• 한국전기전자재료학회논문지
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• 제13권11호
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• pp.963-968
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• 2000

Magnetic properties and microstructures of Fe$\_$93-x/Zr$_3$B$_4$Ag$\_$x/ thin films were investigated as a function of addition of element Ag, (X$\_$Ag/=0 to 6 at.%) and annealing temperature, T$\_$a/=300$\^{C}$ to 600$\^{C}$. In the case of adding Ag, magnetic properties of Fe$\_$93-x/Zr$_3$B$_4$Ag$\_$x/ thin films were improved than those of Ag-free Fe$\_$93/Zr$_3$B$_4$thin films. The prominent soft magnetic properties with coercivity of 1.1 Oe, saturation magnetization of 2.2 T and permeability of 5400 at 50㎒ were obtained from Fe$\_$88/Zr$_3$B$_4$Ag$\_$5/ thin film annealed was lower than that of Fe-base or Co-base thin films reported previously. Such enhanced magnetic properties are presumably attributed to the format in ultra fine grains. Also, the reduced eddy current loss in the annealed sample is due to refined micro magnetic domains with increasing the amount of Ag in Fe$\_$93-x/Zr$_3$B$_4$Ag$\_$x/ thin films.

• 접착 및 계면
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• 제10권2호
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• pp.98-105
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• 2009

Tetramethylorthosilicate와 glycidol을 이용하여 액상의 에폭시 그룹을 함유한 실란 올리고머를 합성하고, p-PDA/ODA 그리고 PMDA/BPDA 단량체로부터 제조된 4성분계 폴리아믹산과 혼성화시켜 고점도의 폴리아믹산/실리카 혼성체를 합성하였다. 그리고 이를 열적 이미드화 공정을 거쳐 폴리이미드/실리카 혼성화 필름을 제조하였다. 혼성화 필름의 특성을 분석한 결과, 열팽창계수는 실리카 함량이 높을수록 최초 17 ppm/K에서 10 ppm/K까지 감소하였고, 탄성률은 증가하였으나 인장강도는 감소하는 경향을 보였다. 또한 유연성 동박 적층 필름을 제조하여 분석한 결과, 실리카 함량 변화에 따라 접착력은 $0.43kg_f/cm$에서 $1.02kg_f/cm$까지 증가하였다. 따라서 높은 접착력을 요구하는 유연성 동박 적층 필름 제조시에는 실리카와 혼성된 폴리이미드 필름이 효과적임을 알 수 있었다.

• 한국표면공학회지
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• 제36권2호
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• pp.122-127
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• 2003

Ti - Si - N hard films were deposited on SKD11 steel substrates by a hybrid deposition system, where TiN was deposited by AIP method while Si was incorporated by sputtering one. The microstructure of Ti-Si-N films was revealed to be a composite of TiN crystallites and amorphous Si3N4 by instrumental analyses. The highest hardness value of about 45 Gpa was obtained at the Si content of around 7.7 at.%. With increase of Si content, the size of TiN crystallites was reduced and their distribution was changed from aligned to randomly orientated states. Surface roughness of Ti-Si-N film also decreased with increase of Si content.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.315-318
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• 2001

The optical and dielectric properties of TiO$_2$ thin films prepared with mixtures of Epoxy, bits-(4, 4'-p-toluenesulfonylacidic isoproplylidene)-cyclohexadiol and UVI 6990 in dry sol-gel process were investigated. The absorption peak of the films was showed at 360nm. Photocurrent of the thin films doped with 50 wt% of TiO$_2$was higher than that of nondoped thin films. Energy gap was lowered from 3.6 to 3.3 eV with increasing amount of TiO$_2$. Relative dielectric constants of samples were 1.5 to 3 and showed a characteristics of lower dielectric materials.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.995-998
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• 2003

This paper reports the correlation between dielectric constant and degree of amorphism of the hybrid type Si-O-C thin films. Si-O-C thin films were deposited by high density plasma chemical vapor deposition using bistrimethyl- silylmethane(BTMSM, $H_{9}$C$_3$-Si-C $H_2$-Si-C$_3$ $H_{9}$) and oxygen precursors with various flow rate ratio. As-deposited film and annealed films at 40$0^{\circ}C$ were analyzed by XRD. The Si-O-C thin films were amorphous from XRD patterns. For quantitative analysis, the diffraction pattern of the samples was transformed to radial distribution function by Fourier analysis, and then compared with each other. The degree of amorphism of annealed films was higher than that of as-deposited ones. The dielectric constant varied in accordance with flow rate ratio of precursors. The lowest dielectric constant was obtained from the as-deposited film which has the highest degree of amorphism after annealing.

