• 제목/요약/키워드: Etch mechanism

검색결과 133건 처리시간 0.028초

$Y_{3-3x}Nd_{3x}Al_5O_12$단결정의 결함 분석 (Defects Characterization of $Y_{3-3x}Nd_{3x}Al_5O_12$ Single Crystals)

  • 유영문;김병호
    • 한국결정학회지
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    • 제5권2호
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    • pp.67-77
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    • 1994
  • 융액인상법으로 육성된 Y3-3xNd3xAl5O12단결정으로부터 결함을 검출하고 1)광학적 불균질상의 발생원인과 2)금속입자 함유물과 기포의 동반 발생 기구 및 3)core와 facet의 발생기구에 대해 분석하였다. 성장방향에 평행한 박 편을 제조한 후 편광현미경으로 광탄성 효과를 이용하여 결함을 분석하였으며, 결함을 etching한 후 광학적 결함 과 비교하였다. 융액유동의 변동에 의해 부분적인 고액계면의 불안정이 발생되면 부분적으로 성장속도가 크게 증가되어 편재 된 기포가 발생되었다. 반면 조성적 과냉이 발생되면 전체적으로 성장속도가 증가되어 고액계면에 평행하게 균일 분포로 기포가 발생되었다. 이때 기포 발생과 함께 고밀도로 전위가 생성되며 전위의 응력장으로 인해 광학적 불 균질상이 발생되었다. 기상의 IrO2각는 응액속에서 분해되며, 산소가 금속입자의 거친 표면에 부착되어 함께 유동 하면서 입 성장하고, 그 후 기공 또는 고액계면에 포획되는 것이 보다 가능한 금속입자 함유물 발생 기구라고 판단 되었다. Y3-3xNd3xAl5O12단결정에서 core와 facet은 정벽에 의해 발생되며, 고액계면의 접선과 성장방향 간의 각도에 영향을 받았다.

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Ar/$CF_4$ 고밀도 플라즈마에서(Ba,Sr)$TiO_3$ 박막의 식각 메카니즘에 관한 연구 (A Study on Etching Mechanism of (Ba,Sr)$TiO_3$ in Ar/$CF_4$ High Density Plasma)

  • 김승범;김창일
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1550-1552
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    • 1999
  • In this study, (Ba,Sr)$TiO_3$ thin films were etched with a magnetically enhanced inductively coupled plasma (MEICP) as a function $CF_4$/Ar gas mixing ratio. Experimental was done by varying the etching parameters such as rf power, dc bias and chamber pressure. The maximum etch rate of the BST films was $1700{\AA}$/min under $CF_4/(CF_4+Ar)$ of 0.1, 600W/350V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X-ray photoelectron spectroscopy (XPS) studies shows that there are surface reaction between Ba, Sr, Ti and C, F radicals during the (Ba,Sr)$TiO_3$ etching. To analysis the composition of surface residue remaining after the etching, films etched with different $CF_4$/Ar gas mixing ratio were investigated using XPS.

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열구동형 폴리실리콘 마이크로 액츄에이터의 제작 및 특성분석 (Fabrication of Thermally-Driven Polysilicon Microactuator and Its Characterization)

  • Lee, J.H.;Lee, C.S.;Yoo, H.J.
    • 한국정밀공학회지
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    • 제14권12호
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    • pp.153-159
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    • 1997
  • A thermally-driven polysilicon microactuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS(tetraethylorthosilicate) oxide as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And newly developed HF GPE(gas-phase etching) process was also employed to eliminate the troublesome stiction problem using anhydrous HF gas and CH$_{3}$OH vapor, and successfully fabricated the microactuators. The actuation is incurred by the thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon microactuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10V and 50Hz square wave. The actuating characteris- tics are also compared with the simulalted results considering heat transfer and thermal expansion in the polysilicon layer. This microactuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

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$CH_4$/Ar 유도 결합 플라즈마를 이용한 Sapphire 기판의 식각 특성 (Etching properties of sapphire substrate using $CH_4$/Ar inductively coupled plasma)

