• 한국전자파학회지:전자파기술
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• 제14권1호
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• pp.35-42
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• 2003

Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair

• 한국항공운항학회지
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• 제17권3호
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• pp.70-77
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• 2009

We proposed the method of avionics integrated architecture using high-speed fiber optic bus. Typically, data bus of aircraft consists of electronic and optic data transmission method. Avionics systems are difficult to operate the electronic data transmission method for the high speed data processing, synchronization and interconnection between flight control system and flight management system efficiently. In this paper, it is known to look into the problem of data bus and the advanced trend in avionics systems, and propose the appropriate data bus of the advanced avionics systems.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 춘계학술대회 논문집
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• pp.2021-2026
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• 2008

Recently, a high speed rail consists of many train coaches and power cars. For keeping the reliable train communication system with train coaches and power cars, train uses the OSI model(Open Systems Interconnection Basic Reference Model) and KTX(Korea Train eXpress) only uses the Physical to Transport layer of OSI model. This paper describes the analysis of CLNP(Connectionless Network Protocol) and ES-IS(End System to Intermediate System) protocols used in KTX for the network layer. CLNP is used to send data to other system and ES-IS protocol is used to route and send information between end systems and intermediate systems. Also this paper presents the protocol parsing program and implementation of Network layer.

• 한국통신학회논문지
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• 제24권8B호
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• pp.1401-1411
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• 1999

멀티미디어 서비스의 증가에 따라 멀티캐스팅(Multicasting)은 ATM 스위치 디자인에 있어 중요성을 더해가고 있다. 기존의 다단 연결 구조에서 멀티캐스트에 의한 트래픽 팽창의 문제를 해결하기 위해 본 논문에서는 고속의 버스와 공유 메모리 스위치를 이용한 멀티캐스트 스위치를 제안한다. 고속의 시분할 버스를 연결 매체로 사용하며 공유 메모리 스위치를 단위 모듈로 하는 구조를 채택하여 용이한 포트 확장성을 제공한다. 트래픽 중재 기법을 사용하여 내부 블러킹을 없애며, 시뮬레이션을 통해 데이터 처리율이나 셀지연 측면에서의 스위치 성능을 확인한다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.149-153
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• 1999

As VLSI technology advances rapidly, the operating frequency of digital systems becomes very fast. In such a high-speed system, there are many factors that threaten signal integrity. The noise sources in digital system include the noises in power supply, ground bounce and packaging media and distortions on single and multiple transmission lines. This paper will present a technology survey useful in the design of Gigabit interconnection systems. Some case studies have been constructed which show the lossy transmission line effect of skin effect. dielectric loss, with backplane connectors using the theoretical and practical conditions.

• 한국통신학회논문지
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• 제22권9호
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• pp.1975-1984
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• 1997

본 논문에서는 3 차원 시간 영역 유한 차분법 (FDTD)을 이용하여 고속 패키지 접속 선로 구조들 중에서 인접 선로와 교차된 선로 구조에 대한 주파수 특성과 누화를 해석하였다. 고속 디지털 신호 전송에서의 실질적인 누화해석을 위하여 입력 여기 신호로서 시간 영역 유한 차분법에서 주로 사용되는 가우스 펄스 대신 빠른 상승 시간을 갖는 계단 펄스를 사용하였다. 해석 결과와 각 접속 선로 구조를 비유전율이 2.33이고, 높이가 0.787[mm]인 Duroid 기판에 제작, 시간 영역 반사측정기(TDR : time domain reflectometry)로 측정한 결과가 잘 일치함을 보였다.

• 정보와 통신
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• 제11권4호
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• pp.62-70
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• 1994

본고는 교환기의 기본구조를 변경하지 않고 프레임릴레이를 통하여 ISDN(Intergrated services digital network) 교환기에 물리적으로 적용 가능한 LAN(Local area network) 인터페이스 기술에 대하여 서술하였다. 프레임릴레이의 구현을 위해 기존 X.25 서비스와의 상호접속 방안이 매우 중요한데 이를 위해서는 X.75 및 I.122를 배경으로 하는 상호적인 방안이 고려되어야 한다. 프레임릴레이 서비스에 필요한 특징 및 트로토콜, 브릿지 상호접속 및 ISDN 노드에 사용되어 프레임 수행을 위한 프레임핸들러의 설계방법에 이어, 프레임릴레이를 통한 LAN과 ISDN간 상호접속 메카니즘에 대해 각각 서술하였다. 그리고 프레임릴레이를 통하여 LAN을 위한 고속 프레임릴레이 서비스를 구현한 주요국의 사례를 살펴보았다.

• 한국기계가공학회지
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• 제16권6호
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• pp.75-80
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• 2017

The use of optical fiber makes it possible to transfer a large amount of data, thereby enabling a high-speed image transmission with a high response speed and a large number of frames. The need for an optical fiber HDMI System has grown in importance due to the rapid development of displays with large sizes and high-resolution images. In this paper, we have studied the structural design and FEM analysis of a 4C fiber guide for hybrid interconnection implementation. According to the structural analysis of the fiber guide, we have confirmed the safety of the design and we will make additional design changes to minimize the optical loss and fabricate a fiber guide for photoelectric composite HDMI in the future.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Journal of Welding and Joining
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• 제32권3호
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.