Abstract
There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.