• Design & Manufacturing
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• v.14 no.3
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• pp.63-70
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• 2020

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.8
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• pp.872-878
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• 2008

Many industrial operations require continuous or nearly-continuous operation of machines, interruption of which can result in significant cost loss. The condition monitoring of these machines has received considerable attentions in recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is to develop a new type of smart sensor for on-line condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This system is capable for signal preprocessing task and analog to digital converter which is controlled by CPU. This sensor communicates with a remote site PC using TCP/IP protocols. The developed sensor executes performance tests for data acquisition accuracy estimations.

• Transactions of Materials Processing
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• v.31 no.5
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• pp.290-295
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• 2022

Recently, the use of high-tech ceramic parts in functional electronic parts, automobile parts and semiconductor equipment parts is increasing. These ceramics materials are required to have high reproducibility, reliability, large size and complex shapes. The researchers initiated the work to develop a new shaping method called gel casting, which allows high performance ceramic materials with a complex shape to be produced. The manufacturing process parameters of gel casting include uniform mixing of the initiator, bubble removal, and slip injection. In this study, we analyzed the dispersion and gelation characteristics according to the change in the additive content of the alumina slurry in the gel casting process. The alumina slurry for gel casting was prepared by mixing a solvent, a monomer and a dispersant through a ball mill. Alumina powder and a gelation initiator were added to the mixed solution, and ball milling was performed for 24 hours. A viscosity of 6,435 cps and a stable zeta potential value were obtained under the conditions of alumina powder content of 55 vol% and dispersant 2.0 wt%. After curing for 12 hours by adding aps 0.1wt%, TEMED 0.2wt%, and Monomer 3, 5wt%, it was possible to separate from the molding cup, confirming that the gelation was completed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.30-37
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• 2005

We present an air bridge type electrode system with tunable electrode distance for detecting electroactive biomolecules. It is known that the narrower gap between electrode fingers, the higher sensitivity in IDA (interdigitated array) electrode. In previous researches on IDA electrode, narrower patterning required much precise and expensive equipment as the gap goes down to nanometer scale. In this paper, an improved method is suggested to replace nano gap pattering with downsizing electrode distance and showed that the patterning can be replaced by thickness control using metal deposition methods, such as electroplating or metal sputtering. The air bridge type electrode was completed by the following procedures: gold patterning for lower electrode, copper electroplating, gold deposition for upper electrode, photoresist patterning for gold film support, and copper etching for space formation. The thickness of copper electroplating is the distance between upper and lower electrodes. Because the growth rate of electroplating is $0.5{\mu}m\;min^{-1}$, the distance is tunable up to hundreds of nanometers. Completed electrodes on the same wafer had $5{\mu}m$ electrode distance. The gaps between fingers are 10, 20, 30, and $40{\mu}m$ and the widths of fingers are 10, 20, 30, 40, and $50{\mu}m$. The air bridge type electrode system showed better sensitivity than planar electrode.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.448-452
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• 2007

Many industrial operations require continuous or nearly-continuous operation of machines, which if interrupted can result in significant financial loss. The condition monitoring of these machines has received considerable attention recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is the development of smart sensor using which can on-line perform condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This sensor can receive data in real-time or periodic time from MEMS accelerometer. Furthermore, this system is capable for signal preprocessing task (High Pass Filter, Low Pass Filter and Gain Amplifier) and analog to digital converter (A/D) which is controlled by CPU. A/D converter that converts 10bit digital data is used. This sensor communicates with a remote site PC using TCP/IP protocols. Wireless LAN contain IEEE 802.11i-PSK or WPA (PSK, TKIP) encryption. Developed sensor executes performance tests for data acquisition accuracy estimations.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.122-130
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• 2013

