• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.523-523
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• 2012

As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

• 비파괴검사학회지
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• 제35권6호
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• pp.414-420
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• 2015

Concrete undergoes significant phase changes from liquid to solid states as hydration progresses. These phase changes are known as the setting process. A liquid state concrete is electrically conductive because of the presence of water and ions. However, since the conductive elements in the liquid state of concrete are consumed to produce non-conductive hydration products, the electrical conductivity of hydrating concrete decreases during the setting process. Therefore, the electrical properties of hydrating concrete can be used to monitor the setting process of concrete. In this study, a parameter identification method to estimate electrical parameters such as ohmic resistance of concrete is proposed. The effectiveness of the proposed method for monitoring the setting process of concrete is experimentally validated.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.1386-1390
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• 2007

This paper presents the equipment condition monitoring technology for the process or the equipment using statistical techniques. The equipment condition monitoring system consists of an empirical model to estimate the expected sensor values of process variables and a diagnose model to detect the abnormal condition and to identify the root source of the problem. The empirical model is constructed by the analysis of historic data. The diagnose model uses the sequential probability ratio test (SPRT) technique. The monitoring system was tested with real operating data acquired from the Reactor Coolant Pump Seal in the Nuclear Power Plant. It can detect the system degradation or failure at the early stage since it is able to catch the subtle deviation of process variables from normal condition.

• Journal of information and communication convergence engineering
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• 제3권4호
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• pp.187-190
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• 2005

High aspect ratio via-hole etching process has emerged as one of the most crucial means to increase component density for ULSI devices. Because of charge accumulation in via-hole, this sophisticated and important process still hold several problems, such as etching stop and loading effects during fabrication of integrated circuits. Indeed, the concern actually depends on accumulated charge. For monitoring accumulated charge during plasma etching process, charge-up monitoring sensor was fabricated and tested under some plasma conditions. This paper presents a neural network-based technique for analyzing and modeling several electrical performance of plasma charge-up monitoring sensor.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2005년도 추계종합학술대회
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• pp.303-306
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• 2005

High aspect ration via-hole etching process has emerged as one of the most crucial means to increase component density for ULSI devices. Because of charge accumulation in via hole, this sophisticated and important process still hold several problems, such as etching stop, loading effects during fabrication of integrated circuits. Indeed, the concern actually depends on accumulated charge. For monitoring accumulated charge during plasma etching process, charge-up monitoring sensor was fabricated and tested under some plasma conditions. This paper presents a neural network-based technique for analyzing and modeling several electrical performance of plasma charge-up monitoring sensor.

• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• 한국전자거래학회지
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• 제12권2호
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• pp.219-231
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• 2007

본 논문에서는 복합 이벤트 처리를 적용하여 비즈니스 활동 분석(BAM)을 위한 이벤트 분석 방안을 제안한다. 이는 프로세스 관리자가 프로세스가 종료되기 이전에 발생 가능한 위험을 감지하고 모니터링하기 위하여 실시간에 진행되는 이벤트에 대하여 조기 경보를 제공하기 위하여 개발되었다. 본 연구에서는 의미 있는 위험을 가지는 이벤트를 추출하는, 프로세스 기반의 이벤트 모니터링 과정을 제시하였다. 복합 이벤트 패턴은 과거 누적된 이벤트 로그를 바탕으로 정의되며, 이벤트의 위험도는 그 패턴들에 기반하여 평가된다. 제안된 방법론은 홈쇼핑업체의 서비스 프로세스의 예를 이용하여 설명한다.

• 한국정밀공학회지
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• 제13권12호
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• pp.30-37
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• 1996

On-line process control equipment for CO$_{2}$ laser cutting is not available for industrial applications. The major part of the industrial laser cutting machines are adjusted off-line by highly educated engineers. The quality inspection of the sample is visual and referred to different quality scales. Due to the lack of automation the potential laser users hesitate to implement the cutting method. The first step toward an automation of the process is the development of a process monitoring system and the research is cincentrated on the area of on-line quality monitoring during CO$_{2}$ laser cutting. The method is based on the detection of the emitted light from the cutting front by photo diode. The developed monitoring system consists of the OP Amplifier, A/D convertor, power supply and PC. The signal from the photo diode has been undertaken from Fourier analysis and statistical analysis with real time. The photograph of striation pattern was taken by metallurgical microscope. As a result, it is possible to predict the striation pattern according to the beam traveling speed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1069-1074
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• 2008

Tool condition monitoring (TCM) is crucial for improvement of productivity in manufacturing process. However, TCM techniques have not been applied to monitor tool failure in an industrial gear shaving application. Therefore, this work studied a statistical TCM method for monitoring gear shaving tool condition. The method modeled the shaving process using beta probability distribution in order to extract the effective features. Modeling includes rectifying for converting a bi-modal distribution into a unimodal distribution, estimating parameters of beta probability distribution based on method of moments. The usefulness of features obtained from the proposed method was evaluated and discussed.

• 한국콘텐츠학회논문지
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• 제11권8호
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• pp.43-50
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• 2011

초기에 예측하지 못한 환경에 대응하기 위한 핵심 요소로 비즈니스 활동 모니터링이 주목받고 있다. 그러나 기존의 이벤트 처리 기반 모니터링 시스템과 실시간 조기 경보 비즈니스 활동 모니터링은 고정된 환경을 가정하여 설계 시 룰 기반으로 표현하여 경보 여부를 결정하거나, 이벤트 속성값이 입력되는 매시점마다 측정하여 경보를 내리게 된다. 따라서, 복잡한 환경에서의 새로운 외부 상황 문제에 대한 발생 범위와 심각한 정도 등을 판별하는데 한계가 있으며, 추상화하지 못한다. 본 논문에서는 외부에서 발생하는 새로운 시나리오의 서비스 요구를 기존의 실행중인 모니터링을 통해 지속적인 서비스 제공을 보장하도록 목표 시나리오를 이용한 비즈니스 프로세스 외부상황 평가 모델을 제안하였다. 외부 상황에 따른 새로운 요구사항을 목표 시나리오 기반으로 분석을 하고, 유사 프로세스 모델을 찾아 유사도와 연관도를 합하여 파악한 뒤 프로세스를 사전에 중단 시키거나 원하는 방향으로 변경하도록 한다.