• Journal of information and communication convergence engineering
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• 제3권4호
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• pp.179-183
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• 2005

A photodiode capable of obtaining a sufficient photo/ dark current ratio at both forward bias state and reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as an insulator barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. A good quality alumina $(Al_2O_3)$ film is formed by oxidation of aluminum film using electrolyte solution of succinic acid. Alumina is used as a potential barrier between amorphous silicon and aluminum. It controls dark-current restriction. In case of photodiodes made by changing the formation condition of alumina, we can obtain a stable dark current $(\~10^{-12}A)$ in alumina thickness below $1000{\AA}$. At the reverse bias state of the negative voltage in ITO (Indium Tin Oxide), the photo current has substantially constant value of $5{\times}10^{-9}$ A at light scan of 100 1x. On the other hand, the photo/dark current ratios become higher at smaller thicknesses of the alumina film. Therefore, the alumina film is used as a thin insulator barrier, which is distinct from the conventional concept of forming the insulator barrier layer near the transparent conduction film. Also, the structure with the insulator thin barrier layer formed near the lower electrode, opposed to the ITO film, solves the interface problem of the ITO film because it provides an improved photo current/dark current ratio.

• 한국결정성장학회지
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• 제20권1호
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• pp.30-34
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• 2010

중고온용 열전 소재로 우수한 특성을 나타내는 $CoSb_3$계 소재의 열전 소자 제조를 위해 방전플라즈마 소결법을 이용하여 소결 및 Cu-Mo 전극 소재와의 접합을 동시에 실시하였다. $CoSb_3$ 내부로의 Cu 확산을 방지하기 위해 Ti을 중간층으로 삽입하였으며 열팽창계수의 조절을 위해 Cu : Mo = 3 : 7 부피비 조성을 선택하였다. 삽입된 Ti과 $CoSb_3$는 $TiSb_2$ 이 차상을 형성하면서 접합이 진행되었지만 접합 온도 및 접합 시간의 증가에 따라 TiSb 및 TiCoSb 등의 상의 형성에 의해 접합 계면에서 균열이 발생되어 접합 특성을 악화시키는 것으로 밝혀졌다.

• 한국기계가공학회지
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• 제20권6호
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• pp.100-107
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• 2021

As a significant technology in the smartization era promoted by the Fourth Industrial Revolution, the secondary battery industry has recently attracted significant attention. The demand for lithium-ion batteries (LIBs), which exhibit excellent performance, is considerably increasing in different industrial fields. During the manufacturing process of LIBs, it is necessary to join the cathode and anode sheets with thicknesses of several tens of micrometers to lead taps of the cathode and anode with thicknesses of several hundreds of micrometers. Ultrasonic welding exhibits excellent bonding when bonded with very thin plates, such as negative and positive electrodes of LIBs, and dissimilar and highly conductive materials. In addition, ultrasonic welding has a small heat-affected zone. In LIBs, Cu is mainly used as the negative electrode sheet, whereas Cu or Ni is used as the negative electrode tab. In this study, one or two electrode sheets (t0.025 mm Cu) were welded to one lead tab (t0.1 mm Cu). The welding energy and pressure were used as welding parameters to determine the welding strength of the interface between two or three welded materials. Finally, the effects of these welding parameters on the welding strength were investigated.

• Korean Chemical Engineering Research
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• 제60권1호
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• pp.62-69
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• 2022

그래핀은 부피에 비해 표면적이 넓고 뛰어난 기계적 물성과 전기전도성을 가지며 생체적합성이 우수하다. 본 연구에서는 전기화학적 방법을 이용하여 indium tin oxide (ITO) 글래스 슬라이드 표면에 산화그래핀을 증착·환원시킨 전극을 제작하였고 그래핀으로 표면 개질된 ITO의 전기화학적 특성을 조사하였다. 산화그래핀의 증착과 환원에 순환전압전류법을 사용하였다. 주사전자현미경과 에너지 분산형 X-선 분광법을 사용하여 그래핀이 코팅된 ITO 표면을 관찰하였다. 순환전압전류법과 전기화학 임피던스 분광법을 사용하여 제작된 전극들의 전기화학 특성을 평가하였다. 사이클 수와 주사 속도는 산화그래핀 증착과 환원도에 상당한 영향을 미쳤으며 제작된 전극의 전기화학 특성도 달랐다. ITO 전극에 비하여 그래핀으로 표면 개질된 ITO는 전극 계면에서의 전하 전달 저항이 낮았고 더 많은 전류를 생산하였다. 그래핀으로 표면 개질된 ITO 표면에 고정화된 포도당 산화효소는 포도당을 산화시키며 성공적으로 전자들을 생성하였다.

