Analysis on the Thermal Deformation of Flip-chip Bump Layer by the IMC's Implication |
Lee, Tae Kyoung
(Education program for samsung advanced integrated circuit, Pusan National University)
Kim, Dong Min (Education program for samsung advanced integrated circuit, Pusan National University) Jun, Ho In (Education program for samsung advanced integrated circuit, Pusan National University) Huh, Seok-Hwan (SEMCO ACI Division) Jeong, Myung Young (Department of Cogno-Mechatronics Engineering, Pusan National University) |
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