• Design & Manufacturing
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• 제12권3호
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• pp.55-59
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• 2018

In a multi-cavity mold having a runner layout of a fish bone structure, problems of unbalanced filling between cavities occur constantly. Unbalanced charging lowers the dimensional accuracy of a molded article and causes deformation after molding. To solve this problem, the gate size connected to each cavity is adjusted using the BGV (Balanced Gate Value) equation. In this paper, in order to solve the filling imbalance problem of the runner layout mold of fish bone structure through injection molding analysis study, we compared the charging imbalance phenomenon before and after improvement after adjusting the gate size by applying BGV equation. From the results of the molding analysis, the shrinkage ratio before and after the improvement of the molded article was improved by only about 0.08%. Based on these results, it was confirmed that the charging imbalance problem was not significantly improved even when the BGV equation was applied.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1033-1034
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• 2005

High resolution 2.1” QVGA LTPS LCD (190ppi) having high aperture ratio of 65% could be successfully developed using state-of-the-art SLS technology and active/gate storage structure. Cost effective P-MOS 6-Mask structure was used. Full gate and transmission gate circuits are integrated in the panel. The high aperture ratio was obtained by using active/gate capacitance structure, which can reduce storage capacitance area. The aperture ratio was increased to 65% from 49% of conventional gate/data capacitance structure. The brightness was increased from 180cd to 270cd without any degradation of optical properties such as contrast ratio, flicker or crosstalk.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.421-424
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• 2004

As the deep sub-micron devices are recently integrated high package density, novel process method for sub $0.1{\mu}m$ devices is required to get the superior thin gate oxide characteristics and reliability. However, few have reported on the electrical quality and reliability on the thin gate oxide. In this paper I will recommand a novel shallow trench isolation structure for thin gate oxide $30{\AA}$ of deep sub-micron devices. Different from using normal LOCOS technology, novel shallow trench isolation have a unique 'inverse narrow channel effects' when the channel width of the devices is scaled down shallow trench isolation has less encroachment into the active device area. Based on the research, I could confirm the successful fabrication of shallow trench isolation(STI) structure by the SEM, in addition to thermally stable silicide process was achiever. I also obtained the decrease threshold voltage value of the channel edge and the contact resistance of $13.2[\Omega/cont.]$ at $0.3{\times}0.3{\mu}m^2$. The reliability was measured from dielectric breakdown time, shallow trench isolation structure had tile stable value of $25[%]{\sim}90[%]$ more than 55[sec].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.280-283
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• 2004

This paper discribes the design concept, fabrication process and measuring result of 2.5kV Gate Commutated Thyristor devices. Integrated gate commutated thyristors(IGCTs) is the new power semiconductor device used for high power inverter, converter, static var compensator(SVC) etc. Most of the ordinary GTOs(gate turn-off thyristors) are designed as non-punch-through(NPT) concept; i.e. the electric field is reduced to zero within the N-base region. In this paper, we propose transparent anode structure for fast turn-off characteristics. And also, to reach high breakdown voltage, we used 2-stage bevel structure. Bevel angle is very important for high power devices, such as thyristor structure devices. For cathode topology, we designed 430 cathode fingers. Each finger has designed $200{\mu}m$ width and $2600{\mu}m$ length. The breakdown voltage between cathode and anode contact of this fabricated GCT device is 2,715V.

• 대한전자공학회논문지SD
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• 제43권4호
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• pp.23-30
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• 2006

본 연구에서는 나노 스케일 MuGFET(Mutiple-Gate FETs)의 단채널 효과와 corner effect를 3차원 시뮬레이션을 통하여 분석하였다. 문턱전압 모델을 이용하여 게이트 숫자(Double-gate=2, Tri-gate=3, Pi-gate=3.14, Omega-gate=3.4, GAA=4)를 구하였으며 추출된 게이트 숫자를 이용하여 각각의 소자 구조에 맞는 natural length($\lambda$)값을 얻을 수 있었다. Natural length를 통하여 MuGFET의 단채널 효과를 피할 수 있는 최적의 소자 구조(실리콘 두께, 게이트 산화막의 두께 등)를 제시 하였다. 이러한 corner effect를 억제하기 위해서는 채널 불순물의 농도를 낮게 하고, 게이트 산화막의 두께를 얇게 하며, 코너 부분을 약 17%이상 라운딩을 해야 한다는 것을 알 수 있었다.

