• 한국광물학회지
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• 제28권4호
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• pp.293-297
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• 2015

집속이온빔(FIB, focused ion beam)법은 광물 및 지질시료의 분석 대상 위치로부터 투과전자현미경(TEM, transmission electron microscope) 관찰을 위한 박편을 정밀하게 제작할 수 있는 방법으로 널리 보급되고 있다. 그러나 박편 제작과정에서 Ga 이온빔에 의한 구조 손상이나 인위적 효과들이 발생하여 전자빔에 의한 손상과 함께 TEM 분석에서의 난점들 중 하나이다. 광물 시료 FIB 박편의 TEM 관찰에서 석영과 장석의 비정질화, 커튼 효과, Ga 오염 등이 확인되었으며, 특히 입자 경계 부근이나 두께가 얇은 곳에서 이들 현상이 보다 뚜렷하다. 박편 제작 시의 가속전압 및 전류 조정 등의 분석절차 개선으로 이온빔 손상을 줄일 수 있으나, 어느 정도의 손상이나 오염은 피할 수 없으므로 TEM 박편 관찰과 해석에서 유의하여야 한다.

• Design & Manufacturing
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• 제14권3호
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• pp.63-70
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• 2020

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.

• 한국정밀공학회지
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• 제27권8호
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• pp.84-90
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• 2010

In focused ion beam (FIB) fabrication processes the ion beam intensity with Gaussian profile has a drawback for high resolution machining. In this paper, the fabrication method to modify the beam profile at substrate using silt mask is proposed to increase the machining resolution at high current. Slit mask is utilized to block the part of beam and transmit only high intensity portion. A nano manipulator is utilized to handle the silt mask. Geometrical analysis on fabricated profile through silt mask was conducted. By utilizing proposed method, improvement of machining resolution was achieved.

• 한국군사과학기술학회지
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• 제14권6호
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• pp.1107-1113
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• 2011

In this paper, ion beam technology was investigated through the published papers. Ion beam technology is mainly used by the focused ion beams. There are two different types of application methods. One method is to remove the material from the substrate, the other one is to deposit the materials on the surface of the substrate or specimen. Based on the literature review there are 1.5 times more published research papers related to the deposition than those of the removal.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.241-245
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• 2007

The residual stress in axial stress in the axial direction of the steel filaments has been measured by using a method based on the combination of the focused ion beam (FIB) and high resolution strain mapping program (VIC-2D). That is, the residual stress was calculated from the measured displacement field before and after the introduction of a slot along the steel filaments. The displacement was obtained by the digital correlation analysis of high-resolution scanning electron micrographs, while the slot was introduced by FIB milling with low energy beam. The present measurement revealed that the residual stress within 8% of the magnitude was persistent in the steel filaments fabricated.

• Applied Microscopy
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• 제45권4호
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• pp.208-213
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• 2015

Nanomanipulators installed in focused ion beam (FIB), which is used in the lift-out of lamella when preparing transmission electron microscopy specimens, have recently been employed for electrical resistance measurements, tensile and compression tests, and in situ reactions. During the pick-up process of a single nanowire (NW), there are crucial problems such as Pt, C and Ga contaminations, damage by ion beam, and adhesion force by electrostatic attraction and residual solvent. On the other hand, many empirical techniques should be considered for successful pick-up process, because NWs have the diverse size, shape, and angle on the growth substrate. The most important one in the in-situ precedence, therefore, is to select the optimum pick-up process of a single NW. Here we provide the advanced methodologies when manipulating NWs for in-situ mechanical and electrical measurements in FIB.

• 한국정밀공학회지
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• 제23권12호
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• pp.122-127
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• 2006

This paper reports on the development of carbon nanotube tip modified with focused ion beam(FIB). We used an electric field which causes dielectrophoresis, to align and deposit CNTs on a metal-coated canning Probe Microscope (SPM) tip. Using the CNT attached SPM tip, we have obtained an enhanced resolution and wear property compared to that from the bare silicon tip through the scanning of the surface of the bio materials. The carbon nanotube tip was aligned toward the source of the ion beam allowing their orientation to be changed at precise angles. By this technique, metal coated carbon nanotube tips that are several micrometer in length are prepared for SPM.

• 소성∙가공
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• 제16권4호
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• pp.323-328
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• 2007

The residual stress in axial direction of the steel wires has been measured by using a method based on the combination of the focused ion beam(FIB) milling and digital image correlation(DIC) program. The residual stress is calculated from the measured displacement field before and after the introduction of a slot along the steel wires. The displacement is obtained by the digital correlation analysis of high-resolution scanning electron micrographs, while the slot is introduced by FIB milling with low energy beam. The experimental procedures are described and the feasibilities are demonstrated in steel wires fabricated with different conditions. It reveals that the tensile residual stress is formed in all steel wires and this is strongly influenced by the fabrication conditions.

• 반도체디스플레이기술학회지
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• 제3권2호
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• pp.5-9
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• 2004

Microcircuit fabrication requires precise control of impurities in tiny regions of the silicon. These regions must be interconnected to create components and VLSI circuits. The patterns to define such regions are created by lithographic processes. In order to image features smaller than 70 nm, it is necessary to employ non-optical technology (or next generation lithography: NGL). One such NGL is extreme ultra-violet lithography (EUVL). EUVL transmits the pattern on the wafer surface after reflecting ultra-violet through mask pattern. If particles exist on the blank mask, it can't transmit the accurate pattern on the wafer and decrease the reflectivity. It is important to care the blank mask. We removed the particles on the wafer using focused ion beam (FIB). During removal, FIB beam caused damage the multi layer mask and it decreased the reflectivity. The relationship between particle removal and reflectivity is examined: i) transmission electron microscope (TEM) observation after particle removal, ii) reflectivity simulation. It is found that the image mode of FIB is more effective for particle removal than spot and bar mode.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2005년도 춘계학술대회 논문집
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• pp.30-34
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• 2005

This paper describes the design and manufacturing of a focused-ion-beam machining system which can make small features of nano size. We use a SIMION simulator in order to obtain the design data of an ion column. The simulation result shows that the focal length of ion beam decreases as the applied voltage of object lens increases. Finally, we obtained the good images of a mesh of 50 micrometers by using the adjustment of applied voltage, acceleration power, and dimension of each elements.