• Journal of the Korean Society of Industry Convergence
• /
• v.21 no.6
• /
• pp.265-271
• /
• 2018

DC-DC buck converter is a critical building block in the power management integrated circuit (PMIC) architecture for the portable devices such as cellular phone, personal digital assistance (PDA) because of its power efficiency over a wide range of conversion ratio. To ensure a safe operation, avoid unexpected damages and enhance the reliability of the converter, fully-integrated protection circuits such as over voltage protection (OVP), under voltage lock out (UVLO), startup, and thermal shutdown (TSD) blocks are designed. In this paper, these three fully-integrated protection circuit blocks are proposed for use in the DC-DC buck converter. The buck converter with proposed protection blocks is operated with a switching frequency of 1 MHz in continuous conduction mode (CCM). In order to verify the proposed scheme, the buck converter has been designed using a 180 nm CMOS technology. The UVLO circuit is designed to track the input voltage and turns on/off the buck converter when the input voltage is higher/lower than 2.6 V, respectively. The OVP circuit blocks the buck converter's operation when the input voltage is over 3.3 V, thereby preventing the destruction of the devices inside the controller IC. The TSD circuit shuts down the converter's operation when the temperature is over $85^{\circ}C$. In order to verify the proposed scheme, these protection circuits were firstly verified through the simulation in SPICE. The proposed protection circuits were then fabricated and the measured results showed a good matching with the simulation results.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07a
• /
• pp.692-696
• /
• 2005

In an attempt to fabricate all inclusive display systems we are presenting a study on several elements that would be used as building blocks for all-on-board integrated applications on stainless steel foils. These systems would include in the same substrate all or many of the components needed to drive a flat panel OLED display. We are reporting results on both digital and analog circuits on stainless steel foils. Shift registers running at speeds greater than 1.0MHz are shown as well as oscillators operating at over 40MHz. Pixel circuits for driving organic light emitting diodes are presented. The device technology of choice is that based on poly-silicon TFT technology as it has the potential of producing circuits with good performance and considerable cost savings over the established processes on quartz or glass substrates (amorphous Silicon a-Si:H or silicon on Insulator SOI).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.353-356
• /
• 1996

Ultra-high-speed analog and digital ICs (integrated circuits) fur 10Gbit/sec optical communication systems have been designed, fabricated and analyzed in this research. These circuits, which are laser diode (LD) driver, pre-amplifier, automatic gain controlled (AGC) amplifier, limiting amplifier and decision circuit, have been implemented with AIGaAs/GaAs heterojunction bipolar transistors (HBTs). The optimized AIGaAs/GaAs HBTs for the 10Gbps circuits in this work showed the cutoff and maximum oscillation frequencies of 65㎓ and 53㎓, respectively. It is demonstrated in this paper that the 10Gbps optical communication system can be realized with the ICs designed and fabricated using AlGaAs/GaAs HBTs.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.8 no.3
• /
• pp.210-220
• /
• 2008

We review three examples (an on-chip transmission line resonator [1], a phase-locked loop [2], and an analog-to-digital converter [3]) of design tradeoffs which can in fact be circumvented; the key in each case is that the parameters that seem to trade off with each other are actually separated in time or space. This paper is an attempt to present these designs in such a way that this common approach can hopefully be applied to other circuits. We note reader that this paper is not a new contribution, but a review in which we highlight the common theme from our published works [1-3]. We published a similar paper [4], which, however, used only two examples from [1] and [2]. With the newly added content from [3] in the list of our examples, the present paper offers an expanded scope.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.4 no.3
• /
• pp.196-203
• /
• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.10 no.10
• /
• pp.1804-1809
• /
• 2006

The aim of this Paper is to describe the implementation of a low-power digital front-End Design (FED) that will act as the core of a stand-alone Power dissipation methodology. The design of digital integrated circuits is a large and diverse area, and we have chosen to focus on low power FED. Designs are made from synthesized logic, and we need to consider the low power digital FED including input clock, buffer, latches, voltage regulator, and capacitance-to-voltage counter which have been integrated onto hish bandwidth communication chips and system. These single- chip micro instruments, implemented in a 0.12um CMOS technology operate with a single 0.9V supply voltage, and can be used to monitor dynamic and static power dissipation, Vesture, acceleration junction temperature (Tj), etc.

• ETRI Journal
• /
• v.37 no.6
• /
• pp.1154-1164
• /
• 2015

This paper proposes a fully sensorless driver for a permanent magnet synchronous motor (PMSM) integrated with a digital motor controller and an analog pre-driver, including sensing circuits and estimators. In the motor controller, a position estimator estimates the back electromotive force and rotor position using a sliding-mode observer. In the pre-driver, drivers for the power devices are designed with a level shifter and isolation technique. In addition, a current sensing circuit measures a three-phase current. All of these circuits are integrated in a single chip such that the driver achieves control of the speed with high accuracy. Using an IC fabricated using a $0.18{\mu}m$ BCDMOS process, the performance was verified experimentally. The driver showed stable operation in spite of the variation in speed and load, a similar efficiency near 1% compared to a commercial driver, a low speed error of about 0.1%, and therefore good performance for the PMSM drive.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.35 no.6
• /
• pp.556-563
• /
• 2007

The current trend of low cost ultra-small satellites is to utilize Commercial Off the Shelf (COTS) parts to save cost, and accordingly, Command and Data Handling (C&DH) that operates the satellite and collects/processes the data is also designed and developed around commercial controllers. However, functionalities of commercial controllers are limited according to the specs outlined by the manufacturer. In order for the commercial controllers to be used for satellites where variety of interfaces is required, a separate interface circuit is required. Therefore, a Multi Digital Data Control System (MDDCS) using Field Programmable Gate Array (FPGA) has been developed in order to expand multiple digital interfaces that are not supported by the commercial controller, and also to compensate for SEU. This has been implemented on Actel A3P1000 using Very High Speed Integrated Circuits Hardware Description Language (VHDL).

• Journal of IKEEE
• /
• v.2 no.1 s.2
• /
• pp.34-41
• /
• 1998

An integrated circuit for magnetic stripe storage system is implemented. All the analog and digital circuits are integrated in one chip. The analog block contains preamplifier, peak detecter, comparator and reference generater. And digital block includes reference window signal generater, up/down counter for F/2F signal measurement, bit-error detection logic, and control logic. Both the encoding and decoding functions for F/2F signal processing are provided. An AGC(automatic gain control) circuit which was included in conventional circuits is eliminated due to optimized circuit design. Misreading prevention circuits are also proposed by fixing up new reference bit when broken bits are detected. The prototype chip is implemented using $0.8{\mu}m$ N-well CMOS technology and operates from 3.3 V to 7.5 V of supply voltage. It occupies a die area of $3.04mm^2(1.6mm{\times}1.9mm)$ and dissipates 8 mW with a 5 V supply voltage.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.5 no.1
• /
• pp.54-59
• /
• 1980

Adaptive version of the delta modulator that is akin to wyllabic companding for telephony is described. A digital technique is used to sense the slope of the input signal and to control the amplitude of the pulses supplied to the RC network in the feed back loop. Thus the development was stimulated by the suitability of delta modulator for low-cost integrated circuits. Analysis are made of the optimum overload characteristics, stability, SNR for improving the frequency range and these results have been esperimentally verfied.