• Korean Journal of Materials Research
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• v.16 no.5
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• pp.318-322
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• 2006

Short-term high temperature degradation test was conducted on Hastelloy X, a candidate tube material for high temperature gas-cooled reactors (HTGR), to evaluate the variation of microstructure and mechanical property in air at $1050^{\circ}C$ during 2000 h. The dominant oxide layer was Cr-oxide and a very shallow Cr-depleted region was observed below the oxide layer. At the beginning of degradation, the island shape $M_6C$ precipitate (M=Mo-rich, Fe, Ni, Cr) was observed in matrix region. After 2000 h degradation, precipitate shape was changed to the chain shape and increased amount of precipitate. These results influenced mechanical property of the specimen which exposed in high temperature. Yield strength was decreased from 115MPa to 89 MPa after 24 h and 2000 h exposure, respectively.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.278-281
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• 2000

In this study, the electrical characteristics of 100V -Class LDMOSFET for high temperature applications such as electronic control systems of automobiles and motor driver were investigated. Measurement data are taken over wide range of temperature(300K-500K) and various drift region length(6.6$\mu\textrm{m}$-12.6$\mu\textrm{m}$). In high temperature condition(>450K), drain current decreased over 50％, and specific on-resistance increased about twice in comparison with room temperature. Moreover the ratio R$\sub$on//BV, a figure of merit of the device, increased with increasing temperature.

• Journal of Mechanical Science and Technology
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• v.18 no.12
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• pp.2104-2113
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• 2004

Surface degreasing method with premixed flame is proposed as the removal method of adherent impurities on materials. Effects of adherent molecular thickness and surface potential energy on evaporation rate of adherent molecules and molecular evaporation mechanism were investigated and discussed in the present study. Evaporation processes of adherent molecules on surface molecules were simulated by the molecular dynamics method to understand thermal phenomena on evaporation processes of adherent molecules by using high temperature gas like burnt gas. The calculation system was composed of a high temperature gas region, an adherent molecular region and a surface molecular region. Both the thickness of adherent molecules and potential parameters affceted the evaporation rate of adherent molecules and evaporation mechanism in molecular scale.

• Journal of Ocean Engineering and Technology
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• v.16 no.5
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• pp.80-87
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• 2002

In this study, CT specimens were prepared from spring steel(SUP9) which was used in suspension of automobile for room temperature and low temperature service. We got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, ­3$0^{\circ}C$, ­5$0^{\circ}C$, ­7$0^{\circ}C$ and ­10$0^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.83-90
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• 2004

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature and low temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, $-30^{\circ}C$, $-50^{\circ}C$, $-70^{\circ}C$,$-100^{\circ}C$, and $-150^{\circ}C$, in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I)was increased but stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to decrease temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerably higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.403-409
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• 2007

In this paper, effects of the trench angle($\theta$) on the breakdown voltage according to the process parameters of p-base region and doping concentrations of n-drift region in a Trench Gate IGBT (TIGBT) device were analyzed by computer simulation. Processes parameters used by variables are diffusion temperature, implant dose of p-base region and doping concentration of n-drift region, and aspects of breakdown voltage change with change of each parameter were examined. As diffusion temperature of the p-base region increases, depth of the p-base region increases and effect of the diffusion temperature on the breakdown voltage is very low in the case of small trench angle($45\;^{\circ}$) but that is increases 134.8 % in the case of high trench angle($90\;^{\circ}$). Moreover, as implant dose of the p-base region increases, doping concentration of the p-base region increases and effect of the implant dose on the breakdown voltage is very low in the case of small trench angle($45\;^{\circ}$) but that is increases 232.1 % in the case of high trench angle($90\;^{\circ}$). These phenomenons is why electric field concentrated in the trench is distributed to the p-base region as the diffusion temperature and implant dose of the p-base increase. However, effect of the doping concentration variation in the n-drift region on the breakdown voltage varies just 9.3 % as trench angle increases from $45\;^{\circ}$ to $90\;^{\circ}$. This is why magnitude of electric field concentrated in the trench changes, but direction of that doesn't change. In this paper, respective reasons were analyzed through the electric field concentration analysis by computer simulation.

