• Title/Summary/Keyword: Deposition property

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Plasma Surface Modification of Polystyrene Foam for Recycling 1. Hydrophilic Thin Film Deposition from Acrylamide (Polystyrene Foam의 재활용을 위한 플라즈마 표면개질 1. 아크릴아미드에 의한 친수성 박막생성)

  • Seo, Eun-Deock
    • Polymer(Korea)
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    • v.32 no.5
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    • pp.497-500
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    • 2008
  • Polystyrene foam (styrofoam) was treated with low-temperature oxygen plasma by means of immobilization and grafting techniques in order to modify its hydrophobic surface property to hydrophilic one using hydrophilic monomers of acrylic acid and acrylamide, and its surface chemical structure, morphology, and hydrophilicity were examined by ESCA, field emission scanning electron microscope (FESEM), and contactangle meter. The experimental evidences, such as the increases of O/C and N/C ratios in ESCA spectrum, thin film deposition, decrease in contact-angle, strongly suggested that the plasma treatments were useful methods for the preparation of hydrophilic surface. Contact angle diminished drastically from $84^{\circ}$ to $18{\sim}19^{\circ}$. Acrylamide, compared to acrylic acid, appeared to play a decisive role, and to be more powerful agent for improving its surface hydrophilicity.

Terahertz time domain spectroscopy of GdBCO superconducting thin films

  • Ji, Gangseon;Park, Woongkyu;Lee, Hyoung-Taek;Song, Chang-Yun;Seo, Choongwon;Park, Minjo;Kang, Byeongwon;Kim, Kyungwan;Kim, Dai-Sik;Park, Hyeong-Ryeol
    • Progress in Superconductivity and Cryogenics
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    • v.21 no.1
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    • pp.15-17
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    • 2019
  • We present terahertz optical properties of $GdBa_2Cu_3O_{7-x}$ (GdBCO) superconducting thin films. GdBCO films with a thickness of about 105 nm were grown on a $LaAlO_3$ (LAO) single crystal substrate using a conventional pulsed laser deposition (PLD) technique. Using an Ar ion milling system, the thickness of the GdBCO film was reduced to 58 nm, and its surface was also smoothened. Terahertz (THz) transmission spectra through two different GdBCO films are measured over the range between 0.2 and 1.5 THz using THz time domain spectroscopy. Interestingly, the THz transmission of the thinner GdBCO film has been increased to six times larger than that of the thicker one, while the thinner film is still maintaining its superconducting property at below 90 K.

Evaluation of cryogenic tensile properties of composite materials fabricated by fused deposition modeling 3D printer

  • Kang, Singil;Cha, Hojun;Ryu, Seungcheol;Kim, Kiwhan;Jeon, Seungmin;Lee, Jaesun;Kim, Seokho
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.1
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    • pp.8-12
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    • 2022
  • Recently, research on applying composite materials to various industrial fields is being actively conducted. In particular, composite materials fabricated by Fused Deposition Modeling 3D printers have more advantages than existing materials as they have fewer restrictions on manufacturing shape, reduce the time required, weight. With these advantages, it is possible to consider utilizing composite materials in cryogenic environments such as the application of liquid oxygen and liquid hydrogen, which are mainly used in an aerospace and mobility. However, FDM composite materials are not verified in cryogenic environments less than 150K. This study evaluates the characteristics of composite materials such as tensile strength and strain using a UTM (Universal Testing Machine). The specimen is immersed in liquid nitrogen (77 K) to cool down during the test. The specimen is fabricated using 3D print, and can be manufactured by stacking reinforced fibers such as carbon fiber, fiber glass, and aramid fiber (Kevlar) with base material (Onyx). For the experimental method and specimen shape, international standards ASTM D638 and ASTM D3039 for tensile testing of composite materials were referenced.

