• Title/Summary/Keyword: Fine pattern

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Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • Jeong, Jae-U;Kim, Yong-Sik;Yun, Gwan-Su
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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A Study on the Relation between Personality and Clothing Design Preferences of Men (직장남성의 성격특성과 의복디자인 선호도와의 관계연구)

  • 임정은;이명희
    • The Research Journal of the Costume Culture
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    • v.7 no.5
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    • pp.80-92
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    • 1999
  • The objectives of this study were to investigate the relation between personality(activity, emotional stability, and dominance) and clothing design preferences, and to examine the differences of clothing design preferences according to demographic variables of men. Subjects for the study were 255 male white-collar workers ranging in ages from twenties to fifties, in Seoul and Kwangju City, Korea. The men with higher activity of personality preferred the double jacket with 4 buttons, the combination of light color jacket and dark trousers, glen check pattern jacket, herringbone pattern jacket, light beige color dress shirts. The higher the emotional stability, the higher the preferences on diverse patterns such as fine stripe, plaid, hound\`s-tooth check, and small check pattern. The men with higher dominance preferred dark blue color suit, glen check pattern suit, and necktie of red circle, and disliked the necktie of gray circle. The men in their 20\`s and 30\`s liked the single jacket with 3 buttons, the suit of fine stripe and the necktie of gray circle more among three income groups. The higher the men\`s age and income were, the more they liked the conservative style such as a single jacket with 2 buttons. The men who reside in Seoul liked the suit of gray circle, the jacket and trousers of same color, the patternless jacket, and the patternless suit more than the men in Kwangju. Therefore, the men in methropolitan area preferred conservative clothing image. Fine stripe pattern and patternless materials were preferred when men wore jacket and trousers of same color, while glen check pattern was preferred as the pattern of jacket when jacket and trousers of different color. Male white-collar worker liked single jacket more than double jacket, and preferred the dark blue color suit and necktie, patternless suit, fine stripe suit, and the pale blue dress shirts generally. The present findings provide that the personality of male has influence on the clothing design preferences, and it is possible to infer men\`s personality by their attire.

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Effect of Particle Size of HPMC on Dissolution Rate of Venlafaxine HCl and Carbamazepine Sustained Release Tablet (HPMC의 입도에 따른 염산벤라팍신 및 카바마제핀 서방성 정제의 용출 특성)

  • Cha, Jae-Uk;Cha, Ja-Hyun;Hong, Jun-Kee;Lee, Sung-Wan;Ko, Won-Hwa;Beak, Hyun-Ho
    • Polymer(Korea)
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    • v.36 no.3
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    • pp.332-337
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    • 2012
  • The primary objective of this work is to find the properties of sustained release dissolution pattern depending on solubility of drugs, so venlafaxine HCl and carbamazepine tablets were made by using polymer wich various particle size. Hydroxy propyl methyl cellulose (HPMC) has been utilized in this study as an excipient that is one of the most widely used polymers for an oral sustained release formulation, and drug release pattern was strongly influenced by swelling rate depending on particle size of HPMC. Scanning electron microscope (SEM) was employed to investigate the surface of tablets with various HPMC particle size, and differential scanning calorimeter (DSC) was employed to investigate the crystallization of drugs in tablets. The release model equation was applied to analyze the main mechanism of drug release pattern. The results demonstrate that drug release pattern is controlled by the drug solubility and HPMC particle size.

Surface Wheel Pattern Analysis and Grinding Process Parameters of Silicon (반도체 실리콘재료의 정밀연삭을 위한 공정변수와 연삭후 표면에 형성된 wheel pattern과의 관계)

  • Oh, Han-Seog;Park, Sung-Eun;Lee, Hong-Lim
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.2
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    • pp.187-194
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    • 2002
  • For the fine grinding process development of semiconductor monocrystalline silicon, wheel rotational speed, chuck rotational speed, feed rate and hysteresis force were controlled. Magic mirror system was used for grinding wheel pattern analysis. Curvature of wheel pattern was measured by fitting equation. The modeling of surface wheel pattern was related to wheel and chuck rotational speed. The calculated curvature of the model was well matched with the measured curvature. The statistical analysis indicated wheel and chuck rotational speed were significantly effective on.

Fine-Pitch Solder on Pad Process for Microbump Interconnection

  • Bae, Hyun-Cheol;Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung
    • ETRI Journal
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    • v.35 no.6
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    • pp.1152-1155
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    • 2013
  • A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

Finite Element Anlaysis of Nanoindentation Process and its Experimental Verification (나노 인덴테이션 공정의 유한요소해석 및 실험적 검증)

  • 이정우;윤성원;강충길
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.116-119
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    • 2003
  • In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation was studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass) were used as specimens, and forming conditions to reduce the elastic restoration and pile-up was proposed. The indenter was modeled a rigid surface. Minimum mesh sizes of specimens are 1-10nm Comparison between the experimental data and numerical result demonstrated that the finite element approach is capable of reproducing the loading-unloading behavior of a nanoindentation test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

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Analysis of Material Deformation Behavior in Nanoindentation Process by using 3D Finite Element Analysis and its Experimental Verification (3차원 유한요소해석을 이용한 나노인덴테이션 공정에서의 소재거동해석 및 실험적 검증)

  • 이정우;윤성원;강충길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1174-1177
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    • 2003
  • In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation was studied with numerical method by ABAQUS S/W. Polymer (PMMA) and brittle materials (Si, Pyrex glass) were used as specimens, and forming conditions to reduce the elastic recover and pile-up was proposed. The indenter was modeled a 3D rigid surface. Minimum mesh sizes of specimens are 1-10nm. Comparison between the experimental data and numerical result demonstrated that the finite element approach is capable of reproducing the loading-unloading behavior of a nanoindentation test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

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Optimized electrode design to improve transmittance in the Patterned Vertical Alignment Liquid Crystal Display

  • Hwang, Seong-Jin;Kim, Youn-Sik;Lee, Seung-Hee;Lyu, Jae-Jin;Kim, Kyeong-Hyeon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.549-552
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    • 2007
  • Patterned vertical alignment (PVA) mode requires multi-domain to exhibit wide viewing angle whereas the transmittance is sacrificed. To overcome the demerit, a fine pattern was formed at folded region in PVA Z-shape electrode structure. In the present work fine patterns were formed near domain boundary regions where the unwanted field direction which causes the LC to tilt down in unwanted direction exists. Thereby transmittance is improved near those fine patterns. This method is very simple and more cost-effective process than the other methods. In this article, we show the method of fine pattern formation and its influence on LC molecule in PVA mode with Z-shape electrode structure.

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