• Journal of the Korea Society for Simulation
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• v.10 no.3
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• pp.59-70
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• 2001

Typical low-level image processing tasks require thousands of operations per pixel for each input image. Traditional general-purpose computers are not capable of performing such tasks in real time. Yet important features of traditional computers are not exploited by low-level image processing tasks. Since storage requirements are limited to a small number of low-precision integer values per pixel, large hierarchical memory systems are not necessary. The mismatch between the demands of low-level image processing tasks and the characteristics of conventional computers motivates investigation of alternative architectures. The structure of the tasks suggests employing an array of processing elements, one per pixel, sharing instructions issued by a single controller. In this paper we implemented various image processing filtering using the format converter. Also, we realized from conventional gray image process to color image process. This design method is based on realized the large processor-per-pixel array by integrated circuit technology This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.21-21
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• 2010

(Ba,Sr)$TiO_3$ (BST) thin film with a perovskite structure has potential for the practical application in various functional devices such as nonvolatile-memory components, capacitor, gate insulator of thin-film transistors, and electro-optic devices for display. Normally, the BST thin films derived from sol-gel and sputtering are amorphous or partially crystalline when processed below $600^{\circ}C$. For the purpose of integrating BST thin film directly into a Si-based read-out integrated circuit (ROIC), it is necessary to process the BST film below $400^{\circ}C$. The microstructural and electrical properties of low-temperature crystallized BST film were studied. The BST thin films have been fabricated at $350^{\circ}C$ by UV-assisted rapidly thermal annealing (RTA). The BST films are in a single perovskite phase and have well-defined electrical properties such as high dielectric constant, low dielectric loss, low leakage current density, and high breakdown voltage. Photoexcitation of the organics contained in the sol-gel-derived films by high-intensity UV irradiation facilitates elimination of the organics and formation of the single-crystalline phase films at low temperatures. The amorphous BST thin film was transformed to a highly (h00)-oriented perovskite structure by high oxygen pressure processing (HOPP) at as low as $350^{\circ}C$. The dielectric properties of BST film were comparable to (or even better than) those of the conventionally processed BST films prepared by sputtering or post-annealing at temperature above $600^{\circ}C$. When external pressure was applied to the well-known contractive BST system during annealing, the nucleation energy barrier was reduced; correspondingly, the crystallization temperature decreased. The UV-assisted RTA and HOPP, as compatible with existing MOS technology, let the BST films be integrated into radio-frequency circuit and mixed-signal integrated circuit below the critical temperature of $400^{\circ}C$.

• Proceedings of the KOSOMBE Conference
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• v.1998 no.11
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• pp.299-300
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• 1998

Recently the development of medical modality like as MRI, 3D US, DR etc is very active. Therefore it is more required not only the enhancement of quality in medical service but the improvement of medical system based on quantization, minimization, and optimization of high speed. Especially, as the changing into the digital modality system, it gets to start using ASIC(Application Specific Integrated Circuit) to realize one board system. It requires the implementation of hardware debugging and effective speedy algorithm with more speed and accuracy in order to support and replace existing device. If objected image could be linked to high speed process board with special interface and pre-processed using FPGA, it can be used in real time image processing and protocol of HIS(Hospital Information System). This study can support the basic circuit design of medical image board which is able to realize image processing basically using digitalized medical image, and to interface between existing device and image board containing image processing algorithm.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.25-29
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• 2002

There is an increasing interest in high-speed signal processing in modern telecommunication and SC circuit, HDTV, ISDN. There are many methods of high-speed signal processing. This paper describes a design approach for the realization of high-frequency Op-amp in CMOS technology. A limiting factor in Op-amp based analog integrated circuits is the limited useful frequency range. this thesis will develop a CMOS op-amp architecture with improved gainband width product with this technique an op-amp will achieve up to 170MHz (CL=2pF) unity-gain frequency with a 1.2-micron design rule. This CMOS op-amp is particularly suitable for achieving wide and stable closed-loop band widths, such as required in high-frequency SC filters, high-speed analog circuits.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.59-65
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• 2004

