• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권6호
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• 디지털융복합연구
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• 제10권6호
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• pp.61-69
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• 2012

오늘날 스마트융합이 급속도로 진척되면서 소프트웨어(software : SW)의 시장이 크게 성장하고 있다. 그러나 세계시장에서 우리나라의 SW가 차지하는 비중은 2.2%에 불과하다. 특히 패키지SW는 글로벌 기업의 그것에 비해 매우 취약한 실정이며, 임베디드SW에 비해서도 그 비중이 낮은 수준에 머물러 있다. 이는 국산 패키지SW의 취약한 경쟁력에 기인하지만, 정부의 정책적 지원도 상대적으로 미약한 실정이다. 이에 본 연구는 국산 패키지SW산업 실태를 자료 및 사례연구를 통해 파악하고 패키지SW 지원정책의 개선 과제를 도출한 다음, 이를 토대로 국산 패키지SW산업의 육성에 관한 정책 대안을 제언하고자 한다.

• 한국IT서비스학회지
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• 제8권2호
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• pp.1-22
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• 2009

Recently, improving service quality for customer satisfaction is one of the most important issues and the task for the growth of company. Furthermore, plenty studies are going on progress to develop service quality in IT industry. There have been so many researches of product quality on package software but yet the service quality of package software has been rarely studied before. Thus, the purpose of this study is to formulate a scheme on how to enhance the competitivity of package software company by analyzing the impacts of these two factors on the customer satisfaction, Word-of-Mouth intention and the reuse intention. The study models have been designed and the hypotheses have been made through the examination of the precedent literature about package software product and service quality. A questionnaire survey was performed to collect information, and the unit of analysis was a person who used package software. This study used the statistical technique such as regression analysis. This study may be utilized as basic data for building marketing strategies when package software companies offer service to customers.

• 한국소음진동공학회논문집
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• 제14권2호
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• 한국국방경영분석학회지
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• 제17권2호
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• pp.100-112
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• 1991

Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.

• 펄프종이기술
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• 제39권2호
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• pp.68-77
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• 2007

It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• 국제학술발표논문집
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• The 3th International Conference on Construction Engineering and Project Management
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• pp.635-641
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• 2009

In the building construction, the specialist contractors play the important roles in the point of the quality securing. Therefore, it is very important for the construction industry to study the sub-package problem. The sub-package problem includes two problems which should be solved. One is to decide the scope of works of each specialist contractor, and another one is to decide the particular specialist contractor which carries out the work. However, the sub-package problem in Korea is not clarified yet, although the circumstance around it has changed rapidly. Many factors influence to the sub-package problem regardless of internal factors or external factors of the project. The general contractor usually decides the sub-package under considering the project conditions. In case of the internal factors, each general contractor manages the organization and materials. But the external factors are relatively more difficult to control and predict than internal ones. But out of the external factors, the legal system has very close relationship with a sub-package problem especially in Korean construction system. So, this paper clarifies relationship between the legal system relating subcontracting and the state of sub-package.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.