with IEEE 1149.1 standard. Furthermore we have developed 2 log(n+2) , where N is the number of nets, interconnect test patterns to test delay faults in addition to the static interconnect faults. The validness of our approach is verified through the design and simulation.