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Twisted Differential Line Structure on High-Speed Printed Circuit Boards to Enhance Immunity to Crosstalk and External Noise  

Kam, Dong-Gun (KAIST)
Kim, Joung-Ho (KAIST)
Publication Information
The Proceeding of the Korean Institute of Electromagnetic Engineering and Science / v.14, no.1, 2003 , pp. 35-42 More about this Journal
Abstract
Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair
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