• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of Mechanical Science and Technology
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• 제19권2호
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• pp.649-654
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• 2005

This paper presents fabrication and drive test of a peristaltic PDMS micropump actuated by the thermopneumatic force. The micropump consists of the three peristaltic-type actuator chambers with microheaters on the glass substrate and a microchannel connecting the chambers and the inlet/outlet port. The micropump is fabricated by the spin-coating process, the two-step curing process, the JSR (negative PR) molding process, and etc. The diameter and the thickness of the actuator diaphragm are 2.5 mm and $30{\mu}m$, respectively. The meniscus motion in the capillary tube is observed with a video camera and the flow rate of the micro pump is calculated through the frame analysis of the recorded video data. The maximum flow rate of the micropump is about $0.36\;{\mu}L/sec$ at 2 Hz for the zero hydraulic pressure difference when the 3-phase input voltage is 20 V.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1174-1177
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• 2003

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation was studied with numerical method by ABAQUS S/W. Polymer (PMMA) and brittle materials (Si, Pyrex glass) were used as specimens, and forming conditions to reduce the elastic recover and pile-up was proposed. The indenter was modeled a 3D rigid surface. Minimum mesh sizes of specimens are 1-10nm. Comparison between the experimental data and numerical result demonstrated that the finite element approach is capable of reproducing the loading-unloading behavior of a nanoindentation test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

• 한국정밀공학회지
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• 제22권11호
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• pp.173-181
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• 2005

We report on the design and fabrication of an electrostatic 2-axis MEMS stage possessing a platform with a size of $5{times}5mm^2$. The stage, as a key component, would be used in developing probe-based storage devices in the future. It was fabricated by forming numerous $5{\times}5{\mu}m^2$ etching holes in the central platform, as a result, reducing the total number of masks to 1, thereby simplifying the whole fabrication process. Experimental results show that the driving range of the stage was $32{\mu}m$ at the supplied voltage of 20V and the natural frequency was approximately 300Hz. The mechanical coupling between x- and y-motion was also measured and verified to be $25\%$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1992년도 추계학술대회 논문집
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• pp.84-89
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• 1992

The polycrystalline $CuInS_2$ thin films are prepared by vacuum heat treatment of layer, which is deposited by vaccum evaporation in order. The electrical and optical properties of the films are investigated at various sulfur deposition mole rate, substrate temperature, heat treatment temperature and time. From data, n type-$CuInS_2$ exhibits resistivity, transmittance and energy band gap with 142[${\Omega}{\cdot}cm$], 73[%], and 1.5[eV] respectively at optimum fabrication condition. Finally, the films are fabricated with chalcoprite structure.

• 산업공학
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• 제21권2호
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• pp.141-150
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• 2008

In this paper, an efficient control method for semiconductor fabrication process is presented. Generally, control is performed with data which is under the influence of process disturbance. EWMA is one of the most popular control methods in semiconductor fabrication that effectively deals with varying process condition. A new method using EWMA, called the Dual Damping EWMA, is presented in this study to reduce over-control by separating weight factor of input and output. The goal is to reflect Drift but reduce the effects of White noise in run to run control. Simulation is performed to evaluate the performance of DPEWMA and to compare with EWMA and Double EWMA.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.181-184
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• 2002

In these day, fabrication technologies for micro parts become more important with the increase of interest on microsystem and developed through the various approaches in the whole world. Among these technologies; micro mechanical machining is one of the most effective methods for the fabrication of micro parts. In this study, we fabricated micro shafts using micro endmill and micromachining system and measured the cutting force at the process. Also, Based on the data, we simulated the deformation of micro shafts due to the cutting force. Through the simulation results, it was verified that the cutting force at the process is enough to cause dimensional error at the micro shafts.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 학술대회 논문집
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• pp.92-94
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• 2003

In superconductive digital logic circuits, D2 cells can be used to compose a decoder an important component of an Arithmetic Logic Unit (ALU). In this wor, we simulated D2 cell by using WRspice. D2 cell has one input, one switch input, and two outputs (output1 and output2). D2 cell functions in such way that output1 follows the input and output2 is the complement of the input data, when the switch input is "0, ". However, when there is a switch input "1, " the opposite output signals are generated. In this paper, we optimized a D2 cell by using WRspice, and obtained the minimum margin of 26%. Our optimized D2 cell will play a key role in the ALU fabrication.the ALU fabrication.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 A
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• pp.141-143
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• 1994

In this paper, an electrostatic micro-actuator is fabricated using flat p+ diaphragm. To avoid the buckling of the flat p+ diaphragm, the processes are designed appropriately. The fabrication processes of the actuator are the anisotropic etching with EPW, the boron diffusion process, Al deposition and the silicon to glass bonding using the negative photoresist. The distance between the p+ and Al electrodes is $10{\mu}m$, and the thickness of the p+ diaphragm is $2{\mu}m$. The measurement of the characteristic of the actuator is performed at 50V. The center displacement of the diaphragm is $1.5{\mu}m$ at 10Hz. In comparison with the experimental data of the actuator with corrugated diaphragm, it is confirmed that the actuator with flat diaphragm is more effective than that with corrugated one in the small deflection region.

• 국제학술발표논문집
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• The 1th International Conference on Construction Engineering and Project Management
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• pp.1193-1198
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• 2005

The pre-assembly takes a large portion of the fabrication cost of steel bridges. In order to save the fabrication cost through the improvement of the conventional pre-assembling process, this research investigates a numerical pre-assembly simulation as an alternative to current pre-assembling process. The 3D laser scanning was utilized in site and measuring data for steel box were analyzed. The productivity of pre-assembly simulation system is compared with the conventional pre-assembling system. This paper identifies feasibility on the alternative pre-assembling process and then proposes the scheme of the pre-assembly simulation system development satisfying the current pre-assembly inspection of standards.