• 제목/요약/키워드: Gate Design

검색결과 1,594건 처리시간 0.026초

Design of Bootstrap Power Supply for Half-Bridge Circuits using Snubber Energy Regeneration

  • Chung, Se-Kyo;Lim, Jung-Gyu
    • Journal of Power Electronics
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    • 제7권4호
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    • pp.294-300
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    • 2007
  • This paper deals with a design of a bootstrap power supply using snubber energy regeneration, which is used to power a high-side gate driver of a half-bridge circuit. In the proposed circuit, the energy stored in the low-side snubber capacitor is transferred to the high-side bootstrap capacitor without any magnetic components. Thus, the power dissipation in the RCD snubber can be effectively reduced. The operation principle and design method of the proposed circuit are presented. The experimental results are also provided to show the validity of the proposed circuit.

3.3 kV 이상의 전력반도체 소자 구현 및 신뢰성 향상을 위한 필드링 최적 설계에 관한 연구 (The Optimal Design of Field Ring for Reliability and Realization of 3.3 kV Power Devices)

  • 강이구
    • 한국전기전자재료학회논문지
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    • 제30권3호
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    • pp.148-151
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    • 2017
  • This research concerns field rings for 3.3kV planar gate power insulated-gate bipolar transistors (IGBTs). We design an optimal field ring for a 3.3kV power IGBT and analyze its electrical characteristics according to field ring parameters. Based on this background, we obtained 3.3kV high breakdown voltage and a 2.9V on state voltage drop. To obtain high breakdown voltage, we confirmed that the field ring count was 23, and we obtained optimal parameters. The gap distance between field rings $13{\mu}m$ and the field ring width was $5{\mu}m$. This design technology will be adapted to field stop IGBTs and super junction IGBTs. The thyristor device for a power conversion switch will be replaced with a super high voltage power IGBT.

SPICE를 이용한 MOSFET의 병렬운전 특성해석 및 설계 (Design and Analysis for Parallel Operation of Power MOSFETs Using SPICE)

  • 김윤호;윤병도;강영록
    • 대한전기학회논문지
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    • 제43권2호
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    • pp.251-258
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    • 1994
  • To apply the Power MOSFET to the high powerd circuits, the parallel operation of the Power MOSFET must be considered because of their low power rating. This means, in practical applications, design methods for the parallel operations are required. However, it is very difficult to investigate the problem of parallel operations by directly changing the internal parameters of the MOSFET. Thus, in this paper, the effects of internal parameters for the parallel operation are investigated using SPICE program which is often used and known that the program is very reliable. The investigation results show that while the gate resistance and gate capacitances are the parameters which affect to the dynamic switching operations, the drain and source resistances are the parameters which affect to the steady-state current unbalances. Through this investigation, the design methods for the parallel operation of the MOSFET are suggested, which, in turn, contributes to the practical use of Power MOSFETs.

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저전력 소모와 테스트 용이성을 고려한 회로 설계 (A study on low power and design-for-testability technique of digital IC)

  • 이종원;손윤식;정정화;임인칠
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1998년도 하계종합학술대회논문집
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    • pp.875-878
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    • 1998
  • In this thesis, we present efficient techniques to reduce the switching activity in a CMOS combinational logic network based on local logic transforms. But this techniques is not appropriate in the view of testability because of deteriorating the random pattern testability of a circuit. This thesis proposes a circuit design method having two operation modes. For the sake of power dissipation(normal operation mode), a gate output switches as rarely as possible, implying highly skewed signal probabilities for 1 or 0. On the other hand, at test mode, signals have probabilities of being 1 or 0 approaching 0.5, so it is possible to exact both stuck-at faults on the wire. Therefore, the goals of synthesis for low power and random pattern testability are achieved. The hardware overhead sof proposed design method are only one primary input for mode selection and AND/OR gate for each redundant connection.

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Computer Simulation에 의한 Semi-Solid 단조금형의 설계 및 실험적 검정 (Die Design of Semi-Solid Forging by Computer Simulation and their Experimental Investigation)

  • 서판기;이동훈;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2000년도 추계학술대회 논문집
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    • pp.185-190
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    • 2000
  • Die design by computer simulation has some advantages compared with the conventional method which has performed by designer's experiences and trials and errors. The die filling and solidification process of thixoforming process were simulated by MAGMAsoft/thixo module. First of all, thixoforming die design was applied to previously geometry shape. The value of pressure distribution shows high and uniform as the gate diameter is 18mm. Designed gating system considering the deformation of die and product was suggested by the filling simulation. Gate velocity(7.25m/s) of designed gating system shows that propriety to semi-solid metal working process and CAE results were in good agreement with experimental results.

