• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.729-732
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting condition. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In order to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber, breaker, and precision servo mechanism in order to dice an semiconductor wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society for Heat Treatment
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• v.29 no.3
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• pp.124-131
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• 2016

GaN and InN epilayers with nucleation layer (LT-buffer) were grown on (0001) sapphire substrates by radio-frequency plasma-assisted molecular beam epitaxy (RF-MBE). As-grown and annealed GaN and InN nucleation layers grown at various growth condition were observed by reflection high-energy electron diffraction (RHEED). When temperature of effusion cell for III source was very low, diffraction pattern with cubic symmetry was observed and zincblende nucleation layer was flattened easily by annealing. As cell temperature increased, LT-GaN and LT-InN showed typical diffraction pattern from wurtzite structure, and FWHM of (10-12) plane decreased remarkably which means much improved crystalline quality. Diffraction pattern was changed to be from streaky to spotty when plasma power was raised from 160 to 220 W because higher plasma power makes more nitrogen adatoms on the surface and suppressed surface mobility of III species. Therefore, though wurtzite nucleation layer was a little hard to be flattened compared to zincblende, higher cell temperature led to easier movement of III surface adatoms and resulted in better crystalline quality of GaN and InN epilayers.

• Proceeding of EDISON Challenge
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• 2017.03a
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• pp.428-432
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• 2017

Silicon 기반 Metal-oxide-semiconductor field-effect transistor (MOSFET)의 크기가 감소함에 따라 silicon자체의 물성적 한계가 나타나고 있다. 이를 극복하고자 III-V 화합물 반도체가 채널소자로서 각광받고 있다. 본 연구에서는 III-V 화합물반도체 중 $In_xGa_{1-x}As$는 Indium 조성에 따른 전자구조 및 n-type MOSFET의 소자 특성을 본다. Indium의 조성이 증가함에 따라 subband의 개수와 간격이 증가하게 되어 Density of state가 감소하게 된다. 이로 인하여 Indium의 조성이 증가함에 따라 $In_xGa_{1-x}As$ 채널 MOSFET에서 상대적으로 Fermi level을 더 많이 상승시키게 되어 potential barrier를 얇아지게 만들며 또한 에너지에 따른 전류 밀도를 넓게 분포하도록 만든다. 이로 인하여 단채널에서는 In 조성이 증가함에 따라 direct source-to-drain tunnelling current이 증가하게 된다. 이로 인하여 In 조성의 증가에 따라 subthreshold swing과 ON-state current가 저하된다.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.222-222
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.155-155
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• 2011

반도체 양자링은 양자점과 같이 효율이 높은 광학 소자 및 전자 소자에 응용 가능할 뿐 아니라, 양자점과는 다른 흥미로운 현상 연구가 가능하기 때문에 지속적으로 연구되고 있는 양자 구조이다. 특히, 반도체 양자링은 다양한 양자 구조를 형성하기 위한 기초 구조로 사용될 수 있으므로, 반도체 양자링 구조의 형성 메카니즘을 연구하는 것 또한 중요하다. 본 연구에서는 Molecular Beam Epitaxy (MBE)를 이용하여 N-type (100) GaAs 기판 위에 GaAs 양자 구조를 형성하였다. As4 분압의 영향, 즉 3-5 ratio가 표면 양자 구조 변화에 미치는 영향을 관찰하기 위해 3족과 5족을 분리하여 성장하는 전형적인 성장 방식인, droplet epitaxy mode를 사용하였다. 성장 온도, Ga metal droplet 밀도 등의 조건을 고정하고 Arsenic 분압을 1e-5 torr부터 3e-8 torr로 감소시켰을 때 표면 이미지를 AFM과 SEM으로 관찰하였다. As4 분압이 1e-5 torr일 때 양자점의 표면 형상을 보여주다가 As4 분압을 줄여갈수록 양자점의 크기가 증가하면서 As4 분압 1e-6 torr에서는 SEM 이미지 상으로도 분명한 양자링을 관찰할 수 있었다. 특히 주목할 것은 As4 분압 1e-6 torr에서 더 줄여갈수록 양자링 중앙 부분의 낮은 부분이 점점 넓어졌다는 점이다. 이것은 As4 분압 1e-6 torr 이상의 조건이 As4와 Ga atom이 결합하여 GaAs 양자점을 형성하는데 적절한 3-5 ratio의 조건인 반면, 그보다 적은 As4 분압에서는 As4와 결합하지 못한 Ga atom의 표면 migration에 의한 driving force로 인해 양자링이 형성되었다고 추측할 수 있다. 이렇게 형성된 양자링을 열처리 후 macro-PL 측정을 통해 광학적 특성을 보고자 하였다. 그 결과 같은 조건에서 열처리되어 PL 측정한 양자점의 에너지에 비해 peak position이 blue shift한 것을 볼 수 있었다. 이것은 As4를 제외한 같은 조건에서 성장된 양자 구조에서 양자링의 경우 양자점에 비해 그 높이가 낮음을 추측해 볼 수 있다. 양자 구조의 모양과 광학 특성의 관계를 밝히기 위해 추후 추가 측정 및 분석이 필요할 것이다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.10 s.340
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• pp.9-18
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• 2005

