• 제목/요약/키워드: Gate stack engineering

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Analytical Modeling and Simulation for Dual Metal Gate Stack Architecture (DMGSA) Cylindrical/Surrounded Gate MOSFET

  • Ghosh, Pujarini;Haldar, Subhasis;Gupta, R.S.;Gupta, Mridula
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권4호
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    • pp.458-466
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    • 2012
  • A Dual metal gate stack cylindrical/ surrounded gate MOSFET (DMGSA CGT/SGT MOSFET) has been proposed and an analytical model has been developed to examine the impact of this structure in suppressing short channel effects and in enhancing the device performance. It is demonstrated that incorporation of gate stack along with dual metal gate architecture results in improvement in short channel immunity. It is also examined that for DMGSA CGT/SGT the minimum surface potential in the channel reduces, resulting increase in electron velocity and thereby improving the carrier transport efficiency. Furthermore, the device has been analyzed at different bias point for both single material gate stack architecture (SMGSA) and dual material gate stack architecture (DMGSA) and found that DMGSA has superior characteristics as compared to SMGSA devices. The analytical results obtained from the proposed model agree well with the simulated results obtained from 3D ATLAS Device simulator.

EPD time delay in etching of stack down WSix gate in DPS+ poly chamber

  • Ko, Yong Deuk;Chun, Hui-Gon
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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    • pp.130-136
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    • 2002
  • Device makers want to make higher density chips as devices shrink, especially WSix poly stack down is one of the key issues. However, EPD (End Point Detection) time delay was happened in DPS+ poly chamber which is a barrier to achieve device shrink because EPD time delay killed test pattern and next generation device. To investigate the EPD time delay, a test was done with patterned wafers. This experimental was carried out combined with OES(Optical Emission Spectroscopy) and SEM (Scanning Electron Microscopy). OES was used to find corrected wavelength in WSix stack down gate etching. SEM was used to confirm WSix gate profile and gate oxide damage. Through the experiment, a new wavelength (252nm) line of plasma is selected for DPS+ chamber to call correct EPD in WSix stack down gate etching for current device and next generation device.

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Analytical Model of Double Gate MOSFET for High Sensitivity Low Power Photosensor

  • Gautam, Rajni;Saxena, Manoj;Gupta, R.S.;Gupta, Mridula
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권5호
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    • pp.500-510
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    • 2013
  • In this paper, a high-sensitivity low power photodetector using double gate (DG) MOSFET is proposed for the first time using change in subthreshold current under illumination as the sensitivity parameter. An analytical model for optically controlled double gate (DG) MOSFET under illumination is developed to demonstrate that it can be used as high sensitivity photodetector and simulation results are used to validate the analytical results. Sensitivity of the device is compared with conventional bulk MOSFET and results show that DG MOSFET has higher sensitivity over bulk MOSFET due to much lower dark current obtained in DG MOSFET because of its effective gate control. Impact of the silicon film thickness and gate stack engineering is also studied on sensitivity.

A Study of SCEs and Analog FOMs in GS-DG-MOSFET with Lateral Asymmetric Channel Doping

  • Sahu, P.K.;Mohapatra, S.K.;Pradhan, K.P.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권6호
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    • pp.647-654
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    • 2013
  • The design and analysis of analog circuit application on CMOS technology are a challenge in deep sub-micrometer process. This paper is a study on the performance value of Double Gate (DG) Metal Oxide Semiconductor Field Effect Transistor (MOSFET) with Gate Stack and the channel engineering Single Halo (SH), Double Halo (DH). Four different structures have been analysed keeping channel length constant. The short channel parameters and different sub-threshold analog figures of merit (FOMs) are analysed. This work extensively provides the device structures which may be applicable for high speed switching and low power consumption application.

Short Channel Analytical Model for High Electron Mobility Transistor to Obtain Higher Cut-Off Frequency Maintaining the Reliability of the Device

  • Gupta, Ritesh;Aggarwal, Sandeep Kumar;Gupta, Mridula;Gupta, R.S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권2호
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    • pp.120-131
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    • 2007
  • A comprehensive short channel analytical model has been proposed for High Electron Mobility Transistor (HEMT) to obtain higher cut-off frequency maintaining the reliability of the device. The model has been proposed to consider generalized doping variation in the directions perpendicular to and along the channel. The effect of field plates and different gate-insulator geometry (T-gate, etc) have been considered by dividing the area between gate and the high band gap semiconductor into different regions along the channel having different insulator and metal combinations of different thicknesses and work function with the possibility that metal is in direct contact with the high band gap semiconductor. The variation obtained by gate-insulator geometry and field plates in the field and channel potential can be produced by varying doping concentration, metal work-function and gate-stack structures along the channel. The results so obtained for normal device structure have been compared with previous proposed model and numerical method (finite difference method) to prove the validity of the model.