A stable reference voltage generator is necessary to the infrared image signal readout circuit(ROIC) to improve noise characteristics of signal originated from infrared devices, that is, to gain good images. In this paper, bandgap circuit operating at cryogenic temperature of 77K for Infrared image ROIC(readout integrated circuit) was first made. It demonstrates practical use possibility through taking measurements and estimations. Bandgap circuit is a representative voltage reference circuit. Most of bandgap reference circuits which are presented so far operate at room temperature, and their characteristic are not suitable for infrared image ROIC operating at liquid nitrogen temperature, 77K. To design bandgap circuit operating at cryogenic temperature, suitable circuit is selected and the parameter characteristics of used devices as temperature change are seen by a theoretical study and fitted at liquid temperature with considering such characteristics. This circuit has been fabricated in the Hynix 0.6um standard CMOS process, and the output voltage measured shows that the stability is 1.042±0.0015V over the temperature range of 60K to 110K and is better than bandgap circuits operated at room temperature.

• Advances in Energy Research
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• v.7 no.2
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• pp.147-166
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• 2020

Industrial cooling towers are often ageing infrastructure that is expensive to maintain and operate. A novel approach is introduced in which a heat pump circuit is incorporated to reduce the load upon the towers by extracting low-grade energy from the stream sent to the towers and repurposing in on-site processing operations. To demonstrate the concept, a model was constructed, which uses industrial data on cooling towers linked to a smelter's sulphuric acid plant, to allow direct economic and environmental impact comparison between different heat recovery and repurposing scenarios. The model's results showed that implementing a heat pump system would significantly decrease annual operating costs and achieve a payback period of 3 years. In addition, overall CO₂ emissions could be reduced by 42% (430,000 kg/year) and a 5% heat load reduction on the cooling towers achieved. The concept is significant as the outcomes introduce a new way for energy intensive industrial sectors, such as mineral processing, to reduce energy consumption and improve long-term sustainable performance.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.10 no.2
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• pp.93-103
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• 1985

The digital signal processing technique by bandwidth compression has been grown up ragidly owing to integrated circuit developments. In this project, we have proposed the Lee Weighted Hadamard (LWH) transform which retains the main properties of Hadamard matirx. The LWH matrix was weighted in the center of the spatial domain. The human visual of the mid spatial are emphasized more than the low and high spatial frequencies. The fast algorithms of the LWH transform has been studied for hardware realization. The result of this project are availabel to airplane photograph, X-Ray, CATV and the artificial satellite of the digital image processing.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.3
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• pp.141-144
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• 2015

A broadband radio frequency synthesizer for multi-band, multi-standard mobile DTV tuners is proposed, it's loop bandwidth can be calibrated to optimize integrated phase noise performance without the problem of phase noise peaking. For this purpose, we proposed a new third-order scalable loop filter and a scalable charge pump circuit to minimize the variation in phase margin during calibration. The prototype phase-lock loop is fabricated in 180nm complementary metal-oxide semiconductor shows that it effectively prevents phase noise peaking from growing while the loop bandwidth increases by up to three times.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.8
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• pp.62-71
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• 1994

A novel semiconductor device is proposed to be used as a processing element for the implementation of pulse-mode neural networks which consists of alternating n' GaAs quantum wells and undoped AlGaAs barriers sandwitched between n' GaAs cathode and P' GaAs anode and in simple circuit in conjunction with a parallel capacitive and resistive load the trigger circuit generates neuron-like pulse train output mimicking the function of axon hillock of biological neuron. It showed the sigmoidal relationship between the frequency of the pulse-train and the applied input DC voltage. In conjunction with MQWIMD the various neural circuits are proposed especially a neural chip monolithically integrated with photodetectors in order to perfrom the pattern recognition.