• Title/Summary/Keyword: III-V Compound Semiconductor

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Measurement of III-V Compound Semiconductor Characteristics using the Contactless Electroreflectance Method

  • Yu, Jae-In;Choi, Soon-Don;Chang, Ho-Gyeong
    • Journal of Electrical Engineering and Technology
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    • v.6 no.4
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    • pp.535-538
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    • 2011
  • The electromodulation methods of photoreflectanceand the related technique of contactless electroreflectance(CER) are valuable tools in the evaluation of important device parameters for structures such as heterojunction bipolar transistors, pseudomorphic high electron mobility transistors, and quantum dots(QDs). CER is a very general principle of experimental physics. Instead of measuring the optical reflectance of the material, the derivative with respect to a modulating electric field is evaluated. This procedure generates sharp, differential-like spectra in the region of interband (intersubband) transitions. We conduct electric-optical studies of both GaAs layers and InAs selfassembled QDs grown by molecular beam epitaxy. Strong GaAsbandgap energy is measured in both structures. In the case of lnAs monolayers in GaAs matrices, the strong GaAsbandgap energy is caused by the lateral quantum confinement.

The passivation of III-V compound semiconductor surface by laser CVD (Laser CVD법에 의한 III-V화합물 반도체 표면의 불활성화)

  • Lee, H.S.;Lee, K.S.;Cho, T.H.;Huh, Y.J.;Kim, S.J.;Sung, Y.K.
    • Proceedings of the KIEE Conference
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    • 1993.07b
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    • pp.1274-1276
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    • 1993
  • The silicon-nitride films formed by laser CVD method are used for passivating GaAs surfaces. The electrical Properties of metal-insulator-GaAs structure are studied to determined the interfacial characteristics by C-V curves and deep level transient spectroscopy(DLTS). The SiN films are photolysisly deposited from $SiH_4\;and\;NH_3$ in the range of $100^{\circ}C-300^{\circ}C$ on P type, (100) GaAs. The hysteresis is reduced and interface trap density is lowered to $10^{12}-10^{13}$ at $100^{\circ}C-200^{\circ}C$. The surface leakage current is studied too. The passivated GaAs have a little leakage current compared to non passivated GaAs.

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Growing of AlGaAs/GaAs Double-Heterostructure by the Liquid Phase Epitaxy Method and Fabrication of the Light Emitting Diode (액상에피층 성장방법에 의한 AlGaAs/GaAs 이중 헤테로 구조의 성장과 LED의 제작)

  • 이원성;권영세
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.5
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    • pp.11-16
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    • 1984
  • In this paper, the construction of the Liquid Phase Epitaxy system for fabricating III-V compound semiconductor devices and the method of growing AIGaAs/GaAs Double-Hetero-structure are discussed. The possibility of this Double-Heterostructure for the Light Emitting Diode is confirmed also.

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Design of Cellular Power Amplifier Using a SifSiGe HBT

  • Hyoung, Chang-Hee;Klm, Nam-Young;Han, Tae-Hyeon;Lee, Soo-Min;Cho, Deok-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.04a
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    • pp.236-238
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    • 1997
  • A cellular power amplifier using an APCVD(Atmospheric Pressure Chemical Vapor Deposition)-grown SiGe base HBT of ETRI has been designed with a linear simulation CAD. The Si/SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0 GHz and a maximum oscillation frequency(f$_{max}$) of 16.1 GHz with a pad de-embedding A packaged power Si/SiGe HBT with an emitter area of 2$\times$8$\times$80${\mu}{\textrm}{m}$$^2$typically shows a f$_{T}$ of 4.7 GHz and a f$_{max}$ of 7.1 GHz at a collector current (Ic) of 115 mA. The power amplifier exhibits a Forward transmission coefficient(S21) of 13.5 dB, an input and an output reflection coefficients of -42 dB and -45 dB respectively. Up to now the III-V compound semiconductor devices hale dominated microwave applications, however a rapid progress in Si-based technology make the advent of the Si/SiGe HBT which is promising in low to even higher microwave range because of lower cost and relatively higher reproducibility of a Si-based process.ess.ess.

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Properties and Peculiar Features of Application of Isoelectronically Doped $A^2B^6$ Compound-Based Scintillators

  • Ryzhikov, V.;Starzhinskiy, N.
    • Journal of Radiation Protection and Research
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    • v.30 no.2
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    • pp.77-84
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    • 2005
  • The authors submit the data concerning the methods of obtaining semiconductor scintillators on the basis of the zinc chalcogenide crystal doped with impurities (Te, Cd, O, $Me^{III}-metals$ Al, In, etc.). Characteristics of such crystals and mechanisms for the semiconductor scintillator luminescence are described as well. The scintillator luminescence spectra maximums are located within the range 450-640nm, which depends on the method of preparing the scintillator. The luminescence decay time ranges within $0.5-10{\mu}s\;and\;30-150{\mu}s$. The afterglow level is less than 0.01% after $10-20{\mu}s$, and the radiation stability is ${\geq}5{\cdot}10^8$ rad. Thermostability of the output characteristics of new semiconductor scintillators on the basis of zinc selenide is prescribed by thermodynamic stability of the principal associative radiative recombination centers that come into existence due to the crystal lattice inherent imperfections. Certain application fields of the new scintillators are examined taking into account their particular qualities.

