• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.239-242
• /
• 2008

We have investigated the reliability of short channel ($L=1.5{\mu}m$) p-type ELA poly-Si TFTs under hot carrier stress. Threshold voltage of short channel TFT was significantly more shifted to positive direction than that of long channel TFT under the same stress. This result may be attributed to electron trapping at the interface between poly-Si film and gate oxide layer.

• 전자공학회논문지 IE
• /
• v.45 no.2
• /
• pp.1-5
• /
• 2008

In this work, RF performance degradation due to hot carrier effects in SOI MOSFET have been measured and analyzed. The LNA that designed at $V_{GS}=0.8V$, f=2.5GHz, gain is 16.51dB and noise figure is 1.195dB. After stress at SOI, the LNA's gain and noise figure change of 15.3dB and 1.44dB with before stress.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.25 no.2
• /
• pp.182-187
• /
• 1988

Hot carrier induced device degradation characteristics under DC bias stress have been investigated in n-MOSFETs with channel length of 1.2,1.8 um, and compared with those of LDD structure device with same channel length. Based on these results, the device lifetime in normal operating bias(Vgs=Vds=5V) is evaluated. The lifetimes of conventional and LDD n-MOSFET with channel length of 1.2 um are estimated about for 17 days and for 12 years, respectively. The degradation rate of LDD n-MOSFET under the same stress is the lowest at n-region implnatation dose of 2.5E15 cm-\ulcorner while the substrate current is the lowest at the dose of 1E13cm-\ulcorner Thses results show that the device degradation characteristics are basic measurement parameter to find optimum process conditions in LDD devices and evaluate a reliability of sub-micron device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.11
• /
• pp.869-873
• /
• 2001

The effects of alternate bias stress on p-channel poly-Si TFT\`s has been systematically investigated. We alternately applied positive and negative bias stress on p-channel poly-Si TFT\`s, device Performance(V$\_$th/, g$\_$m/, leakage current, S-slope) are alternately appeared to be increasing and decreasing. It has been shown that device performance degrade under the negative bias stress while improve under the positive bias stress. This effects have been related to the hot carrier injection into the gate oxide rather than the generation of defect states within the poly-Si/SiO$_2$ interface under alternate bias stress.

• Proceedings of the KIEE Conference
• /
• 2006.10a
• /
• pp.50-52
• /
• 2006

본 논문은 고성능 다결정 실리콘(Poly-Si) 박막 트랜지스터 (Thin Film Transistor)에서 단일 수직 그레인 경계(Single Perpendlcular Grain Boundary)가 고온 캐리어 스트레스(Hot Carrier Stress) 및 정전류 안정성 평가에서 어떠한 효과를 보이는가에 대해서 살펴보았다. 고온 캐리어 스트레스 하에서($V_G=V_{TH}+1V,\;V_D$ =12V),그레이 경계가 없는 다결정 실리콘 TFT와 비교했을 때 그레인 경계를 가지고 있는 다결정 실리를 TFT는 전기 전도(Electric Conduction)에 작용하는 자유 캐리어(Free Carrier)의 개수가 적기 때문에 상대적으로 더욱 우수한 전기적 특성을 나타낸다. 먼저 1000초 동안 고온 캐리어 스트레스를 가해준 결과 단일 그레인 경계를 가진 다결정 실리콘에서의 트랜스 컨덕턴스(Transconductance)의 이동 정도는 5% 미만으로 확인되었다. 반면에 같은 스트레스 조건 하에서 그레인 경계가 존재하지 않는 다결정 실리콘의 경우에는 그 이동 정도가 약 25%에 달하는 것으로 측정되었다. 다음으로 정전류 스트레스(Constant Current Stress) 인가시, 수직형 그레인 경계가 채널 영역 내에 존재하지 않는 다결정 실리콘 TFT는 드레인 접합 부분의 전계 세기를 비교했을 때, 그레인 경계를 가지고 있는 다결정 실리콘 TFT보다 상대적으로 낮은 원 인 때문에 적게 열화되는(Degraded) 특성을 확인할 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.32A no.6
• /
• pp.59-66
• /
• 1995

