• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.630-632
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• 2003

In this paper, we present the fabrication and performance of FBAR filters with ladder and stacked crystal filter (SCF) types. The structure of the unit resonator in our work is the solidly mounted resonator (SMR) with W/SiO$_2$ multi-layer reflectors, the return loss of of which show -24dB at resonant frequency of -2.0GHz. The $K^2$eff, Q$_{s}$, and Q$_{p}$, indicating the performance of resonator were 3.24%, 6,363 and 6,749 and were calculated for the resonator with the resonance area of 21200${\mu}{\textrm}{m}$$^2$. Based on this unit resonator, FBAR filters with ladder and SCF types were fabricated and compared. The sizes of filters were 800$\times$2000(${\mu}{\textrm}{m}$$^2$) for the ladder type and 600$\times$500(${\mu}{\textrm}{m}$$^2$) for the SCF type.e..

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.196-203
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• 2006

An air-gap type FBAR was designed using Leach equivalent model for analyzing a vertical structure of the FBAR. For the top electrode, Pt, and the bottom electrode, Au, of $1.2{\mu}m$ thickness and the piezoelectric of 0.8,urn thickness, the resonance and anti-resonance occurred at 2.401 GHz and 2.460 GHz, respectively. $S_{11}$ was increased and $S_{21}$ was decreased as the resonance area of FBAR was widened. We observed the characteristics of insertion loss, bandwidth and out-of-band rejection of ladder-type FBAR BPF by changing resonance areas of series and shunt resonators and by adding stages. As the resonance area of series resonator was increased, insertion loss was improved but out-of-band rejection was degraded. And as the resonance area of shunt resonator was increased, insertion loss was degraded a little but out-of-band rejection was improved even without adding stages. We, also, changed the shape of the resonance area from square shape to rectangle shape to examine the effects of the resonator shape on the characteristics of the BPF. The best performances were observed when the sizes of series and shunt resonator are $150{\mu}m{\times}l50{\mu}m\;and\;5{\mu}m{\times}50{\mu}m$, respectively. Out-of-band rejection was improved about 10dB and bandwidth was broadened from 30MHz to 100MHz utilizing inductor tuning on $2{\times}2\;and\; 4{\times}2$ ladder-type BPFs.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1594-1596
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• 2004

Film bulk acoustic resonator (FBAR) devices which adopt a membrane-type configuration are fabricated by a novel process. In contrast to the conventional FBAR structure, the newly fabricated resonator doesn't employ any supporting layer below or above it, so that the properties of piezoelectric layer are not influenced by the bottom electrode material. FBAR devices with Mo/AlN/Metal configuration are also fabricated. The frequency response characteristics ($S_{11}$) of the devices fabricated using the proposed process are compared with those of the conventional devices. The return losses are also estimated, in terms of the kind and thickness of bottom electrode materials.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.5
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• pp.915-920
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• 2007

AIN-based film bulk acoustic resonator (FBAR) devices which adopt a membrane-type configuration such as Mo/AIN/bottom-metal/Si are fabricated by employing a novel process. The proposed resonator structure does not require any supporting layer above the substrate, which leads to the reduction in energy loss of the resonators. For all the FBAR devices, the frequency response characteristics are measured and the device parameters, such as return loss and input impedance, are extracted from the frequency responses, and analyzed in terms of the various metals such as Al. Cu, Mo, W used in the bottom-electrode. The mass-loading effect caused by the used bottom-electrode metals is found to be the main reason for the difference revealed in the measured characteristics of the fabricated FBAH devices. The results obtained in this study also show that the degree of match in lattice constant and thermal expansion coefficient hetween piezoelectric layers and electrode metals is crucial to determine the device performance of FEAR.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.249-250
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• 2006