  • 엄두승;김관하;김동표;양설;김창일
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.102-102
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    • 2008
  • Sapphire (${\alpha}-Al_2O_3$) has been used as the substrate of opto-electronic device because of characteristics of thermal stability, comparatively low cost, large diameter, optical transparency and chemical compatibility. However, there is difficulty in the etching and patterning due to the physical stability of sapphire and the selectivity with sapphire and mask materials [1,2]. Therefore, sapphire has been studied on the various fields and need to be studied, continuously. In this study, the etching properties of sapphire substrate were investigated with various $CH_4$/Ar gas combination, radio frequency (RF) power, DC-bias voltage and process pressure. The characteristics of the plasma were estimated for mechanism using optical emission spectroscopy (OES). The chemical compounds on the surface of sapphire substrate were investigated using energy dispersive X-ray (EDX). The chemical reaction on the surface of the etched sapphire substrate was observed by X-ray photoelectron spectroscopy (XPS). Scanning electron microscopy (SEM) was used to investigate the vertical and slope profiles.

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UNS N08810 합금의 입계부식손상과 원인 분석 (Elucidation of Intergranular Corrosion of UNS N08810 alloys)

  • 김영식;황보덕
    • Corrosion Science and Technology
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    • 제11권5호
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    • pp.196-204
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    • 2012
  • Corrosion failure of petrochemical facilities is one of the difficulties in maintenance, since operating conditions of crude oil production, storage, and refinement are very aggressive. UNS N08810, which has been used for crude oil transportation pipes and storage tanks in petrochemical industries, shows good resistance to general corrosion and localized corrosion in several environments. Among its environments, UNS N08810 showed better corrosion resistance in fuel gas containing sulfuric acid and phosphoric acid and sulfur. However, ductility and toughness at high temperature over about $500^{\circ}C$ were greatly reduced due to microstructural change. In general, welding process is the representative method to join the parts in industrial components. Because the alloy by welding can be sensitized and corroded, the manufacturing process should be controlled. In this work, UNS N08810 was used and heat treatment conditions including solution and stabilization treatments were controlled. Oxalic acid etch test by ASTM A262 Practice A was done to evaluate the qualitative sensitization in room temperature. Huey test by ASTM A262 Practice C was done to evaluate the intergranular corrosion rate in boiling 65% $HNO_3$ solution. Also, the microstructure by thermal history was analyzed. Experimental alloy showed high intergranular corrosion rate and its corrosion mechanism was elucidated.

ICP를 이용한 Ar/$Cl_2/BCl_3$ 플라즈마에서 PZT 식각 특성 (The etching characteristics of PZT thin films in Ar/$Cl_2/BCl_3$ plasma using ICP)

  • 안태현;김경태;이영희;서용진;김창일;장의구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.848-850
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    • 1999
  • In this study, PZT etching was performed using planar inductively coupled Ar(20)/$Cl_2/BCl_3$ plasma, The etch rate of PZT film was 2450 $\AA/min$ at Ar(20)/$BCl_3$(80) gas mixing ratio and substrate temperature of $80^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis for film composition was utilized. The chemical bond of PbO is broken by ion bombardment, and the peak of metal Pb in a Pb 4f peak begins to appear upon etching, decreasing Pb content faster than Zr and Ti. As increase content of additive $BCl_3$, the relative content of oxygen decreases rapidly. We thought that abundant Band BCl radicals made volatile oxy-compound such as $B_{x}O_{y}$ and/or $BClO_x$ bond. To understand etching mechanism, Langmuir probe and optical emission spectroscopy (OES) analysis were utilized for plasma diagnostic.

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$SF_6$/Ar 가스 플라즈마에 의한 $SrBi_{2}Ta_{2}O_{9}$ 박막의 식각 메커니즘 연구 (Study on mechanism for etching of $SrBi_{2}Ta_{2}O_{9}$ thin film in $SF_6$/Ar gas plasma)

  • 김동표;서정우;김창일
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.867-869
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    • 1999
  • In this study, $SrBi_{2}Ta_{2}O_{9}$(SBT) thin films were etched as a function of $SF_6$/Ar gas mixing ratio in magnetically enhanced inductively coupled plasma(MEICP) system fer a fixed rf power, dc-bias voltage, and chamber pressure. The etch rate of SBT thin film was $1500{\AA}/min$ and the selectivities of photoresist (PR) and $SiO_2$ to SBT thin film were 0.48 and 0.62, respectively when the samples were etched at a rf power of 600W, a dc-bias voltage of -150V, a chamber pressure of 10 mTorr and a gas mixing ratio of $SF_6/(SF_6+A)$=0.1. In order to examine the chemical reactions on the etched surface, X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry(SIMS) were done.

