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http://dx.doi.org/10.6117/kmeps.2012.19.3.049

Analysis on the Thermal Deformation of Flip-chip Bump Layer by the IMC's Implication  

Lee, Tae Kyoung (Education program for samsung advanced integrated circuit, Pusan National University)
Kim, Dong Min (Education program for samsung advanced integrated circuit, Pusan National University)
Jun, Ho In (Education program for samsung advanced integrated circuit, Pusan National University)
Huh, Seok-Hwan (SEMCO ACI Division)
Jeong, Myung Young (Department of Cogno-Mechatronics Engineering, Pusan National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.3, 2012 , pp. 49-56 More about this Journal
Abstract
Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.
Keywords
Flip-chip; IMC; TCT; Diffusion; Thermal deformation; FEM;
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Times Cited By KSCI : 1  (Citation Analysis)
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