• Title/Summary/Keyword: Heat dissipation efficiency

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A High Efficiency, High Power-Density GaN-based Triple-Output 48V Buck Converter Design (GaN MOSFET을 이용한 고밀도, 고효율 48V 버스용 3-출력 Buck Converter 설계)

  • Lee, Sangmin;Lee, Seung-Hwan
    • The Transactions of the Korean Institute of Power Electronics
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    • v.25 no.5
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    • pp.412-419
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    • 2020
  • In this study, a 70 W buck converter using GaN metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. This converter exhibits over 97 % efficiency, high power density, and 48 V-to-12 V/1.2 V/1 V (triple output). Three gate drivers and six GaN MOSFETs are placed in a 1 ㎠ area to enhance power density and heat dissipation capacity. The theoretical switching and conduction losses of the GaN MOSFETs are calculated. Inductances, capacitances, and resistances for the output filters of the three buck converters are determined to achieve the desired current, voltage ripples, and efficiency. An equivalent circuit model for the thermal analysis of the proposed triple-output buck converter is presented. The junction temperatures of the GaN MOSFETs are estimated using the thermal model. Circuit operation and temperature analysis are evaluated using a circuit simulation tool and the finite element analysis results. An experimental test bed is built to evaluate the proposed design. The estimated switch and heat sink temperatures coincide well with the measured results. The designed buck converter has 130 W/in3 power density and 97.6 % efficiency.

Modeling and Investigation of Multilayer Piezoelectric Transformer with a Central Hole for Heat Dissipation

  • Thang, Vo Viet;Kim, In-Sung;Jeong, Soon-Jong;Kim, Min-Soo;Song, Jae-Sung
    • Journal of Electrical Engineering and Technology
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    • v.6 no.5
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    • pp.671-676
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    • 2011
  • A multilayer square-type piezoelectric transformer with a hole at the center was investigated in this paper. Temperature distribution at the center was improved by using this construction, therefore increasing input voltage and output power. This model was simulated and investigated successfully by applying a finite element method (FEM) in ATILA software. An optimized structure was then fabricated, examined, and compared to the simulation results. Electrical characteristics, including output voltage and output power, were measured at different load resistances. The temperature distribution was also monitored using an infrared camera. The piezoelectric transformer operated at first radial vibration mode and a frequency area of 70 kHz. The 16 W output power was achieved in a three-layer transformer with 96% efficiency and $20^{\circ}C$ temperature rise from room temperature under 115 V driving voltage, 100 ${\Omega}$ matching load, $28{\times}28{\times}1.8mm$ size, and 2 mm hole diameter. With these square-type multilayer piezoelectric transformers, the temperature was concentrated around the hole and lower than in piezoelectric transformers without a hole.

A Study on the Thermoacoustic Oscillation of an Air Column with Variable Cross Section Area (단면 변화가 있는 기주의 열음향진동에 관한 연구)

  • Kwon, Young Pil;Hong, Ha Pyo
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.17 no.2
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    • pp.131-139
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    • 1988
  • The thermoacoustic oscillation induced in an air column with variable cross section area is investigated theoretically and experimentally. The onset condition of the oscillation is derived by equating the acoustic power production to the power dissipation. The power production at the heater is predicted by using the efficiency factor obtained by heat transfer analysis for a single wire in a uniform cross flow and considering the interference between heater wires. The power dissipation is estimated by measuring the attenuating coefficient from the pressure decay curve. The theoretical prediction to the onset condition of the oscillation is confirmed experimentally. The effect of the variation of the column cross section area on the onset condition is presented.

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Effect of Alloying Elements on the Thermal Conductivity and Casting Characteristics of Aluminum Alloys in High Pressure Die Casting (고압 다이캐스팅용 알루미늄 합금의 열전도성 및 주조성에 미치는 첨가원소의 영향)

  • Kim, Cheol-Woo;Kim, Young-Chan;Kim, Jung-Han;Cho, Jae-Ik;Oh, Min-Suk
    • Korean Journal of Metals and Materials
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    • v.56 no.11
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    • pp.805-812
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    • 2018
  • High pressure die casting is one of the precision casting methods. It is highly productivity and suitable for manufacturing components with complex shapes and accurate dimensions. Recently, there has been increasing demand for efficient heat dissipation components, to control the heat generated by devices, which directly affects the efficiency and life of the product. Die cast aluminum alloys with high thermal conductivity are especially needed for this application. In this study, the influence of elements added to the die cast aluminum alloy on its thermal conductivity was evaluated. The results showed that Mn remarkably deteriorated the thermal conductivity of the aluminum alloy. When Cu content was increased, the tensile strength of cast aluminum alloy increased, showing 1 wt% of Cu ensured the minimum mechanical properties of the cast aluminum. As Si content increased, the flow length of the alloy proportionally increased. The flow length of aluminum alloy containing 2 wt% Si was about 85% of that of the ALDC12 alloy. A heat dissipation component was successfully fabricated using an optimized composition of Al-1 wt%Cu-0.6 wt%Fe-2 wt%Si die casting alloy without surface cracks, which were turned out as intergranular cracking originated from the solidification contraction of the alloy with Si composition lower than 2 wt%.

