• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.

• Applied Science and Convergence Technology
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• v.26 no.5
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• pp.110-113
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• 2017

The two-dimensional layered $MoS_2$ has high mobility and excellent optical properties, and there has been much research on the methods for using this for next generation electronics. $MoS_2$ is similar to graphene in that there is comparatively weak bonding through Van der Waals covalent bonding in the substrate-$MoS_2$ and $MoS_2-MoS_2$ heteromaterial as well in the layer-by-layer structure. So, on the monatomic level, $MoS_2$ can easily be exfoliated physically or chemically. During the $MoS_2$ field-effect transistor fabrication process of photolithography, when using water, the water infiltrates into the substrate-$MoS_2$ gap, and leads to the problem of a rapid decline in the material's yield. To solve this problem, an epoxy-based, as opposed to a water-based photoresist, was used in the photolithography process. In this research, a hydrophobic $MoS_2$ field effect transistor (FET) was fabricated on a hydrophilic $SiO_2$ substrate via chemical vapor deposition CVD. To solve the problem of $MoS_2$ exfoliation that occurs in water-based photolithography, a PPMA sacrificial layer and SU-8 2002 were used, and a $MoS_2$ film FET was successfully created. To minimize Ohmic contact resistance, rapid thermal annealing was used, and then electronic properties were measured.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1061-1065
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• 1995

To improve dielectric and mechanical properties of insulating composite by plasma surface treatment, new plasma surface treatment process is designed with concentric and hemi-circle electrodes system, the plasma, which is generated between anode and cathode, is induced to the upper side of the electrode system and treats the surface of the insulators. The optimal surface treatment condition is that pressure : 0.5[torr], flux density 100[gauss], discharge current : 500[mA] and treatment time : 3 minutes. The composite filled with glass cloth surface-treated by plasma shows the improvement in electric and mechanical properties, comparing non- and coupling agent-treated samples.

• Journal of Institute of Control, Robotics and Systems
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• v.7 no.5
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• pp.399-406
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• 2001

This paper presents a dynamic modeling and a sliding mode controller for the high-speed/high-accuracy position control system. The selected target system is the wire bonder assembly which is used in the semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as an actuator and transducer horn as a bonding tool. For the modeling elements, the sys-tem is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.89-96
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• 2000

This paper describes the characteristic of die finishing to obtain smooth surface using electro-chemical grinding after cutting process. Electro-chemical grinding is possible under lower load and tool wear comparing with those in the mechanical grinding. Conventionally, if the metal bonding material of the grinding wheel is directly t contacted with workpiece, the current is circulated without electrolytic phenomena. Sometimes, electrical discharge is occurred between tool and workpiece. To cope with this problem, the metal-resin bonded pellet was used in this study. This pellet is composed of optimal volume of metal and resin powders and its characteristics are changable with the each volume of powders. Finally, high efficient die finishing is realized using metal resin bonded pellet in electro-chemical grinding.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.60_61
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• 2009

최근 국내에서 345kV GIL(Gas Insulated Transmission Lines) 시스템의 실 계통 도입이 검토되고 있다. 현재까지 GIL은 원자력 발전소에서 주변압기로부터 스위치 야드까지 1km 미만의 거리에 소규모로 설치되어 운영되고 있다. 하지만 향후 본격적으로 GIL 시스템이 도입된다면 발전소 구내뿐만 아니라 수 km 이상 되는 송전급 선로에도 적용될 것이 예상된다. 현재 GIL의 시스(외함)는 100~120m 정도마다 접지를 하는 직접접지 형태를 취하고 있으나 시스에 흐르는 순환전류가 부하전류의 97% 이상 된다. 따라서 이에 따른 손실이 많이 발생되고 있어 도체에 흘릴 수 있는 허용전류 값이 감소하게 된다. 본 논문에서는 GIL 시스템에 크로스본드 접지방식을 적용하였을 때 시스 순환전류 감소 효과에 대해서 검토하고, 아울러 뇌써지나 스위칭 써지에 의한 절연통의 열화 등에 대비하기 위하여 절연통보호장치의 설치 방안에 대해서 검토하였다.

• Proceedings of the KIEE Conference
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• 2008.10a
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• pp.129-130
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• 2008

In this paper, optimal DRIE process conditions for fused quartz are experimentally determined by Taguchi method to develop high-performance inertial sensors based on the fused quartz material, which is known to have high Q-factors. Using Si layer as an etch mask, which was formed by previously developed bonding process of the fused quartz and Si wafer, fused quartz DRIE process was performed. Different 9 flow rate conditions of $C_4F_8$, $O_2$, He gas have been tested and the optimum combination of these factors was estimated. By this work, the ability to fabricate high aspect ratio fused quartz structure was confirmed.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1718-1720
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• 2001

The route of surge arrester connection is very important because bends and kinds of leads increase the impedance to lightning surges and tend to nullify the effectiveness of a grounding electrode conductor. There is a need to know how effective installation of lightning surge arresters is made in order to control voltage and to absorb energy at high lightning currents. The effectiveness of a grounding conductor and bonding for 18[kV] metal oxide distribution line arresters was experimentally investigated with lightning and oscillating impulse voltages.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.157-161
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• 2007

There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.