Analytical expressions for breakdown voltages of abrupt $p^{+}n$ junction of Si, GaAs, InP and In$In_{0.53}Ga_{0.47}AS$ were induced. Getting analytical breakdown voltages, effective ionization coefficients were extracted using lucky drift parameters of Marsland for each materials. The results of analytical breakdown voltages followed by ionization integral agreed well with experimental result within 10$\%$ in error for the doping concentration in the range of $10^{14}cm\;^{-3}\~5\times10\;^{17}cm\;^{-3}$.

• Korean Journal of Optics and Photonics
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• v.16 no.3
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• pp.275-286
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• 2005

The performance of the InGaN LED's in terms of the photon extraction efficiency has been analyzed by the Monte Carlo photon simulation method. Simulation results show that the sidewall slanting scheme, which works well for the AlInGaP or InGaN/SiC LED, plays a very minimal role in InGaN/sapphire LED's. In contrast to InGaN/SiC LED's, the lower refractive index sapphire substrate restricts the generated photons to enter the substrate, minimizing the chances for the photons to be deflected by the slanted sidewalls of the epitaxial semiconductor layers that are usually very thin. The limited photon transmission to the sapphire substrate also degrades the. photon extraction efficiency especially in the epitaxial-side down mount. One approach to exploit the photon extraction potential of the epitaxial-side down mount may be to texture the substrate-epitaxy interface. In this case, randomized photon deflection off the textured interface directly increases the number of the photons entering the sapphire substrate, from which they easily couple out of the chip and thereby improving the photon extraction efficiency drastically.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.1
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• pp.21-25
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• 2017

In this study, we have fabricated Schottky barrier diodes (SBD) on single-crystal ${\beta}-Ga_2O_3$ semiconductor that has received much attention for use in next-generation power devices. The SBD had a Pt/Ti/Au Schottky contact on a $2{\mu}m$ Sn-doped low concentration N-type epitaxial layer. The fabricated device exhibited a breakdown voltage of > 180 V, a specific on-resistance of $1.26m{\Omega}{\cdot}cm^2$, and forward current densities of $77A/cm^2$ at 1 V and $473A/cm^2$ at 1.5 V, which proved the potential for use in power device fabrication.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.6
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• pp.574-579
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• 1999

A counter-flow type horizontal reactor of metal organic chemical vapor deposition was designed with the Reynolds and the Rayleigh numbers of Re = 4.5 and Ra = 215.8, respectively. The GaN thin films were grown and characterized by Hall measurement, double crystal X-ray diffraction analysis and photoluminescence measurement. The Si and Mg were also used for doping of GaN films. The dislocation density of $2.6{\times}10^8/\textrm {cm}^2$ was included in GaN films representing the geometrical lattice mismatch between sapphire substrates and GaN films. The Si doped n-GaN films provide the electron carrier density and mobility in the regions of $10^{17}~10^{18}/\textrm{cm}^3$ and 200~400 $\textrm{cm}^2$/V .sec, respectively. Mg doped p-GaN films were post-annealed and activated with the hole carrier density of $8{\times}10^{17}/{\textrm}{cm}^3$.