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http://dx.doi.org/10.6117/kmeps.2015.22.1.001

Fabrication for Optical Layer and Packaging Technology of Optical PCB  

Kim, Taehoon (Department of Cogno-Mechatronics Engineering, Pusan National University)
Huh, Seok-Hwan (ACI division, Samsung Electro-Mechanics)
Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.1, 2015 , pp. 1-5 More about this Journal
Abstract
Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.
Keywords
Optical PCB; Imprint lithography; Optical layer; Optical interconnection;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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