1 |
D. Kim, B. Lee, T.-I. Lee, S. Noh, C. Choe, S. Park, and M.-S. Kim, "Power cycling tests under driving ΔTj = 125 ℃ on the Cu clip bonded EV power module", Microelectron. Reliab., 138, 114652 (2022).
DOI
|
2 |
J. Seong, S. Park, M.K. Kim, J. Lim, H. Han, J. Jeon, and S.W. Yoon, "DBC-packaged inverter power module for integrated motor-inverter design used in 48 V mild hybrid starter-generator (MHSG) system", IEEE Trans. Veh. Technol., 68, 11704 (2019).
DOI
|
3 |
K. Sugiura, T. Iwashige, K. Tsuruta, C. Chen, S. Nagao, T. Funaki, and K. Suganuma, "Reliability evaluation of SiC power module with sintered Ag die-attach and stress-relaxation structure", IEEE Trans. Components, Packag. Manuf. Technol., 9, 609 (2019).
|
4 |
C. Chen, S. Nagao, K. Suganuma, J. Jiu, T. Sugahara, H. Zhang, T. Iwashige, K. Sugiura, and K. Tsuruta, "Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices", Acta Mater., 129, 41 (2017).
DOI
|
5 |
C. Oh, S. Nagao, T. Kunimune, and K. Suganuma, "Pressure-less wafer bonding by turning hillocks into abnormal grain growths in Ag films", Appl. Phys. Lett., 104, 161603 (2014).
DOI
|
6 |
D. Kim, C. Chen, S. Nagao, and K. Suganuma, "Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb-5Sn solder joint", J. Mater. Sci. Mater. Electron., 31, 587 (2020).
DOI
|
7 |
Z. Zhang, C. Chen, A. Suetake, M.C. Hsieh, A. Iwaki, and K. Suganuma, "Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste", Scr. Mater., 198, 113833 (2021).
DOI
|
8 |
C. Chen and K. Suganuma, "Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size", Mater. Des., 162, 311 (2019).
DOI
|
9 |
Y. Zhou, L. Xu, and S. Liu, "Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate", Microelectron. Eng., 136, 63 (2015).
DOI
|
10 |
T. Ishizaki, A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, and Y. Yamada, "Reliability of Cu nanoparticle joint for high temperature power electronics", Microelectron. Reliab., 54, 1867 (2014).
DOI
|
11 |
M.H. Roh, H. Nishikawa, S. Tsutsumi, N. Nishiwaki, K. Ito, K. Ishikawa, A. Katsuya, N. Kamada, and M. Saito, "Pressureless bonding by micro-sized silver particle paste for high-temperature electronic packaging", Mater. Trans., 57, 1209 (2016).
DOI
|
12 |
S. Sakamoto, S. Nagao, and K. Suganuma, "Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices", J. Mater. Sci. Mater. Electron., 24, 2593 (2013).
DOI
|
13 |
M. Wang, Y. Mei, W. Hu, X. Li, and G.Q. Lu, "Pressureless sintered-silver as die attachment for bonding Si and SiC chips on silver, gold, copper, and nickel metallization for power electronics packaging: the practice and science", IEEE J. Emerg. Sel. Top. Power Electron., 10, 2645 (2022).
DOI
|