• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.13-14
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• 2002

우물두께가 각각 1.5, 3.0, 4.5, 6.0 nm이고 장벽두께가 7.5 nm로 일정한 10 주기의 In0.15Ga0.8SN/GaN 다중 양자우물 구조(MQW)의 구조적 특성변화를 HRXRD(high resolution X-ray diffraction)를 이용하여 조사하였다. 구조적 특성변화를 살펴보기 위해 GaN (0002) 회절면의 ω/2θ-scan과 ω-scan 그리고 GaN (10-15) 역격자점 주위의 산란강도 분포도를 측정하였다. 우물두께가 증가할수록 시료의 평균변형률이 증가하였고, 우물두께가 1.5, 3.0, 4.5 nm인 MQW는 GaN 에피층과 격자정합을 이루며 성장된 반면 6.0 nm인 시료에서는 격자이완이 나타나 결정성이 저하된 것을 확인할 수 있었다. (그림 1) 따라서 본 연구에서 사용한 시료에서 6.0 nm의 우물두께가 격자이완의 임계두께임을 알 수 있었다. PL(photoluminescence) 스펙트럼 결과를 통하여 6.0 nm 우물두께의 시료가 다른 시료에 비하여 상대발광강도가 낮아지는 것을 관찰하였으며 이것은 XRD를 이용한 시료의 결정성 변화와 잘 일치하였다. (그림 2) 따라서 PL 발광강도는 격자이완에 의하여 생성된 결함에 의하여 영향을 받는 것을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.2
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• pp.108-111
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• 2011

The semiconducting material of ZnO in II-VI group was well known as its good application for photo electronics, chemical sensors and field effect transistors due to the remarkable optical properties with wide energy band gap and great ionic reactivities. Up to now the growth of a good quality of ZnO film has been issued for better performances. Even though there were many deposition methods for making ZnO films, pulse laser deposition methods have been preferred for high crystalline films. In this report, the ZnO film was also created by pulsed laser deposition technique which also showed high crystalinity. By controlling several factors when deposited, it was investigated that the optimal condition for ZnO film formation. Mainly, oxygen partial pressures and growth temperatures were changed when ZnO films were synthesized and followed the characterization by HRXRD and AFM.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.16-22
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• 2008

We fabricated thermally-evaporated 10 nm-Ni/30 nm and 70 nm Poly-Si/200 nm-$SiO_2/Si$ structures to investigate the thermal stability of nickel silicides formed by rapid thermal annealing(RTA) of the temperature of $300{\sim}1100^{\circ}C$ for 40 seconds. We employed for a four-point tester, field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), high resolution X-ray diffraction(HRIXRD), and scanning probe microscope(SPM) in order to examine the sheet resistance, in-plane microstructure, cross-sectional microstructure evolution, phase transformation, and surface roughness, respectively. The silicide on 30 nm polysilicon substrate was stable at temperature up to $900^{\circ}C$, while the one on 70 nm substrate showed the conventional $NiSi_2$ transformation temperature of $700^{\circ}C$. The HRXRD result also supported the existence of NiSi-phase up to $900^{\circ}C$ for the Ni silicide on the 30 nm polysilicon substrate. FE-SEM and TEM confirmed that 40 nm thick uniform silicide layer and island-like agglomerated silicide phase of $1{\mu}m$ pitch without residual polysilicon were formed on 30 nm polysilicon substrate at $700^{\circ}C\;and\;1000^{\circ}C$, respectively. All silicides were nonuniform and formed on top of the residual polysilicon for 70 nm polysilicon substrates. Through SPM analysis, we confirmed the surface roughness was below 17 nm, which implied the advantage on FUSI gate of CMOS process. Our results imply that we may tune the thermal stability of nickel monosilicide by reducing the height of polysilicon gate.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.179-185
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• 2009