• Bulletin of the Korean Chemical Society
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• 제31권9호
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• pp.2503-2508
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• 2010

ZnO thin films were grown on Si or $SiO_2$/Si substrates, at growth temperatures ranging from 150 to $400^{\circ}C$, by atomic layer deposition (ALD) using diethylzinc and water. Despite the large band gap of 3.3 eV, the ALD ZnO films show high n-type conductivity, i.e. low resistivity in the order of $10^{-3}\;{\Omega}cm$. In order to understand the high conductivity of ALD ZnO films, the films were characterized with X-ray diffraction, transmission electron microscopy, X-ray photoelectron spectroscopy, elastic recoil detection, Rutherford backscattering, Photoluminescence, and Raman spectroscopy. In addition, the various analytical data of the ZnO films were compared with those of ZnO single crystal. According to our analytical data, metallic zinc plays an important role for the high conductivity in ALD ZnO films. Therefore when the metallic zinc was additionally oxidized with ozone by a modified ALD sequence, the resistivity of ZnO films could be adjusted in a range of $3.8{\times}10^{-3}\;{\sim}\;19.0\;{\Omega}cm$ depending on the exposure time of ozone.

• Elastomers and Composites
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• 제45권4호
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• pp.298-308
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• 2010

패럴린 박막의 기계적 성질과 표면 특성을 개선하기 위해 Xylydene계 다이머(DPX-C, DPX-D, DPX-N)를 사용하여 각각의 다이머에 대한 증착 조건과 투입량에 따른 박막의 두께를 조절함으로써 단일 패럴린-C, D, N 박막과 두 가지 타입이 혼합된 하이브리드 타입의 화학적, 물리적 패럴린 박막을 제조하였다. 패럴린 증착은 화학기상증착법(chemical vapor deposition: CVD)을 이용하였으며, 열분석을 통해 단일 박막과 하이브리드 타입의 박막에 대한 열적 특성을 비교 분석하였다. 인장 강도와 신장율 그리고 인열력 시험을 통해 박막에 대한 기계적 물성을 알아보았으며, 접촉각과 표면 에너지를 측정하여 박막에 대한 표면 특성을 관찰하였다. 두 가지 타입이 혼합된 하이브리드 타입의 화학적 패럴린 박막은 서로 다른 다이머의 장단점을 상호 보완시켜 줄 수 있으며, 물리적 패럴린 박막은 기재에 코팅되는 면과 반대 면의 박막 특성을 자유롭게 조절할 수 있다.

• Korean Chemical Engineering Research
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• 제52권3호
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• pp.388-394
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• 2014

출발물질인 TTIP로부터 이산화티탄 졸을 합성하여 무기물로 사용하고 유기물로서 실란커플링제인 methacryloxypropyl trimethoxysilane (MPTMS), aminopropyl triethoxysilane (APS), glycidoxypropyl trimethoxysilane (GPTMS), vinyltriethoxysilane (VTES)을 2종 혹은 3종씩 복합 사용하여 유-무기 하이브리드 코팅 용액을 제조하였다. 그 후 코팅 용액을 기재인 PC시트 위에 스핀 코팅시키고, 열경화 시켜 하드코팅 막을 제조하였다. 2종 실란커플링제를 혼합하여 제조된 코팅 막들은 기재와의 부착력과 연필경도가 우수하지 못했으나, 3종 실란커플링제를 혼합하여 제조한 코팅 막은 2H~4H의 향상된 연필경도와 5B의 우수한 부착력을 나타내었다. 이산화티탄 졸의 첨가량이 20 g인 코팅 막의 굴절률은 550 nm에서 1.56을 나타내었으나 이산화티탄 졸의 첨가량을 20 g에서 30 g으로 증가시킨 경우, 코팅 막의 굴절률이 1.63으로 향상되었다.

• International Journal of Fuzzy Logic and Intelligent Systems
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• 제1권1호
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• pp.87-94
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• 2001

Silicon nitride films grown by plasma-enhanced chemical vapor deposition (PECVD) are useful for a variety of applications, including anti-reflecting coatings in solar cells, passivation layers, dielectric layers in metal/insulator structures, and diffusion masks. PECVD systems are controlled by many operating variables, including RF power, pressure, gas flow rate, reactant composition, and substrate temperature. The wide variety of processing conditions, as well as the complex nature of particle dynamics within a plasma, makes tailoring SiN film properties very challenging, since it is difficult to determine the exact relationship between desired film properties and controllable deposition conditions. In this study, SiN PECVD modeling using optimized neural networks has been investigated. The deposition of SiN was characterized via a central composite experimental design, and data from this experiment was used to train and optimize feed-forward neural networks using the back-propagation algorithm. From these neural process models, the effect of deposition conditions on film properties has been studied. A recipe synthesis (optimization) procedure was then performed using the optimized neural network models to generate the necessary deposition conditions to obtain several novel film qualities including high charge density and long lifetime. This optimization procedure utilized genetic algorithms, hybrid combinations of genetic algorithm and Powells algorithm, and hybrid combinations of genetic algorithm and simplex algorithm. Recipes predicted by these techniques were verified by experiment, and the performance of each optimization method are compared. It was found that the hybrid combinations of genetic algorithm and simplex algorithm generated recipes produced films of superior quality.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.271-271
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• 2010

$BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.