Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability |
Lee, Ji-Hye
(ACI Division, Samsung Electro-Mechanics)
Huh, Seok-Hwan (ACI Division, Samsung Electro-Mechanics) Jung, Gi-Ho (ACI Division, Samsung Electro-Mechanics) Ham, Suk-Jin (ACI Division, Samsung Electro-Mechanics) |
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