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Surface Wheel Pattern Analysis and Grinding Process Parameters of Silicon  

Oh, Han-Seog (Dept. of Ceramics Engineering, Yonsei University)
Park, Sung-Eun (Dept. of Ceramics Engineering, Yonsei University)
Lee, Hong-Lim (Dept. of Ceramics Engineering, Yonsei University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.19, no.2, 2002 , pp. 187-194 More about this Journal
Abstract
For the fine grinding process development of semiconductor monocrystalline silicon, wheel rotational speed, chuck rotational speed, feed rate and hysteresis force were controlled. Magic mirror system was used for grinding wheel pattern analysis. Curvature of wheel pattern was measured by fitting equation. The modeling of surface wheel pattern was related to wheel and chuck rotational speed. The calculated curvature of the model was well matched with the measured curvature. The statistical analysis indicated wheel and chuck rotational speed were significantly effective on.
Keywords
Fine grinding; Back grinding; Silicon wafer; Wheel pattern; Wafering;
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