• Title/Summary/Keyword: Drain engineering

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Thin Film Transistor fabricated with CIS semiconductor nanoparticle

  • Kim, Bong-Jin;Kim, Hyung-Jun;Jung, Sung-Mok;Yoon, Tae-Sik;Kim, Yong-Sang;Choi, Young-Min;Ryu, Beyong-Hwan;Lee, Hyun-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1494-1495
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    • 2009
  • Thin Film Transistor(TFT) having CIS (CuInSe) semiconductor layer was fabricated and characterized. Heavily doped Si was used as a common gate electrode and PECVD Silicon nitride ($SiN_x$) was used as a gate dielectric material for the TFT. Source and drain electrodes were deposited on the $SiN_x$ layer and CIS layer was formed by a direct patterning method between source and drain electrodes. Nanoparticle of CIS material was used as the ink of the direct patterning method.

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Improvement on the Stability of Amorphous Indium Gallium Zinc Oxide Thin Film Transistors Using Amorphous Oxide Multilayer Source/Drain Electrodes

  • Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.3
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    • pp.143-145
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    • 2016
  • In order to find suitable source and drain (S/D) electrodes for amorphous InGaZnO thin film transistors (a-IGZO TFTs), the specific contact resistance of interface between the channel layers and various S/D electrodes, such as Ti/Au, a-IZO and multilayer of a-IGZO/Ag/a-IGZO, was investigated using the transmission line model. The a-IGZO TFTs with a-IGZO/Ag/a-IGZO of S/D electrodes had good performance and low contact resistance due to the homo-junction with channel layer. The stability was measured with different electrodes by a positive bias stress test. The result shows the a-IGZO TFTs with a-IGZO/Ag/a-IGZO electrodes were more stable than other devices.

Assessment of Ambipolar Behavior of a Tunnel FET and Influence of Structural Modifications

  • Narang, Rakhi;Saxena, Manoj;Gupta, R.S.;Gupta, Mridula
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.4
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    • pp.482-491
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    • 2012
  • In the present work, comprehensive investigation of the ambipolar characteristics of two silicon (Si) tunnel field-effect transistor (TFET) architectures (i.e. p-i-n and p-n-p-n) has been carried out. The impact of architectural modifications such as heterogeneous gate (HG) dielectric, gate drain underlap (GDU) and asymmetric source/drain doping on the ambipolar behavior is quantified in terms of physical parameters proposed for ambipolarity characterization. Moreover, the impact on the miller capacitance is also taken into consideration since ambipolarity is directly related to reliable logic circuit operation and miller capacitance is related to circuit performance.

The gate delay time and the design of VCO using variable MOS capacitance

  • Ryeo, Ji-Hwan
    • Proceedings of the Korea Society of Information Technology Applications Conference
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    • 2005.11a
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    • pp.99-102
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    • 2005
  • In the paper, a proposed VCO based on bondwire inductances and nMOS varactors was implemented in a standard $0.25\;{\mu}m$ CMOS process. Using the new drain current model and a propagation delay time model equations, the operation speed of CMOS gate will predict the dependence on the load capacitance and the depth of oxide, threshold voltage, the supply voltage, the channel length. This paper describes the result of simulation which calculated a gate propagation delay time by using new drain current model and a propagation delay time model. At the result, When the reverse bias voltage on the substrate changes from 0 voltage to 3 voltage, the propagation delay time is appeared the delay from 0.8 nsec to 1 nsec. When the reverse voltage is biased on the substrate, for reducing the speed delay time, a supply voltage has to reduce. The $g_m$ value of MOSFET is calculated by using new drain current model.

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Impact of Energy Relaxation of Channel Electrons on Drain-Induced Barrier Lowering in Nano-Scale Si-Based MOSFETs

  • Mao, Ling-Feng
    • ETRI Journal
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    • v.39 no.2
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    • pp.284-291
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    • 2017
  • Drain-induced barrier lowering (DIBL) is one of the main parameters employed to indicate the short-channel effect for nano metal-oxide semiconductor field-effect transistors (MOSFETs). We propose a new physical model of the DIBL effect under two-dimensional approximations based on the energy-conservation equation for channel electrons in FETs, which is different from the former field-penetration model. The DIBL is caused by lowering of the effective potential barrier height seen by the channel electrons because a lateral channel electric field results in an increase in the average kinetic energy of the channel electrons. The channel length, temperature, and doping concentration-dependent DIBL effects predicted by the proposed physical model agree well with the experimental data and simulation results reported in Nature and other journals.

