• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.4
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• pp.691-698
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• 2008

This paper describes a 3.3V 10 bit CMOS digital-to-analog converter with a divided architecture of a 7 MSB and a 3 LSB, which uses an optimal Thermal-to-Binary Decoding method with monotonicity, glitch energy. The output stage utilizes here implements a return-to-zero circuit to obtain the dynamic performance. Most of D/A converters in decoding circuit is complicated, occupies a large chip area. For these problems, this paper describes a D/A converter using an optimal Thermal-to-Binary Decoding method. the designed D/A converter using the CMOS n-well $0.35{\mu}m$ process0. The experimental data shows that the rise/fall time, settling time, and INL/DNL are 1.90ns/2.0ns, 12.79ns, and a less than ${\pm}2.5/{\pm}0.7\;LSB$, respectively. The power dissipation of the D/A converter with a single power supply of 3.3V is about 250mW.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Journal of IKEEE
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• v.2 no.2 s.3
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• pp.278-284
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• 1998

This paper describes a l0b CMOS A/D converter (ADC) for HDTV applications. The proposed ADC adopts a typical multi-step pipelined architecture. The proposed circuit design techniques are as fo1lows: A selective channel-length adjustment technique for a bias circuit minimizes the mismatch of the bias current due to the short channel effect by supply voltage variations. A power reduction technique for a high-speed two-stage operational amplifier decreases the power consumption of amplifiers with wide bandwidths by turning on and off bias currents in the suggested sequence. A typical capacitor scaling technique optimizes the chip area and power dissipation of the ADC. The proposed ADC is designed and fabricated in s 0.8 um double-poly double-metal n-well CMOS technology. The measured differential and integral nonlinearities of the prototype ADC show less than ${\pm}0.6LSB\;and\;{\pm}2.0LSB$, respectively. The typical ADC power consumption is 119 mW at 3 V with a 40 MHz sampling rate, and 320 mW at 5 V with a 50 MHz sampling rate.

• Journal of Navigation and Port Research
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• v.27 no.4
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• pp.443-447
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• 2003

In this work. using 0.2 GaAs modulation doped FET(MODFET), a high performance DBS downconverter MMIC was developed for direct broadcasting satellite (DBS) application. Without LNA, the downconverter MMIC showed a very low noise of 4.8 dB, which is lower by 3 dB than conventional ones. A low LO power of -10 dBm was required for the normal DBS operation of the downconverter MMIC. which reduced the power consumption via a removal of LO amplifier on MMIC. It required only a low power consumption of 175 mW, which is lower than 70 percent of conventional ones. The LO leakage power at IF output was suppressed to a lower level than 30 dBm, which removes a bulky LO rejection filter on a board. The fabricated chip, which include a mixer, If amplifiers. LO rejection filter, and active balun, exhibited a small size of $0.84{\times}0.9\textrm{mm}^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.2
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• pp.19-24
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• 2007

With recent advancement of high-speed, multi-gigabit data transmission capabilities, serial links have been more widely adopted in industry than parallel links. Since the parallel link design forces its transmitter to transmit both the data and the clock to the receiver at the same time, it leads to hardware's intricacy during high-speed data transmission, large power consumption, and high cost. Meanwhile, the serial links allows the transmitter to transmit data only with no synchronized clock information. For the purpose, clock and data recovery circuit becomes a very crucial key block. In this paper, a 5.4Gbps half-rate bang-bang CDR is designed for the applications of high-speed graphic DRAM interface. The CDR consists of a half-rate bang-bang phase detector, a current-mirror charge-pump, a 2nd-order loop filter, and a 4-stage differential ring-type VCO. The PD automatically retimes and demultiplexes the data, generating two 2.7Gb/s sequences. The proposed circuit is realized in 66㎚ CMOS process. With input pseudo-random bit sequences (PRBS) of $2^{13}-1$, the post-layout simulations show 10psRMS clock jitter and $40ps_{p-p}$ retimed data jitter characteristics, and also the power dissipation of 80mW from a single 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.6 s.348
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• pp.9-17
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• 2006

We proposed a new High-speed CMOS Level Up/Down Shifter circuits that can be used with Dynamic Voltage and Frequency Scaling(DVFS) algorithm, for low power system in the SoC(System-on-Chip). This circuit used to interface between the other voltage levels in each CMOS circuit boundary, or between multiple core voltage levels in a system bus. Proposed circuit have advantage that decrease speed attenuation and duty ratio distortion problems for interface. The level up/down shifter of the proposed circuit designed that operated from multi core voltages$(0.6\sim1.6V)$ to used voltage level for each IP at the 500MHz input frequency The proposed circuit supports level up shifting from the input voltage levels, that are standard I/O voltages 1.8V, 2.5V, 3.3V, to multiple core voltage levels in between of $0.6V\sim1.6V$, that are used internally in the system. And level down shifter reverse operated at 1Ghz input frequency for same condition. Simulations results are shown to verify the proposed function by Hspice simulation, with $0.6V\sim1.6V$ CMOS Process, $0.13{\mu}m$ IBM CMOS Process and $0.65{\mu}m$ CMOS model parameters. Moreover, it is researched delay time, power dissipation and duty ration distortion of the output voltage witch is proportional to the operating frequency for the proposed circuit.