The hot electron induced effective channel length modulation (${\Delta}L_{H}$) and HEIP characteristics in PMOSFET's after bidirectional stress are presented. Trapped electron charges in gate oxide and lateral field are calculated from the gate current model, and ${\Delta}L_{H}$(${\Delta}L_{HD},\;{\Delta}L_{HS}$) is calculated using trapped electron charges and lateral field. It has been found that ${\Delta}I_{d}$and ${\Delta}L_{H}$ are more affected by the stress order (Forward-Reverse of Reverse or Reverse-Forward) than the stress direction, and they vary logarithmically with the stress time. In contrast, ${\Delta}V_{t}$ and ${\Delta}V_{pt}$ are more affected by the stress direction thatn the stress order. The correlation between ${\Delta}V_{pt}$ and the stress time can be explanined as the following polynomial functin: ${\Delta}V_{pt}$=AT$^{n}$. It has also been shown that PMOSFET degradation is related with the gate current and the effects of ${\Delta}V_{pt}$ is the most significant.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.36D no.5
• /
• pp.21-28
• /
• 1999

A new method of making high speed self-aligned ESD (Elevated Source/Drain) MOSFET is proposed. Different from the conventional LDD (Lightly-Doped Drain) structure, the proposed ESD structure needs only one ion implantation step for the source/drain junctions, and makes it possible to modify the depth of the recessed channel by use of dry etching process. This structure alleviates hot-carrier stress by use of removable nitride sidewall spacers. Furthermore, the inverted sidewall spacers are used as a self-aligning mask to solve the self-align problem. Simulation results show that the impact ionization rate ($I_{SUB}/I_{D}$) is reduced and DIBL (Drain Induced Barrier Lowering) characteristics are improved by proper design of the structure parameters such as channel depth and sidewall spacer width. In addition, the use of removable nitride sidewall spacers also enhances hot-carrier characteristics by reducing the peak lateral electric field in the channel.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.05a
• /
• pp.51-54
• /
• 1996

This paper reports the studies of the inversion layer mobility in p-channel Si MOSFET's under hot-carrier degradated condition. The validity of relationship of hot carrier degradations between the surface effective mobility and field effect mobility and are examined. The effective mobility(${\mu}$$\_$eff/) is derived from the channel conductances, while the field-effect mobility(${\mu}$$\_$FE/) is obtained from the transconductance. The characteristics of mobility curves can be divided into the 3 parts of curves. It was reported that the mobility degradation is due to phonon scattering, coulombic scattering and surface roughness. We are measured the mobility slope in curves with DC-stress [V$\_$g/=-3.1v]. It was found that the mobility(${\mu}$$\_$eff/ and ${\mu}$$\_$FE/) of p-MOSFET's was increased by increasing stress time and decreasing channel length. Because of the increasing stress time and increasing V$\_$g/ is changed oxide reliability and increased vertical field.

• KEPCO Journal on Electric Power and Energy
• /
• v.2 no.2
• /
• pp.223-225
• /
• 2016

The newly proposed analysis method using a direct-current current-voltage (DCIV) simulation is introduced for investigating leakage current composing MOS transistor. From comparing the density and location of traps using DCIV method and investigating the leakage current of gate channel transistor, we proposed the graphical analysis method to correlate the DCIV current and leakage mechanism by the traps. And, our graphical method intuitively explains that leakage current in MOS transistor is well correlated with the DCIV current of the MOS transistor arrays due to two kinds of traps created by Fowler-Nordheim (F-N) stress and Hot carrier stress, respectively.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.33A no.10
• /
• pp.130-138
• /
• 1996

The size of a device needs to scale down to increase its integrity and speed. As the size of the device is reduced, the hot-carrier degradation that severely effects on device reliabilty is concerned. In this paper, sub-micron buried-channel P-MOSFETs were fabircated, and the hot-carrier effects were invetigated. Also the hot-carrier effect in the buired-channel P-MOSFETs and the surface-channel P-MOSFETs were compared with simulation programs using SUPREM-4 and MINIMOS-4. This paper showed that the electric characteristics of sub-micron P-MOSFET are different from those of N-MOSFET. Also it showed that the punchthrough voltage ( $V_{pt}$ ) was abruptly drop after applying the stress and became almost 0V when the channel lengths were shorter than 0.6.mu.m. The lower punchthrough voltage causes the device to operte poorly by the deterioration of cut-off characteries in the switching mode. We can conclude that the buried channel P-MOSFET for CMOS circuits has a limit of the channel length to be around 0.6.mu.m.