Compact Model of a pH Sensor with Depletion-Mode Silicon-Nanowire Field-Effect Transistor

  • Yu, Yun Seop
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.451-456
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    • 2014
  • A compact model of a depletion-mode silicon-nanowire (Si-NW) pH sensor is proposed. This drain current model is obtained from the Pao-Sah integral and the continuous charge-based model, which is derived by applying the parabolic potential approximation to the Poisson's equation in the cylindrical coordinate system. The threshold-voltage shift in the drain-current model is obtained by solving the nonlinear Poisson-Boltzmann equation for the electrolyte. The simulation results obtained from the proposed drain-current model for the Si-NW field-effect transistor (SiNWFET) agree well with those of the three-dimensional (3D) device simulation, and those from the Si-NW pH sensor model also agree with the experimental data.

A Study on the Horizontal Drainage Method Using Plastic Drain Board (플라스틱 배수재를 이용한 수평배수공법에 관한 연구)

  • 황정규;김홍택;김석열;강인규;김승욱
    • Geotechnical Engineering
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    • v.14 no.6
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    • pp.93-112
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    • 1998
  • In the present study, 2-D consolidation theory of the dredged clay by means of the horizontal drain method is proposed. The horizontal drain method to install the drains such as plastic drain board within the dredged clay is a soil improvement method to accelerate the consolidation by expelling pore water in the vertical direction along the horizontal drains. Based on the finite strain consolidation theory by Gibson et al., the partial differential equation of 2-D consolidation due to the horizontal drain is derived. The consolidation due to the horizontal drain can be illustrated from combined self-weight consolidation effect and consolidation effect by horizontal drains. For the prediction of consolidation settlement and degree of consolidation numerical analysis is suggested on the basis of Dufort-Frankel finite differential algorithm. Also, the analytical procedures proposed in this study are verified by the model tests, and the predictions of the consolidation settlement and degree of consolidation are compared with the results obtained from the tests for the dredged clay gathering at Siwha site in Ansan, Korea. For the predictions, the relationship void ratio vs effective stress and the relationship permeability vs void ratio of the dredged clay are obtained from the odometer tests. Additionally, the parametric study for consolidation settlement by variations of design parameters related with horizontal drain method is carried out. Based on the results of the parametric study, design .charts for the preliminary design are also proposed.

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A comparative analysis of domestir vs. overseas postgraduate education in science and technology

  • Kim, Ji-Soo
    • Journal of the Korean Operations Research and Management Science Society
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    • v.10 no.2
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    • pp.65-74
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    • 1985
  • Domestic versus overseas postgraduate education in science and engineering has its own advantages and disadvantages. One of the issues involved in developing countries is the problem of brain drain. This study deals with the cost and benefit of domestic and foreign education, problems in brain drain and the social and private rate of return analysis in postgraduate science and technology education in Korea.

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Analytical Threshold Voltage Modeling of Surrounding Gate Silicon Nanowire Transistors with Different Geometries

  • Pandian, M. Karthigai;Balamurugan, N.B.
    • Journal of Electrical Engineering and Technology
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    • v.9 no.6
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    • pp.2079-2088
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    • 2014
  • In this paper, we propose new physically based threshold voltage models for short channel Surrounding Gate Silicon Nanowire Transistor with two different geometries. The model explores the impact of various device parameters like silicon film thickness, film height, film width, gate oxide thickness, and drain bias on the threshold voltage behavior of a cylindrical surrounding gate and rectangular surrounding gate nanowire MOSFET. Threshold voltage roll-off and DIBL characteristics of these devices are also studied. Proposed models are clearly validated by comparing the simulations with the TCAD simulation for a wide range of device geometries.