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http://dx.doi.org/10.7467/KSAE.2013.21.3.134

Evaluation of Shear Strength for Pb-free Solder/Ni and Cu Plate Joints due to Reflow Time  

Ha, Byeori (Advanced Technology Research Team, Jeonbuk Institute of Automotive Technology)
Yu, Hyosun (Mechanical System Engineering, Chonbuk National University)
Yang, Sungmo (Mechanical System Engineering, Chonbuk National University)
Ro, Younsik (Advanced Technology Research Team, Jeonbuk Institute of Automotive Technology)
Publication Information
Transactions of the Korean Society of Automotive Engineers / v.21, no.3, 2013 , pp. 134-141 More about this Journal
Abstract
Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.
Keywords
Reflow time; Pb-free solder; Shear strength; Intermetallic Compound(IMC); Ni plate; Cu plate; SP test;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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