Turn-on Loss Reduction for High Voltage Power Stack Using Active Gate Driving Method

  • Kim, Jin-Hong;Park, Joon Sung;Gu, Bon-Gwan;Won, Chung-Yuen
    • Journal of Electrical Engineering and Technology
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    • 제12권2호
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    • pp.632-642
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    • 2017
  • This paper presents an improved approach towards reducing the switching loss of insulated gate bipolar transistors (IGBTs) for a medium-capacity-class power conditioning system (PCS). In order to improve the switching performance, the switching operation is analyzed, and based on this analysis, an improved switching method that reduces the switching time and switching loss is proposed. Compared to a conventional gate drive scheme, the switching loss, switching time, and delay are improved in the proposed gate driving method. The performance of the proposed gate driving method is verified through several experiments.

Stack 기술을 이용한 향상된 감내 특성을 갖는 SCR 기반 ESD 보호 소자에 관한 연구 (A Study on SCR-Based ESD Protection Device with Improved Robustness Using Stack Technology)

  • 곽재창
    • 전기전자학회논문지
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    • 제23권3호
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    • pp.1015-1019
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    • 2019
  • 본 논문에서는 트리거 전압과 감내 특성을 개선시키기 위해 HHVSCR의 구조적 변경을 바탕으로 Stack 기술을 적용한 새로운 ESD 보호 소자를 제안한다. 우선 HHVSCR과 제안된 ESD 보호 소자를 비교하여 트리거 전압과 홀딩 전압, 감내 특성을 확인하였고 게이트 길이에 대한 변수를 추가하였다. 마지막으로, 제안된 ESD 보호 소자와 Stack을 적용한 소자를 비교하여 트리거 전압과 홀딩 전압, 감내 특성을 비교하였다.

Device and Circuit Performance Issues with Deeply Scaled High-K MOS Transistors

  • Rao, V. Ramgopal;Mohapatra, Nihar R.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제4권1호
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    • pp.52-62
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    • 2004
  • In this paper we look at the effect of Fringe-Enhanced-Barrier-lowering (FEBL) for high-K dielectric MOSFETs and the dependence of FEBL on various technological parameters (spacer dielectrics, overlap length, dielectric stack, S/D junction depth and dielectric thickness). We show that FEBL needs to be contained in order to maintain the performance advantage with scaled high-K dielectric MOSFETs. The degradation in high-K dielectric MOSFETs is also identified as due to the additional coupling between the drain-to-source that occurs through the gate insulator, when the gate dielectric constant is significantly higher than the silicon dielectric constant. The technology parameters required to minimize the coupling through the high-K dielectric are identified. It is also shown that gate dielectric stack with a low-K material as bottom layer (very thin $SiO_2$ or oxy-nitride) will be helpful in minimizing FEBL. The circuit performance issues with high-K MOS transistors are also analyzed in this paper. An optimum range of values for the dielectric constant has been identified from the delay and the energy dissipation point of view. The dependence of the optimum K for different technology generations has been discussed. Circuit models for the parasitic capacitances in high-K transistors, by incorporating the fringing effects, have been presented.

제수문 영향 및 액비시용 증가에 따른 농업소유역에서의 비점오염원 특성 평가 (Assessing Nonpoint Sources Pollution Affected by Regulating Gate and Liquid Manure Application in Small Agricultural Watershed)

  • 송재도;장태일;손재권
    • 한국농공학회논문집
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    • 제58권6호
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    • pp.31-38
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    • 2016
  • The purpose of this study was to assess nonpoint sources (NPS) pollution affected by liquid manure and regulating gate in a small agricultural watershed. The study area, which is a wide plain farmland, was operating by the Buyong regulating gate in order to maintain irrigation water level during irrigation period. Consequentially, runoff only occurs through the gate at each event in rainy season for avoiding farmland inundation. In addition, the usage ratio of liquid manure in the study area has been increased greatly since 2014. Discharge loads at the Hwaingsan bridge subwatershed were 1.2 times for T-N, 4-10 times for T-P, and 3-8 times for TOC compared with the Soyang watershed (control) during study period. The reason was that NPS pollutants from upper Gpeun and Sangri bridge subwatersheds, which are widely spraying with livestock liquid manure, were stack at this subwaterehd because of regulating gate in non-rainy seasons. A number of agricultural watersheds in Saemangeum watershed are affected by regulating gate and vigorous livestock activities so that substantial management schemes under controling regulating gate are needed for minimizing livestock related NPS.