• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.903-906
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• 2011

The electroplating and electro-less plating methods have been applied for the high density chip interconnect of the Copper Pillar Tin Bump (CPTB) preparation. The CPTB was prepared, which had been electroplated about $100{\mu}m$ pitch of copper layer firstly, and then the Tin layer was deposited on the copper pillar surface to protect the oxidation of it. It was also very important to get uniform thickness of electroplated copper layer, though it was difficult and sensitive. In order to control the thickness distribution, it was examined that the current separating disk of Insulating Gate with a hole in the center was installed between electrodes. The current flows through the center hole of the Insulating Gate in the cylindrical electroplating bath and the other parts were blocked to protect current flowing. The main current flowed through the center hole of the Insulating Gate directly to the opposite electrode of wafer disk. As the results, it was verified that the copper layer was thick in the center part of wafer disk with distribution of thinner to the outer part toward edge.

• Journal of Sensor Science and Technology
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• v.24 no.6
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• pp.379-384
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• 2015

An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

• Journal of Energy Engineering
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• v.23 no.2
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• pp.13-20
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• 2014

The natural convection heat transfers of a helical coil in a duct were measured experimentally varying the inclination. To achieve high Rayleigh number, mass transfer experiments instead of heat transfer experiments were performed based upon the analogy. The $Ra_D$ was fixed to $4.55{\times}10^6$. The turn numbers were 1~10. the pitch to diameter ratio were 1.3~5, and the inclination of the helical coil $0^{\circ}{\sim}90^{\circ}$. The measured $Nu_D$ for a single turn of the helical coil was very close to that from McAdams heat transfer correlation for a horizontal cylinder. The heat transfers of the helical coil were varied by the pith, number of turns, and duct height in a complex manner showing the velocity, chimney, and pre-heating effects. The results of the study contributes to the phenomenological analyses of the natural convection heat transfer of a compact heat exchanger.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1180-1184
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• 2006

In a speech coding system using excitation source of voiced and unvoiced, it would be a distortion of speech quality in a voiced and an unvoiced consonants in a frame. In this paper, I propose a new multi-pulse coding method make use of V/S/TSIUVC switching and TSIUVC approximation-synthesis method in order to restrict a distortion of speech quality. The TSIUVC is extracted by using the zero crossing rate and individual pitch pulse. And the TSIUVC extraction rate was 91% for female voice and 96.2% for male voice. The important thing is that the frequency information of 0.547kHz below and 2.813kHz above can be made with high quality synthesis waveform within TSIUVC. I evaluated the MPC of V/UV and FBD-MPC of V/S/TSIUVC. As a result, the synthesis speech of FBD-MPC was better in speech quality than the MPC.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.5 s.248
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• pp.446-456
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• 2006

The effect of relative position of the stationary turbine blade for the fixed vane has been investigated on blade tip and shroud heat transfer. The local mass transfer coefficients were measured on the tip and shroud fur the blade fixed at six different positions within a pitch. A low speed stationary annular cascade with a single turbine stage was used. The chord length of the tested blade is 150 mm and the mean tip clearance of the blade having flat tip is 2.5% of the blade chord. A naphthalene sublimation technique was used for the detailed mass transfer measurements on the tip and the shroud. The inlet flow Reynolds number based on chord length and incoming flow velocity is fixed to $1.5{\times}10^5$. The results show that the incoming flow condition and heat transfer characteristics significantly change when the relative position of the blade changes. On the tip, the size of high heat/mass transfer region along the pressure side varies in the axial direction and the difference of heat transfer coefficient is up to 40% in the upstream region of the tip because the position of flow reattachment changes. On shroud, the effect of tip leakage vortex on the shroud as well as tip gap entering flow changes as the blade position changes. Thus, significantly different heat transfer patterns are observed with various blade positions and the periodic variation of heat transfer is expected with the blade rotation.

• Journal of the Korean Society for Precision Engineering
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• v.4 no.3
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• pp.44-51
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• 1987

In metal cutting various types of chips are produced in consequence of cutting conditions. Flow-type chips have been studied in most cases because they are easier to be analyzed, but the actual surfaces of chips are not smooth, but crushed. This paper deals with saw-toothed chips, special types of flow-type chips, which have deep concaves and high convexes and sharp angles on the free surface. I tried to establish the theory of saw-toothed chip mechanism through experimental observation, that is, the mathmatical model of the cutting energy and cutting mechanism through the geometrical observation of the chips by using a microscope. The results obtained are as follows: 1. The mechanism of saw-toothed chips is diffenent from that of general flow-chips. 2. In the case of saw-toothed chips, the shear angle must be measured by the hypotenuse angle and the rake angle, and the shear angle is more affected by the rake angle than by the hypotenbuse angle. 3. The friction angle is represented by .beta. = . pi. /4+ .alpha./ sub n/- .phi. which is different from Merchant's equation. 4. The pitch and the slip are greatly influenced by depth of cut, but the influence of the rake angle on it is small. 5. The normal stress and the shear stress on the shear plane decrease with the increase of the cutting depth, and they are almost independent on the variation of a rake angle. 6. The unit friction energy on the tool face, the unit shear energy on the shear plane, and the total cutting energy per unit volume decrease with the increase of rake angle and cutting depth.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Korean Geotechnical Society
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• v.36 no.9
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• pp.45-55
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• 2020

X-ray computed tomography (CT) is very useful for the quantitative evaluation of internal structures, particularly defects in rock samples, such as pores and fractures. In situ CT allows 3D imaging of a sample subjected to various external treatments such as loading and therefore enables observation of changes that occur during the loading process. We reviewed state-of-the-art of in situ CT applications for geomaterials. Two triaxial cells made using relatively low density but high strength materials were developed aimed at in situ CT scanning during hydro-mechanical laboratory testing of rocks. Preliminary results for in situ CT imaging of granite and sandstone samples with diameters ranging from 25 mm to 50 mm show a resolution range of 34~105 ㎛ per pixel pitch, indicating the feasibility of in situ CT observations for internal structural changes in rocks at the micrometer scale. Potassium iodide solution was found to improve the image contrast, and can be used as an injection fluid for hydro-mechanical testing combined with in situ CT scanning.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.274-281
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• 2018

Experimental studies of the hydrodynamic performance of the draft tube conical spout-fluid bed (DCSF) were conducted using pharmaceutical pellets. The experiments were carried out in a DCSF consisted of two sections: (a) a conical section with the cross section of $120mm{\times}250mm$ and the height of 270 mm, (b) a cylindrical section with the diameter of 250 mm and the height of 600 mm. The flow characteristics of solids were investigated with a high speed camera and a pezoresistive absolute pressure transducer simultaneously. These characteristics revealed different flow regimes in the DCSF: packed bed at low gas velocities, fluidized bed in draft tube at higher gas velocities until minimum spouting, and spouted bed. The stable spouting was identified by the presence of two dominant frequencies of the power spectrum density of pressure fluctuation signature: (i) the frequency band 6-9 Hz and (ii) the frequency band 12-15 Hz. The pressure drops across the draft tube as well as the annulus measured in order to better recognize the flow structure in the DCSF. It was observed that the pressure drop across the draft tube, the pressure drop across the annulus, and the minimum spouting velocity increase with the increase in the height of draft tube and distance of the entrainment zone, but with the decrease in the distributor hole pitch. Finally, this study provided novel insight into the hydrodynamic of DCSF, particularly minimum spouting and stable spouting in the DCSF which contains valuable information for process design and scale-up of spouted bed equipment.