• Environmental Engineering Research
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• 제14권2호
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• pp.134-139
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• 2009

In this study, oxidation of As (III) as well as removal of total arsenic by adsorbents coated with single oxides or multi-oxides (Fe (III), Mn (IV), Al (III)) was investigated. In addition, multi-functional properties of adsorbents coated with multi-oxides were evaluated. Finally, application of activated carbon impregnated with Fe or Mn-oxides on the treatment of As (III) or As (V) was studied. As (V) adsorption results with adsorbents containing Fe and Al shows that adsorbents containing Fe show a greater removal of As (V) at pH 4 than at pH 7. In contrast adsorbents containing Al shows a favorable removal of As (V) at pH 7 than at pH 4. In case of iron sand, it has a negligible adsorption capacity for As (V) although it contains 217.9 g-Fe/kg-adsorbent, Oxidation result shows that manganese coated sand (MCS) has the greatest As (III) oxidation capacity among all metal oxides at pH 4. Oxidation efficiency of As (III) by IMCS (iron and manganese coated sand) was less than that by MCS. However the total removed amount of arsenic by IMCS was greater than that by MCS.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2004년도 춘계학술발표대회
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• pp.481-484
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• 2004

이 논문에서는 소포 배달 서비스를 위한 인텔리전트 모니터링 시스템(Intelligent Monitoring and Control System; IMCS)에 대해 기술한다. IMCS 는 GIS, GPS 그리고 무선 통신 기술을 이용하여 택배의 접수와 배달 업무를 효율적이고 효과적으로 개발하기 위한 시스템이다. IMCS는 모두 세개의 서브 시스템으로 구성되어 있는데 접수와 배달 계획을 수립하는 PDPS(Pick-up and Delivery Planning System)과 접수/배달 현황과 차량의 위치를 파악할 수 있는 PDMS(Pick-up and Delivery Monitoring System), 그리고 개인휴대단말기(PDA)을 이용한 실시간 업무 처리 시스템인 MOCS(Mobile Operations and Communication System)으로 구성되어 있다. PDPS는 GIS와 최적화 알고리즘을 이용하여 접수와 배달을 위한 방문 순서와 경로 그리고 고객에게 방문할 예정시간 등을 생성한다. MOCS에서는 GPS와 무선 통신을 이용하여 업무 중 발생한 접수/배달 결과와 위치 정보를 실시간으로 PDMS에 전송하고 바코드 스캐닝과 전자 서명 등의 업무를 지원한다. PDMS에서는 수신한 정보에 따라 소포의 접수/배달 현황과 차량의 위치를 전자지도 상에 표현하고 업무 차량의 이동 궤적을 표시하여 계획된 경로와 비교하여 모니터링하고 관제할 수 있다. 현재 IMCS는 국내 한 우체국에서 시범 운영되고 있다.

• 열처리공학회지
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• 제34권6호
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• pp.309-314
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• 2021

Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.205-206
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• 2006

The microstructural evolutions and shear properties of the pure Sn solder bumps with Ni UBMs were investigated during multiple reflows and high temperature storage(HTS) tests. Only a $Ni_3Sn_4$ IMC was found at the bump/Ni UBM interface after 1 reflow. The layer thickness of these IMCs increased with increasing reflow number and testing time. The solder bumps showed a good reliability during multiple reflows and HTS tests.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.49-56
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• 2012

최근 전자 제품의 소형화, 박형화 및 집적화에 따라 칩과 기판을 연결하는 범프의 미세화가 요구되고 있다. 그러나 범프의 미세화는 직경 감소와 UBM의 단면적 감소로 인하여 전류 밀도를 증가시켜 전기적 단락을 야기할 수 있다. 특히 범프에서 형성되는 금속간화합물과 KV의 형성은 전기적 및 기계적 특성에 큰 영향을 줄 수 있다. 따라서 본 논문에서는 유한요소해석을 이용하여 플립칩 범프의 열변형을 분석하였다. 우선 TCT의 온도조건을 통하여 플립칩 패키지의 열변형 특성을 분석한 결과, 범프의 열 변형이 시스템의 구동에 큰 영향을 미칠 수 있음을 확인하였다. 그리고 범프의 열변형 특성에 큰 영향을 미칠 것을 생각되는 IMC층의 두께와 범프의 직경을 변수로 선정하여 온도변화, 열응력 및 열변형에 대한 해석을 수행하였으며, 이를 통하여 IMC층이 범프에 영향을 미치는 원인에 대한 분석을 수행하였다.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.27-36
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• 2007

본 논문에서는 다양한 조성의 주석-은-구리 합금계 솔더볼과 ENIG 및 Cu-OSP 패드와의 계면 반응에 대해 연구하였다. ENIG 패드와 미량의 Sb이 첨가된 합금 솔더와의 계면 반응 시 다른 솔더에 비해 매우 얇은 100 nm 내외의 두께를 가진 P-rich Ni layer가 형성되었다. 미량의 Ni이 첨가된 합금 솔더와 Cu-OSP 금속 패드와의 계면 반응 시에는 다른 솔더와는 달리 균일한 두께의 $Cu_6Sn_5$ 금속간화합물이 형성되었으며 추가 리플로우 시에 금속간화합물 입자가 거의 성장하지 않았다. 또한 $150^{\circ}C$의 장시간 열처리 시에 다른 솔더에 비해 매우 얇은 두께의 $Cu_3Sn$ 금속간화합물이 형성되었다.

• 대한금속재료학회지
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• 제50권1호
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• 대한금속재료학회지
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• 제50권10호
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• pp.775-783
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• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1820-1821
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• 2011

The equipment qualification test was accomplished before application to power generating stations because troubles in applying to real system could be prevented trough the test. That is, if a system was judged to be suitable in the equipment qualification test, the system was expected to be operated stable to the designed life.