• 한국전기전자재료학회논문지
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• 제13권9호
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• pp.729-734
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• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• 한국진공학회지
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• 제5권4호
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• pp.327-332
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• 1996

Tungsten(W) polycide gate 구조에서 $WSi_x$의 두께가 증가하면 열처리 공정 후 Gate oxide의 두께가 증가하며, 전기적 신뢰도가 열화 되는 현상이 발생한다. 이러한 특성 열화를 일으키는 지배적인 요인은 $WSi_x$ 증착 공정 중 유입되어 후속 열 공정에 의하여 gate oxide로 환산되는 fluorine인 것으로 밝혀졌다. 이러한 현상을 규명하기 위하여 fluorine ion implantation된 poly Si과의 특성을 비교하였으며, SIMS 및 단면 TEM을 이용한 미세 구조 연구를 실시하였다. 그러나 $WSi_x$의 두께가 600$\AA$ 이상부터는이러한 특성 열화가 포화되는 현상이 관찰되었다. 600$\AA$ 이상의 $WSi_x$ 두께에서는 미세 구조가 표면이 거칠고, porous한 phase로 구성된 상부 구조와 비교적 dense하고, 매끈한 계면 상태를 갖는 하부 구조로 이루어졌으며, porous한 표면 부위는 후속 열공정 중 oxygen-rich한 phase로 변하여 fluorine을 포획하여 oxide로의 확산을 억제하여 특성 열화가 포화되는 것으로 해석되었다.

• 한국정보통신학회논문지
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• 제7권2호
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• pp.263-268
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• 2003

본 논문에서는 main gate(MG)와 side gate(SG)를 갖는 double gate(DG) MOSFET 구조를 조사하였다. MG가 50nm일 때 최적의 SG 전압은 약 3V임을 알 수 있었고, 각각의 MG에 대한 최적의 SG 길이는 약 70nm임을 알 수 있었다. DG MOSFET는 매우 작은 문턱 전압 roll-off 특성을 나타내고, 전류-전압 특성곡선에서 VMG=VDS=1.5V, VSG=3V인 곳에서 포화전류는 550$\mu\textrm{A}$/m임을 알 수 있었다. subthrehold slope는 82.6㎷/decade, 전달 컨덕턴스는 l14$\mu\textrm{A}$/$\mu\textrm{m}$ 그리고 DIBL은 43.37㎷이다 다중 입력 NAND 게이트 로직 응용에 대한 이 구조의 장점을 조사하였다. 이때, DG MOSFET에서 41.4GHz의 매우 높은 컷오프 주파수를 얻을 수 있었다.

• 대한전자공학회논문지SD
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• 제46권12호
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• pp.10-17
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• 2009

Double-Gate MOSFET 구조를 사용한 Nano-Electro-Mechanical MOSFET (NEMFET)는 게이트 길이가 짧아지면서 나타나는 단채널 현상을 효과적으로 제어하는 새로운 구조의 차세대 소자이다. 특히 공핍형 Double-gate NEMFET (Dep-DGNEMFET)은 차단 상태에서 얇은 산화막을 가지므로 subthreshold 전류가 효과적으로 제어된다. 이러한 Dep-DGNEMFET 특성에 대한 해석적 수식을 유도하고 소자 구조가 변화하는 경우의 특성 변화를 분석하였다. 또한 ITRS (International Technology Roadmap for Semiconductors) 전류 기준값을 만족시키기 위하여 Dep-DGNEMFET 소자 구조를 최적화 하였다.

• 환경영향평가
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• 제19권3호
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• pp.231-245
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• 2010

The the purpose of this study was to analyze of the vegetation structure and phytosociological changes in the area adjacent to GeumJeong Mountain Fortress for fifteen years. The result of this study was as follows; Of the 8 quadrates, site of the North Gate 2 was having a highest in the number of extinct trees, 15 kinds. This is probably due to trampling effect caused by climbers' steps. Site of the West Gate 1 and South gate 1 each had 8 kinds of extinct trees, respectively. The number of newly appeared trees was highest at site of the North Gate 1, (8 kinds) followed by the sites of South gate 1 and South gate 2, respectively (5 kinds). The highest decrease in number of tree species was observed in North Gate 1, therefore, there is a strong relationship between vegetation diversity and the number of users of the available spaces. In order to revitalize the unstable vegetation structure of the Area Adjacent to GeumJeong Mountain Fortress, Robinia pseudo-acacia has to be well maintained in the shrub tree layer, and vines, such as Smilax china, Humulus japonicus, and Pueraria thungergiana, should be removed. To recover natural vegetation, dead leaf layer should be protected, and more shrub trees need to be planted. In the understory and shrub tree layer, multi layer tree planting is highly recommended to recover natural vegetation and increase tree diversity. In order to improve bad soil condition caused by trampling effect of recreational users, special treatments to the soil structure are required, such as mulching and raking soil. Also, depending on its soil damage from users trampling, the areas in the park should be divided into usable areas and user limited areas by the sabbatical year system. To improve the soil acidity due to acidic rain, soil buffering ability should be improved by activating microorganisms in the soil by using lime and organic material.