Journal of Mechanical Science and Technology

The Korean Society of Mechanical Engineers (대한기계학회)
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Molecular Dynamics Study on Evaporation Process of Adherent Molecules on Surface by High Temperature Gas

  • Yang, Young-Joon (Department of Mechanical Engineering, Osaka University) ;
  • Osamu Kadosaka (Department of Mechanical Engineering, Osaka University) ;
  • Masahiko Shibahara (Department of Mechanical Engineering, Osaka University) ;
  • Masashi Katsuki (Department of Mechanical Engineering, Osaka University) ;
  • Kim, Si-Pom (Department of Mechanical Engineering, Dong-A University)
  • Published : 2004.12.01
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Abstract

Surface degreasing method with premixed flame is proposed as the removal method of adherent impurities on materials. Effects of adherent molecular thickness and surface potential energy on evaporation rate of adherent molecules and molecular evaporation mechanism were investigated and discussed in the present study. Evaporation processes of adherent molecules on surface molecules were simulated by the molecular dynamics method to understand thermal phenomena on evaporation processes of adherent molecules by using high temperature gas like burnt gas. The calculation system was composed of a high temperature gas region, an adherent molecular region and a surface molecular region. Both the thickness of adherent molecules and potential parameters affceted the evaporation rate of adherent molecules and evaporation mechanism in molecular scale.

Keywords

References

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