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산화막 식각 기구 연구를 위한 QMF Ion Beam 장치의 제작 (QMF Ion Beam System Development for Oxide Etching Mechanism Study)

  • 주정훈
    • 한국표면공학회지
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    • 제37권4호
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    • pp.220-225
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    • 2004
  • A new ion beam extraction system is designed using a simple ion mass filter and a micro mass balance and a QMS based detecting system. A quadrupole Mass Filter is used for selective ion beam formation from inductively coupled high density plasma sources with appropriate electrostatic lens and final analyzing QMS. Also a quartz crystal microbalance is set between a QMF and a QMS to measure the etching and polymerization rate of the mass selected ion beam. An inductively coupled plasma was used as a ion/radical source which had an electron temperature of 4-8 eV and electron density of $4${\times}$10^{11}$#/㎤. A computer interfaced system through 12bit AD-DA board can control the pass ion mass of the qmf by setting RF/DC voltage ratio applied to the quadrupoles so that time modulation of pass ion's mass is possible. So the direct measurements of ion - surface chemistry can be possible in a resolution of $1\AA$/sec based on the qcm's sensitivity. A full set of driving software and hardware setting is successfully carried out to get fundamental plasma information of the ICP source and analysed $Ar^{+}$ beam was detected at the $2^{nd}$ QMS.

대기압 저온 플라스마에 의한 ITO(Indium Tin Oxide)박막 식각의 수소(H$_2$)효과 (Effect of Hydrogen in ITO(Indium Tin Oxide) Thin Films Etching by Low Temperature Plasma at Atmospheric Pressure)

  • 이봉주
    • 대한전자공학회논문지SD
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    • 제39권8호
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    • pp.12-16
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    • 2002
  • 산화인듐(ITO)박막은 대기압 저온 플라스마에 의해 식각이 가능하다는 것을 확인했다. 식각은 수소유량 4 sccm에서 가장 깊게 발생하여, 120 /min를 나타내었다. 식각속도는 Hα*의 발광강도와 대응하였다. ITO박막의 식각 메커니즘은 Hα*에 의해 환원이 된후, 남게 된 금속 화합물은 CH*과 반응하여 기판으로부터 이탈한다고 생각된다. 식각은 식각시간 50초 이상에서부터, 기판온도 145℃ 이상부터 발생하기 시작하였다. 활성화 에너지는 Arrehenius plots으로부터 0.16eV(3.75kcal/mole)를 얻었다

Molecular Cloning and NMR Characterization of the Nonreceptor Tyrosine Kinase PTK6 SH3-SH2-Linker Domain

  • Lee, Young-Min;Ahn, Kyo-Eun;Ko, Sung-Geon;Lee, Weon-Tae
    • Bulletin of the Korean Chemical Society
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    • 제30권5호
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    • pp.1043-1046
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    • 2009
  • Human protein tyrosine kinase-6 (PTK6) is a member of the non-receptor protein tyrosine kinase family and it is found in two-thirds of all breast tumors. Very recently, we proposed that the SH3 domain of PTK6 interacts with the linker region (Linker) between the SH2 and kinase domains, proving that the interaction between SH3 domain and Linker plays an important role in auto-inhibition mechanism. Residues from 1 to 191 corresponding region of SH3-SH2-Linker (SH32L) of PTK6 was cloned into the pET32a expression vector with Tobbaco etch virus (TEV) protease enzyme site by sequence homology and 3D structural model. The purified PTK6-SH32L was determined as a monomer conformation in solution. The amide proton resonances in the $^{15}N-^{1}H$ 2D-HSQC spectrum suggest that PTK6-SH32L possesses disordered structural region of the flexible/unstructured linker region. In addition, the backbone amide proton chemical shifts of the SH3 domain in the PTK6-SH32L differ from that of the independent domain, indicating that intra-molecular interaction between SH3 and Linker in the PTK6-SH32L is present.