Browse > Article
http://dx.doi.org/10.7736/KSPE.2013.30.3.349

A Study on Manufacturing Processes of Street-lighting System using COH LED Package  

Lee, Jong Hang (Department of Mechanical Engineering, Korea Polytechnic Univ.)
Yang, Keun Ju (COSMOIN Ltd.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.30, no.3, 2013 , pp. 349-355 More about this Journal
Abstract
Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.
Keywords
Street-lighting; LED; COH Package; Manufacturing Processes; Problem and Solution;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 Korea Agency for Technology and Standards, "LED Luminaires for Road and Street Lighting-Safety and Performance Requirements," KSC 7658, 2009.
2 Yang, K. J. and Lee, J. H., "A Study on Manufacturing Processes of LED Street-lighting System," Proc. of KSMTE Spring Conference, pp. 421-422, 2012.
3 Yang, K. J. and Lee, J. H., "Final Report of Business for Academic-industrial Cooperative Establishments," SMBA, pp. 25-49, 2012.
4 Huber, R., "Thermal management of golden Dragon LED," Osram, Opto Semiconductors, Application Note, pp. 1-11, 2008.
5 Hong, D. W., "A Study on High Power LED Lamp Structures," Korean Journal of Optics and Photonics, Vol. 21, No. 3, pp. 118-122, 2010.   과학기술학회마을   DOI   ScienceOn
6 Lee, K. S., Kim, J. W., Yoon, D. H., Kwon, Y. N., and Jang, S. P., "Thermal Analysis of 0.3 W Single-chip LED Packages," Proc. of KSPE Spring Conference, pp. 1117-1118, 2010.   과학기술학회마을
7 Lee, M. H. and Kim, Y. J., "Structural Design of Metal PCB and Thermal Analysis Improving the Thermal Dissipation of LED Lighting," Proc. of KSPE Spring Conference, pp. 515-516, 2010.   과학기술학회마을
8 Kang, J. H., "Optimum Design of Heat Sink Module for LED Lamp," Proc. of KSPE Spring Conference, pp. 421-422, 2010.
9 Jung, T. S. and Kang, H. K., "Evaluation on the Cooling Performance to Design Heat sinks for LED lightings," J. Korean Soc. Precis. Eng., Vol. 29, No. 7, pp. 778-784, 2012.   과학기술학회마을   DOI   ScienceOn