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D. M. Kim, J. H. Ryu and M. Y. Jeong, "Optical Packaging and Interconnection Technology", J. Microelectron. Packag. Soc., 19(4), 13 (2012).
DOI
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J. H. Ryu, M. K. Kim, E. S. Kim and M. Y. Jeong, "Optical PCB and Packaging Technology", J. Microelectron. Packag. Soc., 18(1), 7 (2011).
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D. M. Kim, T. K. Lee, T. H. Lee and M. Y. Jeong, "Design for High-Efficient Passive Optical PCB Interconnection by Using Built-in Lens Structure", J. Microelectron. Packag. Soc., 19(2), 47 (2012).
DOI
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F. E. Doany, C. L. Schow, B. G. Lee, R. A. Budd, C. W. Baks, C. K. Tsang, J. U. Knickerbocker, R. Dangel, B. Chan, H. Lin, C. Carver, J. Huang, J. Berry, D. Bajkowski, F. Libsch and J. A. Kash, "Terabit/s-Class Optical PCB Links Incorporating 360Gb/s Bidirectional 850 nm Parallel Optica Transceivers", Journal of lightwave technology, 30(4), 560 (2012).
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ScienceOn
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F. Y. Chang, C. Y. Cheng, S. W. Chau, J. P. Chu and Y. C. Chen, "Fabrication of Mg-based bulk metallic glass molds by thermal imprint process", Intermetallics, 30, 35 (2012).
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J. J. Dumond, K. A. Mahabadi, Y. S. Yee, C. Tan, J. Y. H. Fuh, H. P. Lee and H. Y. Low, "High Resolution UV roll-toroll nanoimprinting of resin moulds and subsequent replication via thermal nanoimprint lithography", Nanotechnology, 23, 9 (2012).
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J. H. Ryu, T. H. Lee, I. K. Cho, C. S. Kim and M. Y. Jeong, "Simple fabrication of a double-layer multi-channel optical waveguide using passive alignment", Optics Express, 19(2), 1183 (2011).
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K. Dhima, A. Mayer, S. Wang, S. Mollenbeck and H. C. Scheer, "A novel processing procedure for Y/UV-NIT with negative tone resists", Microelectronic Engineering, 110, 85 (2013).
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A. Finn, B. Lu, R. Kirchner, X. Thrun, K. Richter and W. J. Fischer, "High aspect ratio pattern collapse of polymeric UVnano-imprint molds due to cleaning", Microelectronic Engineering, 110, 112 (2013).
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