• 전력전자학회논문지
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• 제25권5호
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• pp.412-419
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• 2020

In this study, a 70 W buck converter using GaN metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. This converter exhibits over 97 % efficiency, high power density, and 48 V-to-12 V/1.2 V/1 V (triple output). Three gate drivers and six GaN MOSFETs are placed in a 1 ㎠ area to enhance power density and heat dissipation capacity. The theoretical switching and conduction losses of the GaN MOSFETs are calculated. Inductances, capacitances, and resistances for the output filters of the three buck converters are determined to achieve the desired current, voltage ripples, and efficiency. An equivalent circuit model for the thermal analysis of the proposed triple-output buck converter is presented. The junction temperatures of the GaN MOSFETs are estimated using the thermal model. Circuit operation and temperature analysis are evaluated using a circuit simulation tool and the finite element analysis results. An experimental test bed is built to evaluate the proposed design. The estimated switch and heat sink temperatures coincide well with the measured results. The designed buck converter has 130 W/in³ power density and 97.6 % efficiency.

• Journal of Electrical Engineering and Technology
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• 제6권5호
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• pp.671-676
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• 2011

A multilayer square-type piezoelectric transformer with a hole at the center was investigated in this paper. Temperature distribution at the center was improved by using this construction, therefore increasing input voltage and output power. This model was simulated and investigated successfully by applying a finite element method (FEM) in ATILA software. An optimized structure was then fabricated, examined, and compared to the simulation results. Electrical characteristics, including output voltage and output power, were measured at different load resistances. The temperature distribution was also monitored using an infrared camera. The piezoelectric transformer operated at first radial vibration mode and a frequency area of 70 kHz. The 16 W output power was achieved in a three-layer transformer with 96% efficiency and $20^{\circ}C$ temperature rise from room temperature under 115 V driving voltage, 100 ${\Omega}$ matching load, $28{\times}28{\times}1.8mm$ size, and 2 mm hole diameter. With these square-type multilayer piezoelectric transformers, the temperature was concentrated around the hole and lower than in piezoelectric transformers without a hole.

• 대한설비공학회지:설비저널
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• 제17권2호
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• pp.131-139
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• 1988

The thermoacoustic oscillation induced in an air column with variable cross section area is investigated theoretically and experimentally. The onset condition of the oscillation is derived by equating the acoustic power production to the power dissipation. The power production at the heater is predicted by using the efficiency factor obtained by heat transfer analysis for a single wire in a uniform cross flow and considering the interference between heater wires. The power dissipation is estimated by measuring the attenuating coefficient from the pressure decay curve. The theoretical prediction to the onset condition of the oscillation is confirmed experimentally. The effect of the variation of the column cross section area on the onset condition is presented.

• 대한금속재료학회지
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• 제56권11호
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• pp.805-812
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• 2018

High pressure die casting is one of the precision casting methods. It is highly productivity and suitable for manufacturing components with complex shapes and accurate dimensions. Recently, there has been increasing demand for efficient heat dissipation components, to control the heat generated by devices, which directly affects the efficiency and life of the product. Die cast aluminum alloys with high thermal conductivity are especially needed for this application. In this study, the influence of elements added to the die cast aluminum alloy on its thermal conductivity was evaluated. The results showed that Mn remarkably deteriorated the thermal conductivity of the aluminum alloy. When Cu content was increased, the tensile strength of cast aluminum alloy increased, showing 1 wt% of Cu ensured the minimum mechanical properties of the cast aluminum. As Si content increased, the flow length of the alloy proportionally increased. The flow length of aluminum alloy containing 2 wt% Si was about 85% of that of the ALDC12 alloy. A heat dissipation component was successfully fabricated using an optimized composition of Al-1 wt%Cu-0.6 wt%Fe-2 wt%Si die casting alloy without surface cracks, which were turned out as intergranular cracking originated from the solidification contraction of the alloy with Si composition lower than 2 wt%.

• 한국정밀공학회지
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• 제32권2호
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• pp.219-227
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• 2015

A dehumidifier using a thermoelement has many advantages compare to a dehumidifier using compressor systems. However, it is crucial to optimize the performance of heat sink for improving heat dissipation problem on the heat generation part. In this study, we utilized computational fluid dynamics software to compare Nusselt number, temperature and system efficiency based on fin thickness, flow gap between fin and fin length. Moreover, slip flow on the boundary layer was applied for the further analysis. Our objective in this study is to suggest an optimal fin shape to improve heat transfer with the tendency of performance factor depending on change of the shapes. Our results on the optimization of fin shape and analysis of slip flow will be utilized to enhance the heat transfer in the heat sink which is important in the design of dehumidifier using a thermoelement.

• 대한기계학회논문집
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• 제11권2호
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• pp.253-261
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• 1987

본 논문에서는 이러한 점들을 보완하여 Fig.1에 도시한 Rijke 관에서 나선형 가열기에 의한 음향력의 발생량을 계산하고 기주진동을 일으키는데 필요한 가열량을 계산하고 기주진동을 일으키는데 필요한 가열량을 구하였다. 이론을 뒷받침하기 위 하여 실험을 하고 결과를 비교 검토하였다.

• 진공이야기
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• 제4권3호
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• 한국정밀공학회지
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• 제30권3호
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• pp.349-355
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• 2013

Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.

• 조명전기설비학회논문지
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• 제28권7호
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• 항공우주시스템공학회지
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• 제14권3호
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• pp.51-59
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• 2020

초소형 위성인 큐브위성의 경우 위성체의 제한적인 중량 및 부피를 고려하여 경량화 및 전기적 회로설계 측면에서 유리한 PCB 기반의 전개형 태양전지판이 폭넓게 적용되고 있으나, PCB의 낮은 두께 방향 열전도율로 인해 태양전지셀의 방열이 어려운 점이 있다. 본 논문에서 제안한 6U 큐브위성용 태양전지판은 PCB 기반의 태양전지판으로 제작되고, 판넬 외곽에 장착된 알루미늄 보강재 접속부에 열전도 패드가 적용된다. 따라서 판넬 전면부의 태양전지셀에서 방열면인 판넬 후면으로 열전달이 원활하도록 하여 PCB 적용에 따른 장점을 유지하면서도 방열성능을 극대화함으로서 태양전지셀 온도 하강에 따른 전력생성효율 향상이 가능한 장점을 갖는다. 본 연구에서 제안된 열전도 패드가 적용된 태양전지판의 열제어 측면에서의 유효성 입증을 위해 궤도 열해석을 통해 기존 PCB 태양전지판과 비교 분석을 실시하였다.