We fabricated thermally evaporated 30 nm-Ni/(20 nm or 60 nm)a-Si:H/Si films to investigate the energy-saving property of silicides formed by rapid thermal annealing (RTA) at temperatures of $350^{\circ}C$, $450^{\circ}C$, $550^{\circ}C$, and $600^{\circ}C$ for 40 seconds. A transmission electron microscope (TEM) and a high resolution X-ray diffractometer (HRXRD) were used to determine the cross-sectional microstructure and phase changes. A UVVIS-NIR and FT-IR (Fourier transform infrared spectroscopy) were employed for near-IR and middle-IR absorbance. Through TEM and HRXRD analysis, for the nickel silicide formed at low temperatures below $450^{\circ}C$, we confirmed columnar-shaped structures with thicknesses of $20{\sim}30\;nm$ that had ${\delta}-Ni^2Si$ phases. Regarding the nickel silicide formed at high temperatures above $550^{\circ}C$, we confirmed that the nickel silicide had more than 50 nm-thick columnar-shaped structures with a $Ni_{31}Si_{12}$ phase. Through UV-VIS-NIR analysis, nickel silicide showed almost the same absorbance in the near IR region as well as ITO. However, in the middle IR region, the nickel silicides with low temperature showed similar absorbance to those from high temperature silicidation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.151-151
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• 2007

최근에 에피 성장된 ZnO는 UV-LED, 화학적-바이오센서와 투명전도 전극에 많은 관심을 받고 있다. 고 품질의 ZnO는 Metal-organic chemical vapor deposition(MOCVD), Pulsed laser deposition(PLD), molecular beam epitaxy(MBE), 그리고 마그네트론 스퍼터링법에 의해 성장이 이루어지고 있다. 대부분의 ZnO는 사파이어, 싫리콘과 같은 이종 기판 위에 성장되고 있으며, Heteroepitaxy로 성장된 ZnO 박막은 기판과 박막사이의 격자상수, 열팽창계수 차이로 인해 높은 결함 밀도를 보이고 있다. 이러한 문제점은 광전자 소자 응용에 있어 여러 가지 문제점을 야기 시킨다. 이와 같은 문제점을 해결하기 위해 박막과 기판사이에 저온 버퍼층을 사용하거나 같은 물질의 버퍼층을 사용하여 결할 밀도를 감소시키고, 높은 결정성을 가진 ZnO 박막을 성장시킨 결과들이 많이 보고되어지고 있다. 본 연구에서는 마그네트론 스퍼터링 법으로 저온 버퍼층 성장 없이 성장온도 만을 달리 하여 고품질의 ZnO 박막을 성장시켰다. ZnO 박막은 c-sapphire 기판위에 ZnO(99.9999%)의 타겟을 사용하여 $600{\sim}800^{\circ}C$ 온도에서 성장시켰고, 스퍼터링 가스로는 아르곤과 산소를 2:1 비율로 혼합하여 15mtorr의 압력에서 성장하였다. 이렇게 성장시킨 ZnO 박막은 Transmission Electron Microscopy (TEM), High-Resolution X-ray Diffraction (HRXRD), Low-temperature PL, 그리고 Atomic Force Microscopy (AFM)로 특성을 분석 하였다. ZnO 박막은 HRXRD (002) 면의 $\omega$-rocking curve운석 결과, $0.083^{\circ}$의 작은 FEHM을 얻었고, (102) 면의 $\varphi$-sacn을 통해 온도가 증가함에 따라 향상된 6-fold을 확인함으로새 에피성장됨을 알 수 있었다. 또한 TEM분석을 통해 $800^{\circ}C$에서 성장된 박막은 $6.7{\times}10^9/cm^2$의 전위밀도를 얻을 수 있었다.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.321-328
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• 2011

The 30 nm-thick Ni layers was deposited on a flexible polyimide substrate with an e-beam evaporation. Subsequently, we deposited a Si layer using a catalytic CVD (Cat-CVD) in a hydride amorphous silicon (${\alpha}$-Si:H) process of $T_{s}=180^{\circ}C$ with varying thicknesses of 55, 75, 145, and 220 nm. The sheet resistance, phase, degree of the crystallization, microstructure, composition, and surface roughness were measured by a four-point probe, HRXRD, micro-Raman spectroscopy, FE-SEM, TEM, AES, and SPM. We confirmed that our newly proposed Cat-CVD process simultaneously formed both NiSi and crystallized Si without additional annealing. The NiSi showed low sheet resistance of < $13{\Omega}$□, while carbon (C) diffused from the substrate led the resistance fluctuation with silicon deposition thickness. HRXRD and micro-Raman analysis also supported the existence of NiSi and crystallized (>66%) Si layers. TEM analysis showed uniform NiSi and silicon layers, and the thickness of the NiSi increased as Si deposition time increased. Based on the AES depth profiling, we confirmed that the carbon from the polyimide substrate diffused into the NiSi and Si layers during the Cat-CVD, which caused a pile-up of C at the interface. This carbon diffusion might lessen NiSi formation and increase the resistance of the NiSi.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.528-537
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• 2008