The demand and the supply are increasing sharply in accordance with the growth of the Memory Semiconductor Industry. The Flash Memory above all is being utilized substantially in the Industry of smart phone, the tablet PC and the System on Chip (SoC). The Flash Memory is divided into the NOR-type Flash Memory and the NAND-type Flash Memory. A lot of study such as the Built-In Self Test (BIST), the Built-In Self Repair (BISR) and the Built-In Redundancy Analysis (BIRA), etc. has been progressed in the NOR-type fash Memory, the study for the Built-In Self Test of the NAND-type Flash Memory has not been progressed. At present, the pattern test of the NAND-type Flash Memory is being carried out using the outside test equipment of high price. The NAND-type Flash Memory is being depended on the outside equipment as there is no Built-In Self Test since the erasure of block unit, the reading and writing of page unit are possible in the NAND-type Flash Memory. The Built-In Self Test equipped with 2 kinds of finite state machine based structure is proposed, so as to carry out the pattern test without the outside pattern test equipment from the NAND-type Flash Memory which carried out the test dependant on the outside pattern test equipment of high price.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.7 no.1
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• pp.219-227
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• 2017

Current military command information system uses electronic equipment a lot on which semiconductor chip is attached. It seems its' importance will increase more with latest information communication technology developing. Electronic equipment which uses electricity contains regular tolerance to high output electric signal. And EMC specification is the standardized of this electronic equipment's tolerance. On the other hand, the Institute of Atomic Energy Research has ever declared that high output electromagnetic pulse(EMP) will be broken out within the radius of 170Km when 10kt nuclear explosion occurs at an altitude of 40Km above Seoul. Then, the region suffer from the damage of most electronic equipments. Therefore, the norm to protect the influences in that case is defined by EMP protection specification. Most common electronic equipments meet the EMC norm, but there is no way to check whether they meet the EMP norm or not. That is because it is difficult to check whether they meet EMP protection norm and is on the matter of cost. Except inevitable cases, there is no review of checking whether they meet the norm or not. Considering the above, in this research, we speculate about the measures to improve military EMP protection ability by analyzing the EMC-EMP correlation and checking the EMP protection ability of general electronic equipment through the analysis.

• Journal of Industrial Convergence
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• v.19 no.3
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• pp.1-12
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• 2021

Even though there have been so much practical interests in industry, the relevant empirical researches are not sufficient. In this study, we try to identify the problems of matrix organization structure in the semiconductor industry and make suggestions for improvements. Also, we try to find out whether there are differences in the perceptions of the problems among ranks and teams. This study was conducted to the researchers in the matrix organization structure of the H-corp. research institute. The problems we found are as follows. The researchers agreed that the matrix organization structure is appropriate when highly professional members for the development of next-generation semiconductors are participated in the projects. They showed strong wills to participate and succeed in projects. However, the researchers felt that the equipments and manpowers were not enough and too much tasks and workloads were assigned to both the managers and members Also, in an open ended question, the researchers pointed out the problems of the matrix organization structure such as 'weak project manager's authority', 'communication and teamwork issues', 'non-obvious work priorities', 'compensation and benefit system', 'lack of research manpower and equipment'. From the strengths and weaknesses of the matrix organization structure of the semiconductor industry, we provide some suggestions for improvements.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.923-925
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• 2002

The existing contactless inductive coupler has many problems because of its large volume and high level of exciting current, so a new contactless inductive coupler is being required under the circumstances and the load requirement. For a contactless inductive coupler in the manufacturing equipment of semiconductor, the coupler's efficiency is low because of its small magnetic inductance and large leakage inductance. Moreover, the high frequency switching to increase energy density per unit volume increases the iron loss and the eddy current loss, so it must be considered deeply when selecting core materials. Therefore, this paper presents core materials and shape to improve the performance of the contactless inductive coupler according to the coil positions.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.186-188
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• 2003

The ZnO surge arrester is the protective device for limiting surge voltages on equipment by diverting surge current and returning the device to its original status. The occurrence of overvoltage appears in any phase to AC power supply system and it appears in mixing AC and impulse voltages, moreover because HVDC power supply system uses converter in semiconductor, it makes mixed DC and high harmonics voltages. In this study, the various mixed AC and DC voltages was made for investigating the degradation effect of ZnO arrester according to mixed voltage. As a result, the increase of DC component to mixed voltages causes the increase of resistive component of total leakage current to ZnO block. In changing V-I curve for mixed voltages, the cross-over point acts a factor as making the proper capacitor size of an equivalent circuit for ZnO block.