• Journal of Electrochemical Science and Technology
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• 제14권2호
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• pp.184-193
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• 2023

This study investigates the effects of a carbon fiber layer formed on the surface of an etched aluminum current collector on the electrochemical properties of the activated carbon electrodes for an electric double layer capacitor. A particle size analyzer, field-emission SEM, and nitrogen adsorption/desorption isotherm analyzer are employed to analyze the structure of the carbon fiber layer. The electric and electrochemical properties of the activated carbon electrodes using a carbon fiber layer are evaluated using an electrode resistance meter and a charge-discharge tester, respectively. To uniformly coat the surface with carbon fiber, we applied a planetary mill process, adjusted the particle size, and prepared the carbon paste by dispersing in a binder. Subsequently, the carbon paste was coated on the surface of the etched aluminum current collector to form the carbon under layer, after which an activated carbon slurry was coated to form the electrodes. Based on the results, the interface resistance of the EDLC cell made of the current collector with the carbon fiber layer was reduced compared to the cell using the pristine current collector. The interfacial resistance decreased from 0.0143 Ω·cm² to a maximum of 0.0077 Ω·cm². And degradation reactions of the activated carbon electrodes are suppressed in the 3.3 V floating test. We infer that it is because the improved electric network of the carbon fiber layer coated on the current collector surface enhanced the electron collection and interfacial diffusion while protecting the surface of the cathode etched aluminum; thereby suppressing the formation of Al-F compounds.

• 전자공학회논문지D
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• 제35D권5호
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• pp.33-39
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• 1998

The BST (Ba$_{1-x}$ Sr$_{x}$TiO$_{3}$)(50/50) thin film has been grown by RF magnetron reactive sputtering and its characteristics such as crystallization, surface roughness, and electrical properties have been investigated with varying the film thickness. The crystallization and surface roughness of BST thin film are investigated by using XRD and AFM, respectively The BST thin film anealed at 800.deg. C for 2 min has pure perovskite structure and good surface roughness of 16.1.angs.. We estimate that the thickness and dielectric constant of interface layer between BST film and electrode are 3nm and 18.9, respectively, by measuring the capacitance with various film thickness. As the film thickness increases form 80nm to 240nm, the dielectric constant at 10kHz increases from 199 to 265 and the leakage current density at 200kV/cm decreases from 0.682.mu.A/cm$^{2}$ to 0.181 .mu.A/cm$^{2}$. In the case of 240nm-thick BST thin film, the charge storage density and leakage current density at 5V are 50.5fC/.mu.m$^{2}$ and 0.182.mu.A/cm$^{2}$, respectively. The values indicate that the BST thin film is a very useful dielectric material for the DRAM capacitor.or.

• 한국결정학회지
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• 제2권2호
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• pp.32-40
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• 1991

The effects of compositional variation, rotation speel and pulling rate on the growth of optical quality Bi120e02(1 crystals were examined. It was found to flatten the shape of crystal-melt interface for yowing a single crystals less than about 30mm in diameter at the rotation speed of 50rpm. Diameter of crystals with flat interface was increased as the pulling rate. The precipitation of Bi40e3012 phase set limits to pulling rate of BGO crystals. Precipitate-free BGO crystals were grown under pulling rate of 2mm l hr which released the stress resulted from too hi어 Pulling rate, and from 6. IBi203·GeO2 batch composition obtained by addition of 0.1 mole Bi203 into Bi-deficient melts to fill up the deficiency resulted from gradual volatilization of Bi2O). The pale-yellow colored crystals had good quality in that dislocation density was less than 103pits/cm, and it also exhibited transmittance of 70% and optical activity of 23°/mm. and SAW velosity was measured 1700m/sec on 111 cut 110 propagating BGO crystals. The SAW filter with electrode thickness of 9.8um was fabricated by using the electron beam and dry etching technique, it makes Bi12GeO20 devices intersting for color TV IF with half device size.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1552-1555
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• 2005

We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared by variation of molecular weight and control of initial nucleation and growth of silver nanoparticles. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The fine line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• 한국전기전자재료학회논문지
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• 제18권7호
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• pp.594-599
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• 2005

In this paper, we report the properties of Mo metal employed as PMOS gate electrode. Mo on $SiO_2$ was observed to be stable up to $900^{\circ}C$ by analyzing the Interface with XRD. C-V measurement was performed on the fabricated MOS capacitor with Mo Bate on $SiO_2$. The stability of EOT and work-function was verified by comparing the C-V curves measured before and after annealing at 600, 700, 800, and $900^{\circ}C$. C-V hysteresis curve was performed to identify the effect of fired charge. Gate-injection and substrate-injection of carrier were performed to study the characteristics of $Mo-SiO_2$ and $SiO_2-Si$ interface. Sheet resistance of Mo metal gate obtained from 4-point probe was less than $10\;\Omega\Box$ that was much lower than that of polysilicon.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.9-12
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• 2004

This paper investigated the stability of Ta-Mo alloy on thin gate dielectric. Ta-Mo alloy was deposited by using co-sputtering process after thermal growing of 3.4nm and 4.2nm silicon dioxide. When the sputtering power of Ta and Mo were 100W and 70W, respectively, the suitable work function for NMOS gate electrode, 4.2eV, could obtain. To prove interface thermal stability of thin film gate dielectric and Ta-Mo alloy, rapid thermal annealing was performed at $600^{\circ}C$ and $700^{\circ}C$ for 10sec in Ar ambient. The results of interface reaction were surveyed by change of silicon dioxide thickness and work function after annealing process. Also, the reliability of alloy gate and gate dielectric could be confirmed by quantity of leakage current. Ta-Mo alloy was showed low sheet resistance and thermal stability, namely, little change of gate dielectric and work function, after $700^{\circ}C$ annealing process.