High Speed Cu Filling Into TSV by Pulsed Current for 3 Dimensional Chip Stacking |
Kim, In Rak
(Dept. of Materials Sci. and Eng., University of Seoul)
Park, Jun Kyu (Dept. of Materials Sci. and Eng., University of Seoul) Chu, Yong Cheol (Duksan Hi-metal) Jung, Jae Pil (Dept. of Materials Sci. and Eng., University of Seoul) |
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