Promoting Photoelectrochemical Performance Through the Modulation of MoS2 Morphology (MoS2의 형상변조를 통한 광전기화학 성능 촉진)

  • Seo, Dong-Bum;Kim, Eui-Tae
    • Korean Journal of Materials Research
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    • v.32 no.1
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    • pp.30-35
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    • 2022
  • The development of advanced materials to improve the efficiency of photoelectrochemical (PEC) water splitting paves the way for widespread renewable energy technologies. Efficient photoanodes with strong absorbance in visible light increases the effectiveness of solar energy conversion systems. MoS2 in a two-dimensional semiconductor that has excellent absorption performance in visible light and high catalytic activity, showing considerable potential as an agent of PEC water splitting. In this study, we successfully modulated the MoS2 morphology on indium tin oxide substrate by using the metalorganic chemical vapor deposition method, and applied the PEC application. The PEC photocurrent of the vertically grown MoS2 nanosheet structure significantly increased relative to that of MoS2 nanoparticles because of the efficient transfer of charge carriers and high-density active sites. The enhanced photocurrent was attributed to the efficient charge separation and improved light absorption of the MoS2 nanosheet structure. Meanwhile, the photocurrent property of thick nanosheets decreased because of the limit imposed by the diffusion lengths of carriers. This study proposes a valuable photoelectrode design with suitable nanosheet morphology for efficient PEC water splitting.

Compressive Properties of 3D Printed TPU Samples with Various Infill Conditions (채우기 조건에 따른 3D 프린팅 TPU 샘플의 압축 특성)

  • Jung, Imjoo;Lee, Sunhee
    • Journal of the Korean Society of Clothing and Textiles
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    • v.46 no.3
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    • pp.481-493
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    • 2022
  • This study investigated process conditions for 3D printing through manufacturing thermoplastic polyurethane (TPU) samples under different infill conditions. Samples were prepared using a fused deposition modeling 3D printer and TPU filament. 12 infill patterns were set (2D: grid, lines, zigzag; 3D: triangles, cubic, cubic subdivision, octet, quarter cubic; 3DF: concentric, cross 3D, cross, honeycomb), with 3 infill densities (20%, 50%, 80%). Morphology, actual time/weight and compressive properties were analyzed. In morphology: it was found that, as infill density increased, the increase rate of the number of units rose for 2D and fell for 3DF. Printing time varied with the number of nozzle movements. In the 3DF case, the number of nozzle movements increased rapidly with infill density. Sample weight increased similarly. However, where the increase rate of the number of units was low, sample weight was also low. In compressive properties: compressive stress increased with infill density and stress was high for the patterns with layers of the same shape.

THE EFFECT OF THE HIGH DENSITY PLASMA ON THE DIAMOND-LIKE CARBON FILMS

  • Kim, H.;D.H. Jung;Park, B.;K. C. Yoo;Lee, J. J.;J. H. Joo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2003.10a
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    • pp.54-54
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    • 2003
  • DLC films were deposited on Si(100) substrates by inductively coupled plasma (ICP) assisted chemical vapor deposition (CVD). A mixture of acetylene (C$_2$H$_2$) and argon (Ar) gases was used as the precursor and plasma source, respectively. The structure of the films was characterized by the Raman spectroscopy. Results from the Raman spectroscopy analysis indicated that the property change of the DLC films is due to the sp$^3$ and sp$^2$ ratio in the films under various conditions such as ICP power, working pressure and RF substrate bias. The hydrogen content in the DLC films was determined by an electron recoil detector (ERB). The roughness of the films was measured by atomic force microscope (Am). A microhardness tester was used for the hardness and elastic modulus measurement. The DLC film showed a maximum hardness of 37㎬. In this work, the relationship between deposition parameters and mechanical properties were discussed.

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Evaluation of mechanical properties of polylactic acid and photopolymer resin processed by 3D printer fused deposition modeling and digital light processing at cryogenic temperature

  • Richard G. Pascua;Gellieca Dullas;SangHeon Lee;Hyung-Seop Shin
    • Progress in Superconductivity and Cryogenics
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    • v.26 no.2
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    • pp.19-23
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    • 2024
  • 3D printing has the advantage of being able to process various types of parts by layering materials. In addition to these advantages, 3D printing technology allows models to be processed quickly without any special work that can be used in different fields to produce workpieces for various purposes and shapes. This paper deals to not only increase the utilization of 3D printing technology, but also to revitalize 3D printing technology in applications that require similar cryogenic environments. The goal of this study is to identify the mechanical properties of polylactic acid and photopolymer resin processed by Fused Deposition Modeling (FDM) and Digital Light Processing (DLP) respectively. The entire process is meticulously examined, starting from getting the thermal contraction using an extensometer. A uniaxial tensile test is employed, which enables to obtain the mechanical properties of the samples at both room temperature (RT) and cryogenic temperature of 77 K. As the results, photopolymer resin exhibited higher tensile properties than polylactic acid at RT. However, at cryogenic temperatures (77 K), the photopolymer resin became brittle and failure occurred due to thermal contraction, while polylactic acid demonstrated superior tensile properties. Therefore, polylactic acid is more suitable for lower temperatures.

