• 인터넷정보학회논문지
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• 제20권3호
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• pp.85-92
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• 2019

In this paper, we extract the quantitative relation data of activities from the workflow event log file recorded in the XES standard format and connect them to rediscover the workflow process model. Extract the workflow process patterns and proportions with the rediscovered model. There are four types of control-flow elements that should be used to extract workflow process patterns and portions with log files: linear (sequential) routing, disjunctive (selective) routing, conjunctive (parallel) routing, and iterative routing patterns. In this paper, we focus on four of the factors, disjunctive routing, and conjunctive path. A framework implemented by the authors' research group extracts and arranges the activity data from the log and converts the iteration of duplicate relationships into a quantitative value. Also, for accurate analysis, a parallel process is recorded in the log file based on execution time, and algorithms for finding and eliminating information distortion are designed and implemented. With these refined data, we rediscover the workflow process model following the relationship between the activities. This series of experiments are conducted using the Large Bank Transaction Process Model provided by 4TU and visualizes the experiment process and results.

• 산업공학
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• 제17권4호
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• pp.414-425
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• 2004

This study presents the decision of priority for optimal design guide to improve disassembly process. Disassembly process is divided into recognition, transfer and disassembly of assembly point and recognition, transfer and remove of grasp point. Significant influential factors are derived from analyzing the above process. And those factors are used for making the check list to evaluate the properties of parts in each process. Furthermore, the weight with considering disassembly process is also used to determine weight of each process. On the base of the above sequence, qualitative score of disassemblability of each process that is enabled to compare different disassembly processes can be acquired. Ultimately the score helps to decide the priority of design guide for disassembly process.

• Journal of Electrical Engineering and Technology
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• 제10권3호
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• pp.1138-1143
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• 2015

Effects of fabrication process variations on impedance of microelectrodes integrated on a neural probe were examined through equivalent circuit modeling and SPICE simulation. Process variation and the corresponding range were estimated based on experimental data. The modeling results illustrate that the process variation induced by metal etching process was the dominant factor in impedance variation. We also demonstrate that the effect of process variation is frequency dependent. Another process variation that was examined in this work was the thickness variation induced by deposition process. The modeling results indicate that the effect of thickness variation on impedance is negligible. This work provides a means to predict the variations in impedance values of microelectrodes on neural probe due to different process variations.

• International Journal of Automotive Technology
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• 제7권2호
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• pp.217-226
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• 2006

To maintain competitiveness in the modern automotive market, it is important to carry out process planning concurrently with new car development processes. Process planners need to make decisions concurrently and collaboratively in order to reduce manufacturing preparation time for developing a new car. Automated generation of a simulation model by using the integrated process plan database can reduce time consumed for carrying out a simulation and allow a consistent model to be used throughout. In this research, we developed a web-based system for concurrent and collaborative process planning and flow analysis for an automotive general assembly using web, database, and simulation technology. A single integrated database is designed to automatically generate simulation models from process plans without having to rework the data. This system enables process planners to evaluate their decisions quickly, considering various factors, and easily share their opinions with others. By using this collaborative system, time and cost put into the assembly process planning can be reduced and the reliability of the process plan would be improved.

• 산업경영시스템학회지
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• 제25권2호
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• pp.1-10
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• 2002

Process capability indices are widely used in industries and quality assurance system. In past years, process capability analysis have been used to characterize process performance on the basis of univariate quality characteristics. However, in actual manufacturing industrial, statistical process control (SPC) often entails characterizing or assessing processes or products based on more than one engineering specification or quality characteristic. Therefore, the analysis have to be required a multivariate statistical technique. This paper introduces to multivariate capability indices and then selects a multivariate process capability index incorporated both the process variation and the process deviation from target among these indices under the multivariate normal distribution. We propose a new multivariate capability index $MC_{pm}^+$ using quality loss function instead of the process variation and this index is compared with the proposed indices when quality characteristics are independent and dependent of each other.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• Design & Manufacturing
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• 제15권1호
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• pp.41-47
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• 2021

The Fine Blanking process is an effective precision shearing process that can obtain a smooth cutting surface and high product precision through a single blanking process. It is widely used in various manufacturing fields. However, shearing through this fine blanking process is only intended to minimize burrs, die rolls and fracture surfaces and does not completely remove them. Therefore, it is necessary to study the minimization of burrs, die rolls and fracture surfaces in the fine blanking process. In this study, a study was conducted on the relationship between the fracture surface and process conditions that occurred during product production using the fine blanking process. For this purpose, the shape of the V-ring indenter, the distance to the punch, and the pressure force, clearance, shear rate, and physical properties of the material were selected as process and design variables, and the relationship with the fracture surface according to each process and design condition was tested. It was analyzed through the Experimental Design Method.

• 시스템엔지니어링학술지
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• 제8권1호
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• pp.9-19
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• 2012

The Light Rail Transit Project is a large scaled project which takes several years in building a system. After construction, LRT system is operating for several tens of years. For these characteristics, the right application of systems engineering to LRT project greatly effects the project success. In this paper, we present systems engineering application model to LRT project i.e. SELRT which include systems engineering technical process, core technology management process, project support process. SELRT also has a module for the exchange of outputs in SE tool and PM tool. Systems engineering processes in SELRT mainly base on ISO/IEC 15288. In future, we expand the range of SE processes and improve the usability in SELRT. We expect that this model will contribute to improve the efficiency in LRT project and to success the LRT project.

• 디지털융복합연구
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• 제10권1호
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• pp.317-321
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• 2012

SW 개발 프로젝트 시, SW 품질 및 생산성 향상에 저해 되는 SW공학 가이드 부재가 존재한다. 그 중에서 SW공학 발전과 전문 SW공학 인력 양성의 필요성 인식이 존재하고 있다. SW공학 인력의 역량과 전문성을 강화시킬 수 있는 지속적 성장 체계 확립과 인력 활용 가이드 제시를 위하여 본 논문에서는 SW공학 표준 커리큘럼 개발을 소개한다. 프로젝트 수행 시 SW공학 표준 커리큘럼은 SW공학 전문 인력 확보를 위한 기준을 제시 하여, 조직 SW 공학 역량 강화를 할 수 있다. 본 연구에서는 SW개발 프로세스에 대해 설명하는 SW프로세스와 SW품질 교육과정을 소개하고자 한다.

• 시스템엔지니어링학술지
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• 제9권1호
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• pp.47-53
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• 2013

The object of this study is to define systematically for outputs of Verification Process among the system life cycle process based on ISO/IEC 15288 for power supply system, which is one of the importance sub-systems to configure the LRT system. Furthermore, to prevent various problem in advance that can occur in the Transition LRT's power supply to be completed Integration. For this purpose, traceability of verification requirement and outputs. should be managed to use verification for system requirement and data processing tool. by system engineering techniques of system life cycle process based on ISO/IEC 15288 to LRT system.