Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Reliability of Electroplated Pure Sn Solder Bumps

전해도금으로 형성된 Sn 솔더 범프의 신뢰성

  • 김유나 (성균관대학교 신소재공학과) ;
  • 구자명 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2006.10.19
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Abstract

The microstructural evolutions and shear properties of the pure Sn solder bumps with Ni UBMs were investigated during multiple reflows and high temperature storage(HTS) tests. Only a $Ni_3Sn_4$ IMC was found at the bump/Ni UBM interface after 1 reflow. The layer thickness of these IMCs increased with increasing reflow number and testing time. The solder bumps showed a good reliability during multiple reflows and HTS tests.

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