A Study for the Mechanical Properties with Infill Rate in FDM Process to Fabricate the Small IoT Device (소형 IoT 기기 제작을 위한 FDM 프린팅 공정에서의 내부채움에 따른 물성치 변화 연구)

  • Ahn, Il-Hyuk
    • Journal of Internet of Things and Convergence
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    • v.6 no.3
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    • pp.75-80
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    • 2020
  • Recently, the size of the IoT sensor has been decreased and the collecting direction of the IoT sensor for acquiring the data have been changed from 2D to 3D. It makes sensor structure complex. In the fabrication of the complex structure, 3D printing technology has more useful than traditional manufacturing technologies. Among 3D printing technologies, FDM (fused deposition modeling) is a candidate technology to fabricate a small IoT sensor because the price of the machine and the material is cheap. In the FDM process, a 3D shape is made by depositing the melted filament. Recently, the patent of FDM technology is expired and cheat machines are developed based on the open-source. In the FDM process, mechanical properties of a fabricated part is affected by a lots of factors such as the kind of material and process parameters. Among them, infill is affecting the mechanical properties and the production lead time as well. In this work, a new method to optimize the FDM process with the consideration of mechanical property and production lead time was proposed. To verify the method, the fabrications were performed with the different infill rates. The results of tensile tests were analyzed to verify the proposed method.

Effects of Pretreatments of PET Substrate on the Adhesion of Copper Films Prepared by a Room Temperature ECR-MOCVD Method (PET 기질의 전처리효과가 상온 ECR 화학증착법에 의해 증착된 구리박막의 계면접착력에 미치는 영향)

  • Hyun Jin;Jeon Bupju;Byun Dongjin;Lee Joongkee
    • Korean Journal of Materials Research
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    • v.14 no.3
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    • pp.203-210
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    • 2004
  • Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

Silicide Formation of Atomic Layer Deposition Co Using Ti and Ru Capping Layer

  • Yoon, Jae-Hong;Lee, Han-Bo-Ram;Gu, Gil-Ho;Park, Chan-Gyung;Kim, Hyung-Jun
    • Korean Journal of Materials Research
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    • v.22 no.4
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    • pp.202-206
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    • 2012
  • $CoSi_2$ was formed through annealing of atomic layer deposition Co thin films. Co ALD was carried out using bis(N,N'-diisopropylacetamidinato) cobalt ($Co(iPr-AMD)_2$) as a precursor and $NH_3$ as a reactant; this reaction produced a highly conformal Co film with low resistivity ($50\;{\mu}{\Omega}cm$). To prevent oxygen contamination, $ex-situ$ sputtered Ti and $in-situ$ ALD Ru were used as capping layers, and the silicide formation prepared by rapid thermal annealing (RTA) was used for comparison. Ru ALD was carried out with (Dimethylcyclopendienyl)(Ethylcyclopentadienyl) Ruthenium ((DMPD)(EtCp)Ru) and $O_2$ as a precursor and reactant, respectively; the resulting material has good conformality of as much as 90% in structure of high aspect ratio. X-ray diffraction showed that $CoSi_2$ was in a poly-crystalline state and formed at over $800^{\circ}C$ of annealing temperature for both cases. To investigate the as-deposited and annealed sample with each capping layer, high resolution scanning transmission electron microscopy (STEM) was employed with electron energy loss spectroscopy (EELS). After annealing, in the case of the Ti capping layer, $CoSi_2$ about 40 nm thick was formed while the $SiO_x$ interlayer, which is the native oxide, became thinner due to oxygen scavenging property of Ti. Although Si diffusion toward the outside occurred in the Ru capping layer case, and the Ru layer was not as good as the sputtered Ti layer, in terms of the lack of scavenging oxygen, the Ru layer prepared by the ALD process, with high conformality, acted as a capping layer, resulting in the prevention of oxidation and the formation of $CoSi_2$.