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http://dx.doi.org/10.5781/JWJ.2014.32.3.60

Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability  

Lee, Ji-Hye (ACI Division, Samsung Electro-Mechanics)
Huh, Seok-Hwan (ACI Division, Samsung Electro-Mechanics)
Jung, Gi-Ho (ACI Division, Samsung Electro-Mechanics)
Ham, Suk-Jin (ACI Division, Samsung Electro-Mechanics)
Publication Information
Journal of Welding and Joining / v.32, no.3, 2014 , pp. 60-67 More about this Journal
Abstract
The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.
Keywords
High speed shear energy; Electroless Ni-P; $HNO_3$ vapor treatment; Ni corrosion;
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Times Cited By KSCI : 4  (Citation Analysis)
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