Design Optimization of a Type-I Heterojunction Tunneling Field-Effect Transistor (I-HTFET) for High Performance Logic Technology

  • Cho, Seong-Jae;Sun, Min-Chul;Kim, Ga-Ram;Kamins, Theodore I.;Park, Byung-Gook;Harris, James S. Jr.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.11 no.3
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    • pp.182-189
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    • 2011
  • In this work, a tunneling field-effect transistor (TFET) based on heterojunctions of compound and Group IV semiconductors is introduced and simulated. TFETs based on either silicon or compound semiconductors have been intensively researched due to their merits of robustness against short channel effects (SCEs) and excellent subthreshold swing (SS) characteristics. However, silicon TFETs have the drawback of low on-current and compound ones are difficult to integrate with silicon CMOS circuits. In order to combine the high tunneling efficiency of narrow bandgap material TFETs and the high mobility of III-V TFETs, a Type-I heterojunction tunneling field-effect transistor (I-HTFET) adopting $Ge-Al_xGa_{1-x}As-Ge$ system has been optimized by simulation in terms of aluminum (Al) composition. To maximize device performance, we considered a nanowire structure, and it was shown that high performance (HP) logic technology can be achieved by the proposed device. The optimum Al composition turned out to be around 20% (x=0.2).

A Study on Concentrating Photovoltaic Module with Plate Structure (평판 구조의 집광형 태양광 모듈 구조에 관한 연구)

  • Park, Seung-Jae;Hong, Min-Sung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.4
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    • pp.629-634
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    • 2013
  • This study aims to investigate a new structure for a concentrating photovoltaic (PV) module using a III-V compound semiconductor solar cellto solve the problems of existing concentrating PV modules and to explore a concentrating optical system with a flat structure, which shows remarkable advantages in terms of manufacturing cost, installation, and maintenance. This study should greatly contribute toward the development of concentrating PV modules. This study was performed to achieve an improvement in efficiency and economy and to implement an actual product. A new source of renewable energy is the only way in which countries that cannot produce oil can even emerge as an energy power. Therefore, this work can serve as a fundamental study that will help South Korea grow into a country that is a PV power generation force.

Soft Lithographic Approach to Fabricate Sub-50 nm Nanowire Field-effect Transistors

  • Lee, Jeong-Eun;Lee, Hyeon-Ju;Go, U-Ri;Lee, Seong-Gyu;Qi, Ai;Lee, Min-Hyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.410.1-410.1
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    • 2014
  • A soft-lithographic top-down approach is combined with an epitaxial layer transfer process to fabricate high quality III-V compound semiconductor nanowires (NWs) and integrate them on Si/SiO2 substrates, using MBE-grown ultrathin InAs as a source wafer. The channel width of the InAs nanowires is controlled by using solvent-assisted nanoscale embossing (SANE), descumming, and etching processes. By optimizing these processes, the NW width is scaled to less than 50 nm, and the InAs NWFETs has ${\sim}1,600cm^2/Vs$ peak electron mobility, which indicates no mobility degradation due to the size.

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SWIR 이미지 센서 기술개발 동향 및 응용현황

  • Lee, Jae-Ung
    • Ceramist
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    • v.21 no.2
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    • pp.59-74
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    • 2018
  • Imaging in the Short Wave Infrared (SWIR) provides several advantages over the visible and near-infrared regions: enhanced image resolution in in foggy or dusty environments, deep tissue penetration, surveillance capabilities with eye-safe lasers, assessment of food quality and safety. Commercially available SWIR imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits(ROIC) by indium bump bonding Infrared image sensors made of solution-processed quantum dots have recently emerged as candidates for next-generation SWIR imagers. They combine ease of processing, tunable optoelectronic properties, facile integration with Si-based ROIC and good performance. Here, we review recent research and development trends of various application fields of SWIR image sensors and nano-materials capable of absorption and emission of SWIR band. With SWIR sensible nano-materials, new type of SWIR image sensor can replace current high price SWIR imagers.

Study on the Characteristics of GaInP/AlGaInP Heterojunction Photovoltaic Cells under Concentrated Illumination (집광 조건에서의 GaInP/AlGaInP 이종접합 구조 태양전지 특성 연구)

  • Kim, Junghwan
    • Applied Chemistry for Engineering
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    • v.30 no.4
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    • pp.504-508
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    • 2019
  • The feasibility of replacing the tope cell of pn GaInP homojunction with our GaInP/AlGaInP heterojunction structure in III-V semiconductor multijunction photovoltaic (MJPV) cells having the highest current conversion efficiency was investigated. The performance of photovoltaic (PV) cells grown on $2^{\circ}$ and $10^{\circ}$ off-oriented GaAs substrates were compared to each other. The PV cells on the $10^{\circ}$ off-cut substrate showed higher short-circuit current density ($J_{sc}$) and conversion efficiency values than that of using the $2^{\circ}$ one. For $2{\times}2mm^2$ area PV cell on $10^{\circ}$ off substrate, the $J_{sc}$ of $9.21mA/cm^2$ and the open-circuit voltage of 1.38 V were measured under 1 sun illumination. For $5{\times}5mm^2$ cell on $10^{\circ}$ off substrate, the conversion efficiency was decreased from 6.03% (1 sun) to 5.28% (20 sun) due to a decrease in fiill factor (FF).