• Structural Engineering and Mechanics
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• v.63 no.6
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• pp.735-742
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• 2017

Steel cables as the most important components are widely used in the certain types of structures such as cable-supported bridges, but the long-span structures may result in an increase in fatigue under high stress and corrosion of steel cables. The traditional steel cable is becoming a more evident hindrance. Fiber Reinforced Polymer (FRP) cables with lightweight, high-strength are widely used in civil engineering, but there is little research in vibrational characteristics of FRP cables, especially on the damping characteristic. This article studied the two methods to evaluate dynamical damping characteristic of basalt FRP(BFRP) and glass FRP(GFRP) cables. First, the vibration tests of the B/G FRP cables with different diameter and different cable force were executed. Second, the cables forces were calculated using dynamic strain, static strain and dynamic acceleration respectively, which were further compared with the measured force. Third, experimental modal damping of each cables was calculated by the half power point method, and was compared with the calculation by Rayleigh damping theory and energy dissipation damping theory. The results indicate that (1) The experimental damping of FRP cables decreases with the increase of cable force, and the trend of experimental damping changes is roughly similar with the theoretical damping. (2) The distribution of modal damping calculated by Rayleigh damping theory is closer to the experimental results, and the damping performance of GFRP cables is better than BFRP cables.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.4
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• pp.93-103
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• 2002

A new current mirror for high-accuracy current-mode signal processing and integrated circuit design was proposed. The current mirror adopts the technique of an adaptive feedback to reduce the input impedance and the output stage of regulated cascode current mirror to increase the output impedance. Simulation results show that the current mirror has input impedance of 0.9Ω, the output impedance of 415 MΩ, and current gain of 0.96 at the supply voltage Vcc=5V. The power dissipation is 1.5㎽. In order to certify the applicability of the proposed current mirror, a voltage-to-current converter using the current mirror is designed. Simulation results show that the converter has good agreement with theoretical equation and has three times better conversion characteristics when compared with voltage-to-current converter using Wilson current mirror.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.7 s.361
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• pp.37-44
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• 2007

A low-voltage high-linear bipolar OTA and its application to IF bandpass filter for GSM cellular telephone are presented. The OTA consists of a low-voltage linear transconductor, a translinear current gain cell, and three current mirrors. The bandpass filter is composed of two cascaded identical second-order bandpass filters, which consist of a resistor, a capacitor, and a grounded simulated inductor realized with two OTA's and a grounded capacitor. SPICE simulations using an 8 GHz bipolar transistor-array parameter show that the OTA with a transconductance of 1 mS exhibits a linearity error of less than ${\pm}2%$ over an input voltage range of ${\pm}0.65\;V$ at supply voltages of ${\pm}2.0\;V$. Temperature coefficient of the transconductance is less than $-90ppm/^{\circ}C$. The bandpass filter has a center frequency of 85 MHz and Q-factor of 80. Temperature coefficient of the center frequency is less than $-182ppm/^{\circ}C$. The power dissipation of the filter is 128 mW.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.98-107
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• 2013

This work describes a 13b 100 MS/s 0.13 um CMOS four-stage pipeline ADC for 3G communication systems. The proposed SHA-free ADC employs a range-scaling technique based on switched-capacitor circuits to properly handle a wide input range of $2V_{P-P}$ using a single on-chip reference of $1V_{P-P}$. The proposed range scaling makes the reference buffers keep a sufficient voltage headroom and doubles the offset tolerance of a latched comparator in the flash ADC1 with a doubled input range. A two-step reference selection technique in the back-end 5b flash ADC reduces both power dissipation and chip area by 50%. The prototype ADC in a 0.13 um CMOS demonstrates the measured differential and integral nonlinearities within 0.57 LSB and 0.99 LSB, respectively. The ADC shows a maximum signal-to-noise-and-distortion ratio of 64.6 dB and a maximum spurious-free dynamic range of 74.0 dB at 100 MS/s, respectively. The ADC with an active die area of 1.2 $mm^2$ consumes 145.6 mW including high-speed reference buffers and 91 mW excluding buffers at 100 MS/s and a 1.3 V supply voltage.