Optimal Design of a Plate-Fin Heat Sink with Slip Flow (경계면 슬립이 적용되는 Plate-Fin Heat Sink 의 최적형상 설계)

  • Park, Boo Seong;Park, Hyun Jin;Kim, Bo Hung
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.2
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    • pp.219-227
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    • 2015
  • A dehumidifier using a thermoelement has many advantages compare to a dehumidifier using compressor systems. However, it is crucial to optimize the performance of heat sink for improving heat dissipation problem on the heat generation part. In this study, we utilized computational fluid dynamics software to compare Nusselt number, temperature and system efficiency based on fin thickness, flow gap between fin and fin length. Moreover, slip flow on the boundary layer was applied for the further analysis. Our objective in this study is to suggest an optimal fin shape to improve heat transfer with the tendency of performance factor depending on change of the shapes. Our results on the optimization of fin shape and analysis of slip flow will be utilized to enhance the heat transfer in the heat sink which is important in the design of dehumidifier using a thermoelement.

A Study on the Thermoacoustic Oscillation of an Air Column (기주의 열음향진동에 관한 연구)

  • 권영필;이병호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.11 no.2
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    • pp.253-261
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    • 1987
  • Thermoacoustic oscillation of an air column induced by heated wires is investigated analytically and experimentally. Acoustic power generation from a single heater wire is estimated based on the result of heat transfer analysis and expressed in terms of the efficiency factor indicating the conversion efficiency from heat to acoustic energy. It is shown that the efficiency factor becomes maximum when the wire radius is the order of the coustic boundary layer thickness and the flow velocity is close to the thermal diffusion velocity. Onset condition of the column oscillation is obtained by equating the acoustic power generation at the heater to the power loss due to thermoviscous dissipation at the tube wall and the convection and radiationloss at the open ends of the tube. In estimating the acoustic power generation, the heater is treated as a stretched single wire by correcting the flow velocity to take into account the interactions between adjacent heater wires. Experiment is performed by using a spiral heater of 1mm diameter in an air column of 37mm diameter. The heat input to drive the oscillation is measured and compared with the theoretical prediction. A good agreement is found between the theory and experiment, which is regarded as a substantial verification of the present analysis.

The World's Thinnest Graphene Light Source (세상에서 가장 얇은 그래핀 발광 소자)

  • Kim, Young Duck
    • Vacuum Magazine
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    • v.4 no.3
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    • pp.16-20
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    • 2017
  • Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

A Study on Manufacturing Processes of Street-lighting System using COH LED Package (COH형 LED 패키지를 이용한 가로등 생산공정에 관한 연구)

  • Lee, Jong Hang;Yang, Keun Ju
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.3
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    • pp.349-355
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    • 2013
  • Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.

Operating Characteristics of LED Package Heat-sink with Multi-Pin's (멀티-핀을 갖는 LED 패키지 방열장치의 동작특성)

  • Choi, Hoon;Han, Sang-Bo;Park, Jae-Youn
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.7
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    • pp.1-12
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    • 2014
  • This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

Thermal Characteristics Investigation of 6U CubeSat's Deployable Solar Panel Employing Thermal Gap Pad (열전도 패드가 적용된 6U 큐브위성용 태양전지판의 열적 특성 분석)

  • Kim, Hye-In;Kim, Hong-Rae;Oh, Hyun-Ung
    • Journal of Aerospace System Engineering
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    • v.14 no.3
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    • pp.51-59
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    • 2020
  • In the case of cubesat, a PCB-based deployable solar panel advantageous in terms of weight reduction and electrical circuit design is widely used considering the limited weight and volume of satellites. However, because of the low thermal conductivity of PCB, there is a limit relative to heat dissipation. In this paper, the thermal gap pad is applied to the contact between the PCB-based solar panel and the aluminum stiffener mounted on the outside of the panel. Thus, the heat transfer from the solar cell to the rear side of the panel is facilitated. It maximizes the heat dissipation performance while maintaining the merits of PCB panel, and thus, it is possible to improve the power generation efficiency from reducing the temperature of the solar cell. The effectiveness of the thermal design of the 6U cubesat's deployable solar panel using the thermal gap pad has been verified through on-orbit thermal analysis based on the results, compared with the conventional PCB-based solar panel.