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http://dx.doi.org/10.6113/TKPE.2020.25.5.412

A High Efficiency, High Power-Density GaN-based Triple-Output 48V Buck Converter Design  

Lee, Sangmin (Dept. of Electrical & Computer Engineering, University of Seoul)
Lee, Seung-Hwan (Dept. of Electrical & Computer Engineering, University of Seoul)
Publication Information
The Transactions of the Korean Institute of Power Electronics / v.25, no.5, 2020 , pp. 412-419 More about this Journal
Abstract
In this study, a 70 W buck converter using GaN metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. This converter exhibits over 97 % efficiency, high power density, and 48 V-to-12 V/1.2 V/1 V (triple output). Three gate drivers and six GaN MOSFETs are placed in a 1 ㎠ area to enhance power density and heat dissipation capacity. The theoretical switching and conduction losses of the GaN MOSFETs are calculated. Inductances, capacitances, and resistances for the output filters of the three buck converters are determined to achieve the desired current, voltage ripples, and efficiency. An equivalent circuit model for the thermal analysis of the proposed triple-output buck converter is presented. The junction temperatures of the GaN MOSFETs are estimated using the thermal model. Circuit operation and temperature analysis are evaluated using a circuit simulation tool and the finite element analysis results. An experimental test bed is built to evaluate the proposed design. The estimated switch and heat sink temperatures coincide well with the measured results. The designed buck converter has 130 W/in3 power density and 97.6 % efficiency.
Keywords
GaN; Buck converter; PMIC (Power Management Integrated Circuit);
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1 S. Webb and Y. Liu, "A zero inductor-voltage 48V to 12V / 70A converter for data centers with 99.1% peak efficiency and 2.5kW / power density," in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 1858-1865, 2020.
2 M. H. Ahmed, F. C. Lee, and Q. Li, "LLC converter with integrated magnetics application for 48V rack architecture in future data centers," in IEEE Conference on Power Electronics and Renewable Energy, pp. 437-443, 2019.
3 O. Zambetti, M. Colombo, S. D'Angelo, S. Saggini, and R. Rizzolatti, "48V to 12V isolated resonant converter with digital controller," in IEEE Appl. Power Electron. Conf. Expo. (APEC), pp. 315-321, Mar. 2017.
4 K. Hata, Y. Yamauchi, T. Sai, T. Sakurai, and M. Takamiya, "48V-to-12V dual-path hybrid DC-DC converter," in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 2279-2284, 2020.
5 M. Choi and D. K. Jeong, "A 92.8%-peak-efficiency 60A 48V-to-1V 3-level half-bridge DC-DC converter with balanced voltage on a flying capacitor," in 2020 IEEE International Solid-State Circuits Conference (ISSCC), pp. 296-298, Feb. 2020.
6 Efficient Power Conversion, "EPC2045-enhanced mode power transistor," EPC2045 datasheet, Mar. 2020.
7 M. Salato, "Re-architecting 48V power systems with a novel non-isolated bus converter," in 2015 IEEE International Telecommunications Energy Conference (INTELEC), pp. 1-4, Oct. 2016.
8 R. Das and H. P. Le, "A regulated 48V-to-1V/100A 90.9%-efficient hybrid converter for POL applications in data centers and telecommunication systems," in 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 1997-2001, 2019.
9 Z. Yu et al., "An 800MHz 320mW 16-core processor with message-passing and shared-memory inter-core communication mechanisms," in 2012 IEEE International Solid-State Circuits Conference, pp. 64-65, 2012.
10 Texas Instruments, "LM5113 5A, 100V half-bridge gate driver for enhancement mode GaN FETs," LM5113 Datasheet, Apr. 2013.
11 R. W. Erickson and D. Maksimovic, Fundamentals of power electronics, 2nd ed. New York, USA: Springer-Verlag, 2001.
12 R. K. Shah and D. P. Sekuli, Fundamentals of heat exchanger design, New Jersey, USA: John Wiley & Sons, 2003.
13 T. Yang et al., "An integrated liquid metal thermal switch for active thermal management of electronics," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 12, pp. 2341-2351, Dec. 2019.   DOI