In this study, we tried to Improve c-axis orientation of ZnO thin films used in a piezoelectric layer of FBAR devices. First. ZnO deposition conditions were determined by changing various conditions of RF sputter such as RF power, pressure and $O_2$ contents. The Piezoelectric layer was deposited on ZnO buffer layer of dense structure which was formed by ALD equipment. The c-axis orientation of ZnO piezoelectric layer was measured by XRD and we confirmed fine Grains and columnar structure by SEM, AFM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.2
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• pp.159-163
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• 2005

This paper gives characterization of ZnO thin film deposited by RF magnetron sputtering method, which is concerned in deposition process and device fabrication process, to fabricate solidly mounted resonator(SMR)-type film bulk acoustic resonator(FBAR). A piezoelectric layer of 1.1${\mu}{\textrm}{m}$ thick ZnO thin films were grown on thermally oxidized SiO$_2$(3000 $\AA$)/Si substrate layers by RF magnetron sputtering at the room temperature. The highly c-axis oriented ZnO thin film was obtained at the conditions of 265 W of RF power, 10 mtorr of working pressure, and 50/50 of Ar/O$_2$ gas ratio. The piezoelectric-active area was 50 ${\mu}{\textrm}{m}$${\times}$50${\mu}{\textrm}{m}$, and the thickness of ZnO film and Al-3 % Cu electrode were 1.4 ${\mu}{\textrm}{m}$ and 180${\mu}{\textrm}{m}$, respectively. Its series and parallel frequencies appeared at 2.128 and 2.151 GHz, respectively, and the qualify factor of the resonator was as high as 401.8$\pm$8.5.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.140-143
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• 2002

In this study, we prepared ZnO/glass and $ZnO/SiO_{2}/Si$ thin film by Facing Targets Sputtering (FTS) system for Film Bulk Acoustic Resonator (FBAR). When the ZnO thin film applied to piezoelectric thin film, it requires good c-axis preferred orientation. And c-axis orientation has a remarkable difference with preparation conditions. Therefore, c-axis orientation must be significantly evaluated according to changing deposition conditions. Moreover, in order to prepare ZnO thin film with good crystallographic properties and progressive of efficiency of product process, the ZnO thin film should have to prepared as low temperature as possible. In this work, we prepared ZnO thin films on slide glass and $SiO_{2}/Si$ substrate. And the crystallographic characteristics of ZnO thin films on sputtering conditions were investigated by alpha-step and X-ray diffraction.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1992-1994
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• 2005

In this study, Bragg reflector was formed as tungsten(W) and $SiO_2$ deposited by RF magnetron sputtering according to variable conditions of RF power and working pressure to apply to the SMR type FBAR device, one of the next generation mobile communication devices. The micro-structural properties such as a crystal orientation, roughness and micro- structure were measured by XRD, AFM and SEM and the best condition of Bragg reflector was elicited with analyzing that results of the thin films about each conditions. Finally, FBAR device was fabricated with applying the Bragg reflector was formed on the best condition and measured the resonance properties and compared other research and considered it.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.377-378
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• 2005

In this study, $SiO_2$ thin film was deposited on variable conditions of the RF power and working pressure by RF magnetron sputtering to apply to the Bragg reflector of the SMR type FBAR device. A crystal orientation and microstructure of $SiO_2$ thin film was studied by using the XRD, AFM and SEM. The best condition was obtained through analyzing the structural characteristics of thin film. Finally, FBAR device was fabricated with applying the best condition of $SiO_2$ thin film and the resonant characteristics was investigated by network analyzer to verify application possibility as a efficient device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.309-310
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• 2006

In this paper, frequency characteristic of FBAR was studied as a function of annealing temperature. we have used Li dopant to enhance electrical properties of ZnO thin film. Li:ZnO thin film was deposited on Al(300 nm)/$SiO_2$(500 nm)/Si($500\;{\mu}m$) and each layer was patterned. Thermal treatment was executed in range of between 300 and $600^{\circ}C$ in $O_2$ ambient. We observed that the resistivity of ZnO is enhanced under the influence of Li doping and return loss in FBAR frequency properties is improved through annealing.