Study for Inspection Method of Electronic Components Using 3-D X-ray Imaging Technology
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Sim, Hyeok-Hun
(서울산업대학교 메카트로닉스공학과)
Park, Gi-Nam (서울산업대학교 에너지환경전문대학원) Kim, Jong-Hyeong (서울산업대학교 기계설계자동화 공학부) Park, Hui-Jae (서울산업대학교 메카트로닉스 공학과) |
1 | Park, W. S., Kang, S. T., Kim, H. C. and Kim, S. K., 1996, Shape reconstruction of solder joints on PCB using laminography, pp. 264-267 |
2 | Lim, S. H., vatec company, 2003, X-ray based PCB Inspection System developmentpp. 12-29 |
3 | Richard, C., jaeger, 2002, Introduction To Micro electronic Fabrication, pp. 209-226 |
4 | Igoshev, V. I., Kleiman, J. I., Creep Phenomena in Lead-free Solders, Journal of Electronic Materials, Vol. 29, No. 2, 2000, pp. 46-65 |
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