• Asian Pacific Journal of Cancer Prevention
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• v.14 no.9
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• pp.5085-5088
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• 2013

Background: The north-western region of China has a high incidence of oesophageal cancer. This study aimed to investigate whether the intake of food and beverage at high temperature is associated with the risk of oesophageal cancer among adults residing in this remote part of China. Materials and Methods: A case-control study was undertaken in Urumqi and Shihezi, Xinjiang Uyghur Autonomous Region of China, between 2008 and 2009. Participants were 359 incident oesophageal cancer patients and 380 hospital-based controls. Information on temperature of food and beverage intake was obtained by face-to-face interview. Logistic regression analyses were performed to ascertain the association between intake temperature and the risk of oesophageal cancer. Results: The oesophageal cancer patients consumed foods and beverages at higher temperatures than controls, p<0.001. High temperature of tea, water and food intake appeared to increase the risk of oesophageal cancer by more than two-fold, with adjusted odds ratio (95% confidence intervals) of 2.86 (1.73-4.72), 2.82 (1.78-4.47) and 2.26 (1.49-3.45), respectively. Conclusions: Intake of food and beverage at high temperature was positively associated with the incidence of oesophageal cancer in north-western China.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.96-103
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• 2000

This study investigated the effects of bonding temperature and bonding atmosphere on high temperature mechanical properties of transient liquid phase(TLP) bonded joints of heat resistant alloy using MBF-50 insert metal. Specimens were bonded at 1,423~1,468K for 600s. Microconstituents of {TEX}$Cr_{7}(C,B)_{3}${/TEX}were formed in the bonded region when the bonding temperature was low. The amount of microcostituents in the bonded layer decreased with increasing the bonding temperature, and the microconstituents in the bonded layer disappeared at the bonding temperature above 1,468K. The tensile strength of the joints at elevated temperatures increased with the increase the bonding temperature and was the same level as one of the base metal in the bonding temperature over 1,453K. Microstructure and alloying element distributions of the bonded region bonded in Ar and $N_2$atmosphere were similar to those of the bonded in vacuum. The creep rupture strength and rupture lives of joints were almost identical to those of base metal.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.703-710
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• 2012

The effects of the ordering reaction on high temperature mechanical behavior is investigated by tensile tests at $2{\times}10^{-2}/s-3.3{\times}10^{-5}/s$ up to $745^{\circ}C$. The tensile deformed region is examined by differential scanning calorimeter (DSC), TEM, and high resolution neutron diffraction (HRPD). The results showed that a plateau of tensile strength appeared at $150-500^{\circ}C$ whereas the elongation minimum occurred at about $600^{\circ}C$. This suggests that the occurrence of a plateau does not cause the elongation minimum. The temperature of the elongation minimum decreases with the strain rate. HRPD results show a lattice contraction in the tensile deformed specimen at the temperature of the plateau occurring region. The plateau of tensile strength, the lattice contraction, and the occurrence of serration appeared in the same temperature region.

• Bulletin of the Korean Chemical Society
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• v.15 no.9
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• pp.713-718
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• 1994

Manganese-incorporated neodymium oxide systems with a variety of Mn mol% were prepared to investigate the effect of doping on the electrical properties of neodymium oxide. XRD, XPS, SEM, DSC, and TG techniques were used to analyze the specimens. The systems containing 2, 5, 8, and 10 mol% Mn were found to be solid solutions by X-ray diffraction analysis and the lattice parameters were obtained for the single-phase hexagonal structure by the Nelson-Riley method. The lattice parameters, a and c, decreased with increasing Mn mol%. Scanning electron photomicrographs of the specimens showed that the grain size decreased with increasing Mn mol%. The curves of log conductivity plotted as a function of 1/T in the temperature range from 500 to 1000$^{\circ}C$ at $PO_2$'s of $10^{-5}$ to $10^{-1}$ atm for the specimens were divided into high-and low-temperature regions with inflection points near 820-890$^{\circ}C$. The activation energies obtained from the slopes were 0.53-0.87 eV for low-temperature region and 1.40-1.91 eV for high-temperature region. The electrical conductivities increased with increasing Mn mol% and $PO_2$, indicating that all the specimens were p-type semiconductors. At $PO_2$'s below $10^{-3}$ atm, the electrical conductivity was affected by the chemisorption of oxygen molecule in the temperature range of 660 to 850$^{\circ}C$. It is suggested that electron holes generated by oxygen incorporation into the oxide are charge carriers for the electrical conduction in the high-temperature region and the system includes ionic conduction owing to the diffusion of oxygen atoms in the low-temperature region.