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Study for Inspection Method of Electronic Components Using 3-D X-ray Imaging Technology  

Sim, Hyeok-Hun (서울산업대학교 메카트로닉스공학과)
Park, Gi-Nam (서울산업대학교 에너지환경전문대학원)
Kim, Jong-Hyeong (서울산업대학교 기계설계자동화 공학부)
Park, Hui-Jae (서울산업대학교 메카트로닉스 공학과)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.16, no.5, 2007 , pp. 157-161 More about this Journal
Abstract
There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.
Keywords
Tomography; Wire roop; Lead frame; Wire bonding; Raminography;
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