60 nm and 20 nm thick hydrogenated amorphous silicon(a-Si:H) layers were deposited on 200 nm $SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by an e-beam evaporator. Finally, 30 nm-Ni/(60 nm and 20 nm) a-Si:H/200 nm-$SiO_2$/single-Si structures were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 40 sec. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy(FE-SEM), transmission electron microscopy(TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide from the 60 nm a-Si:H substrate showed low sheet resistance from $400^{\circ}C$ which is compatible for low temperature processing. The nickel silicide from 20 nm a-Si:H substrate showed low resistance from $300^{\circ}C$. Through HRXRD analysis, the phase transformation occurred with silicidation temperature without a-Si:H layer thickness dependence. With the result of FE-SEM and TEM, the nickel silicides from 60 nm a-Si:H substrate showed the microstructure of 60 nm-thick silicide layers with the residual silicon regime, while the ones from 20 nm a-Si:H formed 20 nm-thick uniform silicide layers. In case of SPM, the RMS value of nickel silicide layers increased as the silicidation temperature increased. Especially, the nickel silicide from 20 nm a-Si:H substrate showed the lowest RMS value of 0.75 at $300^{\circ}C$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.177-177
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• 2003

GaN 에피층을 성장에 있어서 가장 문제가 되는 통과 전위를 줄이기 위한 방법 이 여러 가지로 진행되고 있다. 그중에서도 PE(Pendeo Epitaxy) 방법으로 많은 연구가 이루어 졌는데 이경우에 열적인 요인으로 인해 발생하는 스트레스와 마스크 물질로 인하여 그러한 물질들이 서로 반응하거나 성장시 악영향을 끼쳐 결국은 성장되는 GaN층의 결정학적 기울기의 원인이 된다는 것이 밝혀졌다. 따라서 이러한 마스크를 제거하여 PE GaN에서 마스크와 수평으로 자라나는 GaN층사이의 간섭이 사라져서 결정학적 기울기가 감소시킬 수 있게 되었다. 이 연구에서 우리는 위에서 언급했던 마스크를 사용하지 않은 PE GaN의 미세구조적인 특성과 전위들의 거동을 투과전자현미경, 주사 전자현미경 그리고 HRXRD(High Resolution X-Ray diffraction)결과를 이용하여 살펴보았다.

• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.125-129
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• 2016

In this study, we have investigated a high-temperature AlN nucleation layer and AlGaN epilayers on c-plane sapphire substrate by low-pressure metal-organic chemical vapor deposition (LP-MOCVD). High resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM), scanning electron microscope (SEM) and Raman scattering measurements have been exploited to study the crystal quality, surface morphology, and residual strain of the HT-AlN nucleation layer. These analyses reveal that the insertion of an LT-AlN nucleation layer can improve the crystal quality, smooth the surface morphology of the HT-AlN nucleation layer and further reduce the threading dislocation density of AlGaN epifilms. The mechanism of inserting an LT-AlN nucleation layer to enhance the optical properties of HT-AlN nucleation layer and AlGaN epifilm are discussed from the viewpoint of driving force of reaction in this paper.

• Electronic Materials Letters
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• v.14 no.6
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• pp.784-792
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• 2018

In this letter, a standard deviation based optimization technique has been applied on High Resolution X-ray Diffraction symmetric and asymmetric scan results to accurately determine the Aluminum molar fraction and lattice relaxation of Molecular Beam Epitaxy grown compositionally graded Aluminum Gallium Nitride (AlGaN)/Aluminum Nitride/Gallium Nitride (GaN) heterostructures. Mathews-Blakeslee critical thickness model has been applied in an alternative way to determine the partially relaxed AlGaN epilayer thicknesses. The coupling coefficient determination has been presented in a different perspective involving sample tilt method by off set between the asymmetric planes of GaN and AlGaN. Sample tilt is further increased to determine mosaic tilt ranging between $0.01^{\circ}$ and $0.1^{\circ}$.