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Conventional CMOS 공정을 위한 GGNMOS Type의 ESD 보호소자의 TLP 특성 평가 (TLP Properties Evaluation of ESD Protection Device of GGNMOS Type for Conventional CMOS Process)

  • 이태일;김홍배
    • 한국전기전자재료학회논문지
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    • 제21권10호
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    • pp.875-880
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    • 2008
  • In this paper, we deal with the TLP evaluation results for GGNMOS in ESD protection device of conventional CMOS process. An evaluation parameter for GGNMOS is that repeatability evaluation for reference device($W/L=50\;{\mu}m1.0\;{\mu}m$) and following factors for design as gate width, number of finger, present or not for N+ gurad -ring, space of N-field region to contact and present or not for NLDD layer. The result of repeatability was showed uniformity of lower than 1 %. The result for design factor evaluation was ; 1) gate width leading to increase It2, 2) An increase o( finger number was raised current capability(It2), and 3) present of N+ gurad-ring was more effective than not them for current sink. Finally we suggest the optimized design conditions for GGNMOS in evaluated factor as ESD protection device of conventional CMOS process.

광학렌즈 사출성형금형 설계에 있어서 CAE기술의 활용 (Application of Birefringence CAE in Mould Design of Optic Lens Injection Molding Process)

  • 야마노이 미키오;곽태수;정종교
    • 한국기계가공학회지
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    • 제11권3호
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    • pp.1-6
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    • 2012
  • This study is focused on simulation technology in injection molding process for plastic optic lenses. The CAE program, $3D-TIMON^{TM}$ is used for the injection molding simulation with O-PET resin material. The design for different gate shape and runner layout has been under review by CAE simulation results. Moreover, the prediction of birefringence and polarized light in injection molded optic lenses has been tested by the CAE Program. The simulation results have been expected to effectively use in the design of injection molding mould.

Minimizing Leakage of Sequential Circuits through Flip-Flop Skewing and Technology Mapping

  • Heo, Se-Wan;Shin, Young-Soo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권4호
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    • pp.215-220
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    • 2007
  • Leakage current of CMOS circuits has become a major factor in VLSI design these days. Although many circuit-level techniques have been developed, most of them require significant amount of designers' effort and are not aligned well with traditional VLSI design process. In this paper, we focus on technology mapping, which is one of the steps of logic synthesis when gates are selected from a particular library to implement a circuit. We take a radical approach to push the limit of technology mapping in its capability of suppressing leakage current: we use a probabilistic leakage (together with delay) as a cost function that drives the mapping; we consider pin reordering as one of options in the mapping; we increase the library size by employing gates with larger gate length; we employ a new flipflop that is specifically designed for low-leakage through selective increase of gate length. When all techniques are applied to several benchmark circuits, leakage saving of 46% on average is achieved with 45-nm predictive model, compared to the conventional technology mapping.

대용량 전력변환용 초고전압 NPT IGBT 최적화 설계에 관한 연구 (The Optimal Design of Super High Voltage Planar Gate NPT IGBT)

  • 강이구
    • 한국전기전자재료학회논문지
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    • 제28권8호
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    • pp.490-495
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    • 2015
  • This paper was proposed the theoretical research and optimal design 3,000 V IGBT for using electrical automotive, high speed train and first power conversion. To obtaining 3,000 V breakdown voltage, the design parameters was showed $160{\Omega}{\cdot}cm$ resistivity and $430{\mu}m$ drift length. And to maintain 5 V threshold voltage, we obtained $6.5{\times}10^{13}cm^{-2}$ p-base dose. We confirmed $24{\mu}m$ cell pitch for maintain optimal on state voltage drop and thermal characteristics. This 3,000 V IGBT was replaced to thyristor devices using first power conversion and high speed train, presently.

0.1${\mu}{\textrm}{m}$ 게이트 길이의 CMOS소자의 Latch-up 특성에 대한 연구 (Investigation of the Characteristic of Latch-up of 0.1 ${\mu}{\textrm}{m}$ Gate Length CMOS)

  • 김연태;원태영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 추계학술대회 논문집
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    • pp.164-167
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    • 1994
  • In this Study, we design the process of 0.1$\mu\textrm{m}$ gate length CMOS that is immunized against Latch-up, and investigate the characteristic of Latch-up of this device by the design rule of layout. Using TSUPREM4 and MEDICI, we design the device and simulate the variable characteristics of it we could understand that the characteristic of Latch-up is changed for the better by varying the critical factor of it. We also investigate the structure of CMOS that can be immunized against Latch-up.